JPH0246730A - Disperser for formation of coat film - Google Patents
Disperser for formation of coat filmInfo
- Publication number
- JPH0246730A JPH0246730A JP19832188A JP19832188A JPH0246730A JP H0246730 A JPH0246730 A JP H0246730A JP 19832188 A JP19832188 A JP 19832188A JP 19832188 A JP19832188 A JP 19832188A JP H0246730 A JPH0246730 A JP H0246730A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- nozzle
- liquid
- dispenser
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000002904 solvent Substances 0.000 claims abstract description 54
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims description 37
- 238000000576 coating method Methods 0.000 claims description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 63
- 239000000377 silicon dioxide Substances 0.000 abstract description 31
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 abstract 3
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000000428 dust Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体基板に絶縁膜等を形成するための塗布膜
形成用ディスペンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a dispenser for forming a coating film for forming an insulating film or the like on a semiconductor substrate.
従来、この種のディスペンサは、高速回転させられた半
導体基板にこのディスペンサにより塗布液を滴下して、
塗布液の−様な膜を形成し、この塗布膜を焼成して半導
体基板上に絶縁膜を形成したり、あるいは半導体基板に
不純物を拡散するためのドーパント膜を形成したりする
ときに用いられている。Conventionally, this type of dispenser drips a coating liquid onto a semiconductor substrate that is rotated at high speed.
It is used to form a coating liquid-like film and then bake this coating film to form an insulating film on a semiconductor substrate, or to form a dopant film for diffusing impurities into a semiconductor substrate. ing.
第８図は従来のディスペンサの構造の一例を示ステイス
ベンサの断面図である。このディスペンサは、同図に示
すように、半導体基板に塗布液を滴下するためのノズル
３と、ノズル３を使用しないときに、ノズル３の吐出口
１が塗布液の固形化により塞がらないように、テーパ穴
８Ｇ４−ノズル３の先端部２を差し込んで密閉するポッ
ト１３とから構成されている。ノズル３の中心には、塗
布液、例えば、シリカ液を供給するチューブ４が挿入さ
れており、チューブ４の周囲に所定の隙間をもたせてチ
ューブ４の外径と同心円の穴である溶剤吐出口６が開け
られている。この溶剤吐出口６の後端はノズル３の側面
に明けられた細穴と通じている。また、ノズル３の側面
の前記細穴には継手７ａを介して溶剤、例えば、エタノ
ールを供給するチューブ５が接続されている。ポット１
３の内部には、ノズル３の先端部２がテーバ穴８に差し
込まれて保管されている間に、ノズル３より滴下するシ
リカ液とメタノールを溜める槽１５が形成され、更に、
オーバフローしたシリカ液とメタノールを排出するドレ
ーン口１０が設けられている。FIG. 8 is a sectional view of a stay dispenser showing an example of the structure of a conventional dispenser. As shown in the figure, this dispenser has a nozzle 3 for dropping the coating liquid onto the semiconductor substrate, and a discharge port 1 of the nozzle 3 to prevent it from being blocked by solidification of the coating liquid when the nozzle 3 is not in use. , a tapered hole 8G4, and a pot 13 into which the tip 2 of the nozzle 3 is inserted and sealed. A tube 4 for supplying a coating liquid, such as a silica liquid, is inserted into the center of the nozzle 3, and a solvent discharge port, which is a hole concentric with the outer diameter of the tube 4, is inserted around the tube 4 with a predetermined gap. 6 is open. The rear end of the solvent discharge port 6 communicates with a small hole formed in the side surface of the nozzle 3. Further, a tube 5 for supplying a solvent, for example, ethanol, is connected to the narrow hole in the side surface of the nozzle 3 via a joint 7a. pot 1
A tank 15 is formed inside the nozzle 3 to store the silica liquid and methanol dripping from the nozzle 3 while the tip 2 of the nozzle 3 is inserted into the tapered hole 8 and stored.
A drain port 10 is provided to drain overflowing silica liquid and methanol.
このドレーン口１０は継手７ｂを介してチューブ１４に
接続されている。This drain port 10 is connected to a tube 14 via a joint 7b.
第９図は塗布動作を説明するための半導体基板とディス
ペンサの相対位置を示すディスペンサの斜視図である。FIG. 9 is a perspective view of the dispenser showing the relative positions of the semiconductor substrate and the dispenser for explaining the coating operation.
次に、半導体基板に塗布液を塗布する動作を説明すると
、同図に示すように、まず、半導体基板１１をスピンコ
ータの回転テーブル（図示せず）に載置する。次に、半
導体基板１１を矢印１７の方向に高速回転する。次に、
支持棒１２に取り付けられたアーム１６を上昇させ、ポ
ット１３よりノズル３を抜き、アーム１６を回転し、ノ
ズル３を半導体基板１１の中心上の位置に位置決めする
。次に、ノズル３より適量のシリカ液を滴下する。滴下
されたシリカ液は遠心力により半導体基板１１と同心の
円形状の塗布膜１８に形成される。この形成された塗布
膜１８が半導体基板１１の外周まで拡がり一様な膜厚に
形成される。Next, the operation of applying a coating liquid to a semiconductor substrate will be described. As shown in the figure, first, the semiconductor substrate 11 is placed on a rotary table (not shown) of a spin coater. Next, the semiconductor substrate 11 is rotated at high speed in the direction of the arrow 17. next,
The arm 16 attached to the support rod 12 is raised, the nozzle 3 is removed from the pot 13, the arm 16 is rotated, and the nozzle 3 is positioned above the center of the semiconductor substrate 11. Next, an appropriate amount of silica liquid is dropped from the nozzle 3. The dropped silica liquid is formed into a circular coating film 18 concentric with the semiconductor substrate 11 by centrifugal force. The formed coating film 18 spreads to the outer periphery of the semiconductor substrate 11 and is formed to have a uniform thickness.
上述した従来のディスペンサでは、以下に示す３つの問
題点がある。The conventional dispenser described above has the following three problems.
１、ノズルの吐出口にシリカ液が結晶化して固まり、充
分な溶剤の回り込みがなく結晶化が進み吐出口を塞ぎ正
常な滴下が出来ないことがある。1. The silica liquid crystallizes and hardens at the nozzle discharge port, and the solvent may not circulate sufficiently and the crystallization progresses, blocking the discharge port and preventing normal dripping.
２、ノズルのポットへの差し込みが頻繁なため、ノズル
の先端にごみが付着し、シリカ液を滴下するとき、ごみ
が混入し半導体基板の汚染を招くことになる。2. Because the nozzle is inserted into the pot frequently, dust adheres to the tip of the nozzle, and when the silica liquid is dropped, the dust gets mixed in and causes contamination of the semiconductor substrate.
３、ノズルの吐出口に溜った溶剤が半導体基板に落ちて
塗布膜の厚さむらを起す。3. Solvent accumulated at the nozzle discharge port falls onto the semiconductor substrate, causing uneven thickness of the coating film.
本発明の目的は、半導体基板を汚染しない、塗布膜の厚
みむらを起すことなく安定して塗布出来る塗布膜形成用
ディスペンサを提供することである。An object of the present invention is to provide a dispenser for forming a coating film that does not contaminate a semiconductor substrate and can stably apply coating without causing uneven thickness of the coating film.
本発明の塗布膜形成用のディスペンサは、半導体基板上
に塗布膜を形成する塗布膜形成用ディスペンサにおいて
、一面に塗布液滴下用ノズルの第１の吐出口と他面に少
なくとも一個以上の前記塗布液の溶剤及び圧縮空気の供
給口が形成されたブロック体と、前記第１の吐出口の周
囲を囲む同心円形状の開口をもつとともに前記第１のノ
ズルの吐出口の端面より外方に突出する前記溶剤及び圧
縮空気の第２の吐出口と、前記ブロック体内にあって前
記塗布液の供給口に通する細大と前記溶剤及び圧縮空気
の供給口に通する細穴とが合流するとともに前記第２の
吐出口に連なる溶剤溜り部とを備え構成される。The dispenser for forming a coating film of the present invention is a dispenser for forming a coating film on a semiconductor substrate, in which a first discharge port of a nozzle for dispensing a coating liquid is formed on one surface, and at least one of the above-mentioned coating liquids is disposed on the other surface. A block body in which supply ports for liquid solvent and compressed air are formed, and a concentric opening surrounding the first discharge port and protruding outward from the end surface of the discharge port of the first nozzle. The second discharge port for the solvent and compressed air, a narrow hole in the block body that passes through the supply port for the coating liquid, and a narrow hole that passes through the supply port for the solvent and compressed air merge, and the and a solvent reservoir connected to the second discharge port.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図及び第２図は本発明による第１の実施例を示すデ
ィスペンサの断面図及び下面図である。1 and 2 are a sectional view and a bottom view of a dispenser showing a first embodiment of the present invention.
このディスペンサの本体は、例えば、透明な樹脂で製作
され、ノズル３をもつブロック体９に形成されており、
このブロック体９の両側面に貫通する細穴２０が開けら
れ、その細大２０の両端には継手７ａ及び７Ｃを介して
溶剤液供給用チューブ５及び空気供給用チューブ１９が
取付けられている。また、この細穴２０に直交するよう
に前記両側面に直交するブロック体９の面に前記細大よ
り太い直径をもつ穴が開けられ、その穴の一端は溶剤吐
出口６を形成し、他端には継手７ｂを介してシリカ液供
給用チューブ４と接続されている。更に、溶剤吐出口６
の内部にシリカ液を滴下するための吐出管２１が差し込
まれ、吐出管２１の一端がシリカ液供給用チューブ４の
継手７ｂの穴に通じ、他端であるシリカ液を滴下する吐
出口１が溶剤吐出口１よりやや凹んだ位置に取り付けら
れている。ここで、この吐出管２１は、例えば、その内
径を２ｍｍ程度の直径をもつ石英管で製作される。The main body of this dispenser is made of, for example, transparent resin, and is formed into a block body 9 having a nozzle 3.
A narrow hole 20 is formed through both sides of the block body 9, and a solvent supply tube 5 and an air supply tube 19 are attached to both ends of the narrow hole 20 via joints 7a and 7C. Further, a hole having a diameter larger than the thin hole is formed in the surface of the block body 9 perpendicular to the both side surfaces so as to be perpendicular to the thin hole 20, and one end of the hole forms the solvent discharge port 6, and the other end of the hole has a diameter larger than the thin hole. The end thereof is connected to the silica liquid supply tube 4 via a joint 7b. Furthermore, the solvent discharge port 6
A discharge pipe 21 for dripping the silica liquid is inserted into the inside of the silica liquid, one end of the discharge pipe 21 communicates with the hole of the joint 7b of the silica liquid supply tube 4, and the other end, the discharge port 1 for dripping the silica liquid, It is attached at a position slightly recessed from the solvent discharge port 1. Here, the discharge tube 21 is made of, for example, a quartz tube having an inner diameter of about 2 mm.
第３図はディスペンサが半導体基板に塗布する前の準備
状態を示すノズルの断面図、第４図は塗布動作を説明す
るための半導体基板を含むディスペンサの斜視図である
。塗布作業を行う前には、ディスペンサのノズル３の清
掃を行なう必要がある。これには、まず、第４図に示す
ように、ディスペンサのブロック体９を保持しているア
ーム１６を回転してブロック体９をＡで示す位置に位置
決めする。次に、第３図に示すように、ノズル３の溶剤
吐出口６に通する溶剤供給用チューブ５より溶剤２３を
供給し、溶剤吐出口６の壁と吐出管２１との隙間でなる
空間を形成する溶剤溜り部に溶剤２３を満たす。この溶
剤は比較的に粘度が高いので溶剤２３が溶剤吐出口６よ
り滴下することはない。また、吐出管２１の内部は使用
前のシリカ液２２か残存し、特に、吐出口１付近のシリ
カ液２２が結晶化し、吐出口１を塞いでいる。この結晶
化したシリカ液２２を溶剤２３が溶解し、強制的に送ら
れた溶剤により、ブロック体９の下にあるドレーンポッ
ト２７に滴下される０次に、空気供給用チューブ１９か
ら清浄な圧縮空気を供給して溶剤吐出口６に通する溶剤
溜り部の溶剤２３を吹き飛ばす。次に、シリカ供給用チ
ューブからシリカ液を吐出管２１内に満たし、試験的に
シリカ液をドレーンボット２７に滴下する。次に、第４
図に示すように、あらかじめスピンコータの回転テーブ
ルの上に位置決めされた半導体基板１１を高速回転させ
、ディスペンサのブロック体９をアーム１６を回転させ
、Ｂに示す位置にブロック体９を位置決めする０次に、
ディスペンサのシリカ供給用チューブ４により所定の量
を強制的に供給し、半導体基板１１の上に所定の量のシ
リカ液を滴下する０滴下されたシリカ液は遠心力により
拡がり半導体基板１１上に膜厚が−様な塗布膜１８が形
成される。ここで、この塗布膜１８が形成される前に、
ブロック体９はアーム１６によりＡで示す位置に戻され
、再び、ノズルの清掃作業を開始する。このような一連
の作業を繰返して、半導体基板１１の上に順次塗布膜を
形成する。FIG. 3 is a cross-sectional view of the nozzle showing a preparation state before the dispenser coats the semiconductor substrate, and FIG. 4 is a perspective view of the dispenser including the semiconductor substrate to explain the coating operation. Before performing the coating work, it is necessary to clean the nozzle 3 of the dispenser. To do this, first, as shown in FIG. 4, the arm 16 holding the block body 9 of the dispenser is rotated to position the block body 9 at the position indicated by A. Next, as shown in FIG. 3, the solvent 23 is supplied from the solvent supply tube 5 passing through the solvent discharge port 6 of the nozzle 3, and the space formed by the gap between the wall of the solvent discharge port 6 and the discharge pipe 21 is filled. The solvent reservoir to be formed is filled with the solvent 23. Since this solvent has a relatively high viscosity, the solvent 23 will not drip from the solvent discharge port 6. Moreover, the silica liquid 22 before use remains inside the discharge pipe 21, and in particular, the silica liquid 22 near the discharge port 1 is crystallized and blocks the discharge port 1. This crystallized silica liquid 22 is dissolved by a solvent 23, and the forcibly fed solvent drips into the drain pot 27 under the block body 9. Next, a clean compressed air is discharged from the air supply tube 19. Air is supplied to blow off the solvent 23 in the solvent pool that passes through the solvent discharge port 6. Next, the discharge pipe 21 is filled with silica liquid from the silica supply tube, and the silica liquid is dripped into the drain bot 27 on a trial basis. Next, the fourth
As shown in the figure, the semiconductor substrate 11, which has been positioned in advance on the rotary table of the spin coater, is rotated at high speed, and the arm 16 of the block body 9 of the dispenser is rotated to position the block body 9 at the position shown in B. To,
A predetermined amount of silica liquid is forcibly supplied by the silica supply tube 4 of the dispenser, and the predetermined amount of silica liquid is dropped onto the semiconductor substrate 11.The dropped silica liquid spreads due to centrifugal force and forms a film on the semiconductor substrate 11. A coating film 18 having a -like thickness is formed. Here, before this coating film 18 is formed,
The block body 9 is returned to the position indicated by A by the arm 16, and the nozzle cleaning operation is started again. By repeating this series of operations, coating films are sequentially formed on the semiconductor substrate 11.
第５図及び第６図は本発明の第２の実施例を示すディス
ペンサの断面図及び下面図、第７図は第５図のＡＡ凹断
面示す断面図である。このディスペンサのブロック体９
は円筒状の樹脂材で製作されており、ノズル３はブロッ
ク体９と分離されて製作されている。また、このノズル
３はブロック体９に蓋をするように組立てられ、ブロッ
ク体９とノズル３との間に形成される空間である溶剤溜
り部２４が形成される。このブロック体９の中心には、
樹脂製のシリカ液供給用チューブ４がきつい状態のはめ
合いで挿入され、その先端はノズル３の溶剤吐出口６よ
り凹んだ位置に取り付けられている。また、シリカ液供
給チューブ４の周囲には、溶剤供給用チューブ５及び空
気供給用チューブ１９が各２本ずつ継手７ａ及び７ｂを
介して取り付けられ、この第５図では、継手７ａ凡び７
ｂに通する細穴２５ａ及び２６ａはブロック体９を貫通
し、溶剤溜り部２４に通じている。この溶剤及び空気を
供給する細穴は第５図では１個所ずつしか示されていな
いが、実際は、第７図に示すよに、溶剤供給口及び空気
供給に連らなる細穴２５ａ、２５ｂ、２６ａ及び２６ｂ
の各２個ずつ配置されている。5 and 6 are a cross-sectional view and a bottom view of a dispenser showing a second embodiment of the present invention, and FIG. 7 is a cross-sectional view showing a concave section AA in FIG. 5. Block body 9 of this dispenser
is manufactured from a cylindrical resin material, and the nozzle 3 is manufactured separately from the block body 9. Further, this nozzle 3 is assembled so as to cover the block body 9, and a solvent reservoir portion 24, which is a space formed between the block body 9 and the nozzle 3, is formed. At the center of this block body 9,
A resin-made silica liquid supply tube 4 is inserted with a tight fit, and its tip is attached at a position recessed from the solvent discharge port 6 of the nozzle 3. Furthermore, two solvent supply tubes 5 and two air supply tubes 19 are attached around the silica liquid supply tube 4 via joints 7a and 7b, and in FIG.
The small holes 25a and 26a passing through the block 9 pass through the block body 9 and communicate with the solvent reservoir 24. Although only one hole each for supplying the solvent and air is shown in FIG. 5, in reality, as shown in FIG. 26a and 26b
Two of each are arranged.
この実施例のディスペンサの動作は第１の実施例と同じ
である。また、この実施例と第１の実施例との異なる点
は、第１の実施例の吐出口を含めた吐出管と溶剤吐出口
の壁との間に出来る空間の溶剤溜り部に対して独立した
溶剤溜り部２４を設けたこと、溶剤供給用及び空気供給
用チューブを各２本ずつ設けたこと、及びシリカ液供給
用チューブの材質を変えて、更に、その長さを短くした
ことである。これらの変更により、第１の実施例と比べ
以下の点が有利である。The operation of the dispenser in this embodiment is the same as in the first embodiment. The difference between this embodiment and the first embodiment is that the solvent reservoir in the space formed between the discharge pipe including the discharge port and the wall of the solvent discharge port in the first embodiment is independent. In addition, two tubes each for solvent supply and air supply were provided, and the material of the silica liquid supply tube was changed to shorten its length. . These changes provide the following advantages over the first embodiment.
１、より広い溶剤溜り部を設けたことにより、結晶化さ
れたシリカの除去がより効果的に行えること。1. Crystallized silica can be removed more effectively by providing a wider solvent reservoir.
２、複数の溶剤供給チューブと空気供給チューブを設け
たのでディスペンサの清掃作業がより短時間で出来るこ
と。2. Since multiple solvent supply tubes and air supply tubes are provided, the cleaning work of the dispenser can be done in a shorter time.
３、溶剤供給用チューブを安価な材料で出来ること、メ
ンテナンスのときにチューブを清掃することなく、切断
して常に新しい先端部を使えば、よりメンテナンス工数
が節減出来ること。3. The solvent supply tube can be made of inexpensive materials, and the number of maintenance steps can be further reduced by cutting the tube and always using a new tip instead of cleaning it during maintenance.
の３点である。There are three points.
以上説明したように、本発明のディスペンサは一つのブ
ロック体に、塗布液滴下用ノズルとノズルを清掃する塗
布液溶剤用供給吐出口及び空気吹出し口とをブロック体
内の溶剤溜り部に通するように一体化して設けたことに
より、塗布液滴下用ノズルに塗布液が詰ることがなく、
ノズルにごみを付着することなく常にきれいに保つこと
が出来、更茫、゛溶剤を半導体基板上に滴下することが
ないの＋３半導体基板を汚染しない、塗布膜の厚みむら
歩１すことなく安定して塗布出来る塗布膜形成用ディス
ペンサが得られるという効果がある。As explained above, the dispenser of the present invention has a single block body in which a nozzle for dropping a coating liquid, a supply outlet for a coating liquid solvent for cleaning the nozzle, and an air outlet are passed through a solvent reservoir in the block body. Since it is integrated with the coating liquid, the coating liquid dripping nozzle will not be clogged with the coating liquid.
The nozzle can be kept clean at all times without any dust adhering to it, and the nozzle does not drip solvent onto the semiconductor substrate. This has the effect that a dispenser for forming a coating film can be obtained.
第１図及び第２図は本発明による第１の実施例を示すデ
ィスペンサの断面図及び下面図、第３図はディスペンサ
が半導体基板に塗布する前の準備状態を示すノズルの断
面図、第４図は塗布動作を説明するための半導体基板を
含むディスペンサの斜視図、第５図及び第６図は本発明
の第２の実施例を示すディスペンサの断面図及び下面図
、第７図は第５図のＡＡＩＩＲ面を示す断面図、第８図
は従来のディスペンサのの構造の一例を示すディスペン
サの断面図、第９図は塗布動作を説明するための半導体
基板とディスペンサの相対位置を示すディスペンサの斜
視図である。
１・・・吐出口、２・・・先端部、３・・・ノズル、４
．５．１４．１９・・・チューブ、６・・・溶剤吐出口
、７ａ、７ｂ、７ｃ・・・継手、８・・・テーパ穴、９
・・・ブロック体、１０・・・ドレーン口、１１・・・
半導体基板、１２・・・支持棒、１３・・・ポット、１
５・・・槽、１６・・・アーム、１７・・・矢印、１８
・・・塗布膜、２０．２５ａ、２５ｂ、２６ａ、２６ｂ
・・・細穴、２１ ・・・吐出管、２２・・・シリカ液
、２３・・・溶剤、２４・・・溶剤溜り部、２７・・・
ドレーンボット。1 and 2 are a cross-sectional view and a bottom view of a dispenser showing a first embodiment of the present invention, FIG. 3 is a cross-sectional view of a nozzle showing a preparation state before the dispenser coats a semiconductor substrate, and FIG. The figure is a perspective view of a dispenser including a semiconductor substrate for explaining the application operation, FIGS. 8 is a sectional view of a dispenser showing an example of the structure of a conventional dispenser, and FIG. 9 is a sectional view of the dispenser showing the relative position of the semiconductor substrate and the dispenser to explain the coating operation. FIG. 1... Discharge port, 2... Tip, 3... Nozzle, 4
．． 5.14.19...Tube, 6...Solvent discharge port, 7a, 7b, 7c...Joint, 8...Tapered hole, 9
...Block, 10...Drain port, 11...
Semiconductor substrate, 12... Support rod, 13... Pot, 1
5... Tank, 16... Arm, 17... Arrow, 18
...Coating film, 20.25a, 25b, 26a, 26b
...Small hole, 21...Discharge pipe, 22...Silica liquid, 23...Solvent, 24...Solvent reservoir, 27...
Drainbot.
Claims (1)
ンサにおいて、一面に塗布液滴下用ノズルの第１の吐出
口と他面に少なくとも一個以上の前記塗布液の溶剤及び
圧縮空気の供給口が形成されたブロック体と、前記第１
の吐出口の周囲を囲む同心円形状の開口をもつとともに
前記第１の吐出口の端面より外方に突出する前記溶剤及
び圧縮空気の第２の吐出口と、前記ブロック体内にあつ
て前記塗布液の供給口に通する細穴と前記溶剤及び圧縮
空気の供給口に通する細穴とが合流するとともに前記第
２の吐出口に連なる溶剤溜り部とを備えたことを特徴と
する塗布膜形成用ディスペンサ。In a coating film forming dispenser for forming a coating film on a semiconductor substrate, a first discharge port of a coating liquid dripping nozzle is formed on one side, and at least one supply port for a solvent for the coating liquid and compressed air is formed on the other side. the block body and the first
a second discharge port for the solvent and compressed air having a concentric opening surrounding the discharge port and protruding outward from the end face of the first discharge port; A thin hole passing through the supply port and a thin hole passing through the supply port for the solvent and compressed air merge, and a solvent reservoir portion is connected to the second discharge port. dispenser for.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198321A JPH0734427B2 (en) | 1988-08-08 | 1988-08-08 | Dispenser for forming coating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198321A JPH0734427B2 (en) | 1988-08-08 | 1988-08-08 | Dispenser for forming coating film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0246730A true JPH0246730A (en) | 1990-02-16 |
| JPH0734427B2 JPH0734427B2 (en) | 1995-04-12 |
Family
ID=16389172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63198321A Expired - Fee Related JPH0734427B2 (en) | 1988-08-08 | 1988-08-08 | Dispenser for forming coating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0734427B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637691U (en) * | 1992-10-21 | 1994-05-20 | 三井精機工業株式会社 | Pipe fitting |
| JPH0729789A (en) * | 1993-07-07 | 1995-01-31 | Nec Corp | Coating device |
| JP2007301444A (en) * | 2006-05-09 | 2007-11-22 | V Technology Co Ltd | Correcting material applying apparatus |
| JP2008093617A (en) * | 2006-10-16 | 2008-04-24 | Yazaki Corp | Coloring nozzle and coloring unit comprising the same |
| JP2017103368A (en) * | 2015-12-02 | 2017-06-08 | 東京エレクトロン株式会社 | Coating liquid supply device, coating method and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081067A (en) * | 1973-11-16 | 1975-07-01 | ||
| JPS56149444U (en) * | 1980-04-10 | 1981-11-10 | ||
| JPS5946164A (en) * | 1982-09-08 | 1984-03-15 | Oki Electric Ind Co Ltd | Apparatus for applying organic macromolecular solution |
| JPS61167646U (en) * | 1985-04-05 | 1986-10-17 |
-
1988
- 1988-08-08 JP JP63198321A patent/JPH0734427B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081067A (en) * | 1973-11-16 | 1975-07-01 | ||
| JPS56149444U (en) * | 1980-04-10 | 1981-11-10 | ||
| JPS5946164A (en) * | 1982-09-08 | 1984-03-15 | Oki Electric Ind Co Ltd | Apparatus for applying organic macromolecular solution |
| JPS61167646U (en) * | 1985-04-05 | 1986-10-17 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637691U (en) * | 1992-10-21 | 1994-05-20 | 三井精機工業株式会社 | Pipe fitting |
| JPH0729789A (en) * | 1993-07-07 | 1995-01-31 | Nec Corp | Coating device |
| JP2007301444A (en) * | 2006-05-09 | 2007-11-22 | V Technology Co Ltd | Correcting material applying apparatus |
| JP2008093617A (en) * | 2006-10-16 | 2008-04-24 | Yazaki Corp | Coloring nozzle and coloring unit comprising the same |
| JP2017103368A (en) * | 2015-12-02 | 2017-06-08 | 東京エレクトロン株式会社 | Coating liquid supply device, coating method and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0734427B2 (en) | 1995-04-12 |
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