JPH03212929A - Applying device of resist - Google Patents
Applying device of resistInfo
- Publication number
- JPH03212929A JPH03212929A JP937290A JP937290A JPH03212929A JP H03212929 A JPH03212929 A JP H03212929A JP 937290 A JP937290 A JP 937290A JP 937290 A JP937290 A JP 937290A JP H03212929 A JPH03212929 A JP H03212929A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- amount
- discharged
- state
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 abstract description 7
- 230000000007 visual effect Effects 0.000 abstract 1
- 241000257465 Echinoidea Species 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体製造装置の特にレジスト塗布装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor manufacturing equipment, particularly to resist coating equipment.
第3図は従来のレジスト(感光性樹脂)塗布装置の断面
図である。図において、(1)はレジスト供給容器、(
2)はポンプ、(8)はフィルタ、(4)はレジストノ
ズル、(6)は半導体ウェハ、(6)は気泡を含んだレ
ジストの排出管、(γ)はレジスト排液箱、(8)は排
出量m整用のニードルバルブ、(9)はカップ、叫は回
転用モータ、συはレジスト排液である。FIG. 3 is a sectional view of a conventional resist (photosensitive resin) coating device. In the figure, (1) is a resist supply container, (
2) is a pump, (8) is a filter, (4) is a resist nozzle, (6) is a semiconductor wafer, (6) is a resist discharge pipe containing air bubbles, (γ) is a resist drain box, (8) (9) is a cup, (9) is a rotation motor, and συ is a resist drain liquid.
次に動作について説明する。ポンプ(2)によって吸い
出されたレジストはフィルタ(8)によって濾過てれて
、レジストノズル(4)より半導体ウェハ(6)に滴下
でれる。半導体ウェハ(6)は回転用モータ(llle
Kより回転され、半導体ウェハ(6)表面に均一にレジ
ストが塗布される。レジスト中に発生した気泡はフィル
タ(8)上部に溜シ、レジストと共に排出管(6)を辿
りレジスト排液箱(7)に排出される。排出するレジス
ト排液aυの量はニードルバルブ(8)によって調整さ
れる。Next, the operation will be explained. The resist sucked out by the pump (2) is filtered by a filter (8) and dripped onto the semiconductor wafer (6) from the resist nozzle (4). The semiconductor wafer (6) is rotated by a rotating motor (lle
The semiconductor wafer (6) is rotated by a rotational speed K, and a resist is uniformly applied to the surface of the semiconductor wafer (6). Air bubbles generated in the resist are collected in the upper part of the filter (8) and are discharged together with the resist through the discharge pipe (6) to the resist drainage box (7). The amount of resist drain liquid aυ to be discharged is adjusted by a needle valve (8).
従来のレジスト装置は以上のように構成されていたので
排出管の先端がレジスト排液箱内にあるため、レジスト
の排出量及び状態を定期的に確認することが困難であり
、必要以上の量を排出してレジストを無駄に消費したり
、逆に排出されずに、気泡が溜まり、レジスト内に異物
が発生し塗布膜厚が均一にならないという問題点があっ
た。Conventional resist devices were configured as described above, and because the tip of the discharge pipe was located inside the resist drain box, it was difficult to regularly check the discharge amount and condition of resist, and it was difficult to check the discharge amount and condition of the resist on a regular basis. There are problems in that the resist is wasted by discharging the resist, or conversely, the resist is not discharged, causing air bubbles to accumulate and foreign matter to occur in the resist, resulting in an uneven coating film thickness.
この発明は上記のような問題点を解消する丸めになされ
たもので、排出されるレジストの量及び状態を定期的に
確認することを容易にすることができるレジスト塗布装
置を得ることを目的とする。This invention has been developed to solve the above-mentioned problems, and its purpose is to provide a resist coating device that can easily check the amount and condition of discharged resist on a regular basis. do.
この発明に係るレジスト塗布装置は、ニードルバルブと
レジスト排液箱の間の排出管の途中に、排出管より直径
が大きく、排出管との接続部から5m程度の長さの内管
を有し透明な外管を持つ透明管を備えたものである。The resist coating device according to the present invention has an inner pipe in the middle of the discharge pipe between the needle valve and the resist drain box, which has a larger diameter than the discharge pipe and has a length of about 5 m from the connection part with the discharge pipe. It has a transparent tube with a transparent outer tube.
この発明における透明管は、レジスト内管より涙滴状に
滴下し、外管が透明であるために排出されるレジストの
量及び状態を容易に確実に確認することを可能とする。The transparent tube in the present invention allows the resist to drip from the inner tube in the form of a teardrop, and since the outer tube is transparent, it is possible to easily and reliably confirm the amount and condition of the discharged resist.
以下、この発明の一実施例を図について説明する。第1
図はレジスト塗布装置の断面図である。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of the resist coating device.
固接おいて、(1)〜συは第2図の従来例に示したも
のと同等であるので説明を省略する。(I2はニードル
バルブ(8)とレジスト排液箱(γ)との間に取りつけ
られた透明管である。As a matter of fact, (1) to συ are equivalent to those shown in the conventional example of FIG. 2, so their explanation will be omitted. (I2 is a transparent tube installed between the needle valve (8) and the resist drain box (γ).
第2図は第1図に示す透明管(lzの断面図でα3は透
明な外管、(14は内管で、排出管(6)に接続されて
いる。σ9は涙滴状に滴下するレジスト滴である。Figure 2 is a cross-sectional view of the transparent tube (lz) shown in Figure 1, where α3 is a transparent outer tube, (14 is an inner tube, which is connected to the discharge tube (6), and σ9 is a teardrop-shaped droplet. It is a resist drop.
次に動作について説明する。半導体ウェハ(5)にレジ
ストを滴下するためにポンプ(2)t−動作きせるとレ
ジストノズル(4)からレジストを吐出する毎にフィル
タ(8)に溜った気泡と共にレジストがニードルバルブ
(8)を通過して内管■の先端よりレジスト滴(19と
して滴下する。この量及び滴下状態は外管(131を通
して容易に目視で確認することが出来る。Next, the operation will be explained. When the pump (2) is activated to drop the resist onto the semiconductor wafer (5), each time the resist is discharged from the resist nozzle (4), the resist along with the air bubbles accumulated in the filter (8) closes the needle valve (8). After passing through, the resist droplet (19) is dropped from the tip of the inner tube (2).The amount and state of the drop can be easily confirmed visually through the outer tube (131).
レジスト滴(151の量は目視で確認しながらニードル
バルブ(8)を開閉することで調整を行ない、最適な量
、状態を維持することが可能となる。The amount of the resist droplets (151) can be adjusted by opening and closing the needle valve (8) while visually checking the amount, thereby making it possible to maintain the optimum amount and condition.
なお、上記実施例では透明管α2をレジスト排液箱(γ
)のすぐ上に取りつけた例を示したが、ニードルバルブ
(8)とレジスト排液箱(γ)の間で、かつレジスト排
液箱(γ)よシ高い位置であれば、どの場所でも良く、
装置の前面部等の常時確認が容易な場所に設置しても良
い。In the above embodiment, the transparent tube α2 is connected to the resist drain box (γ
), but it can be installed anywhere between the needle valve (8) and the resist drain box (γ) and higher than the resist drain box (γ). ,
It may be installed in a location where it can be easily checked at all times, such as on the front of the device.
またレジスト排液αυをレジスト排液箱(γ)に捨てて
しまう例を示したが、レジスト供給容器(1)に戻す場
合でも上記実施例と同様の効果を奏する。Although an example has been shown in which the resist drain liquid αυ is discarded into the resist drain box (γ), the same effect as in the above embodiment can be obtained even when the resist drain liquid αυ is returned to the resist supply container (1).
以上のようにこの発明によれば、気泡を含んだレジスト
を排出する途中に涙滴状に滴下する構造にした透明管を
備えたので、レジスト排液の量を正確に確認、調整する
ことが可能となり、レジストの節減及び塗布膜厚の不均
一性の防止が得られる効果がある。As described above, according to the present invention, since the transparent tube is provided with a structure in which resist containing bubbles is dripped in a teardrop shape while being discharged, it is possible to accurately check and adjust the amount of resist drained. This has the effect of saving resist and preventing non-uniformity in coating film thickness.
第1図はこの発明の一実施例によるレジスト塗布装置を
示す断面図、第2図は第1図に示す透明管の断面図、第
3図は従来のレジスト塗布装置を示す断面図である。
図ににおいて、(1)はレジスト供給容器、(2)はポ
ンプ、(8)はフィルタ、(4)はレジストノズル、(
5)は半導体ウニへ、(6)は排出管、(7)はレジス
ト排液管、(8)はニードルバルブ、(9)はカップ、
αQは回転用モータ、συはレジスト排液、任zは透明
管、αJは外管、口4は内管、 (151はレジスト滴
である。
なお、図中、同一符号は同一 又は相当部分を示す。
代
第2図FIG. 1 is a cross-sectional view of a resist coating apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the transparent tube shown in FIG. 1, and FIG. 3 is a cross-sectional view of a conventional resist coating apparatus. In the figure, (1) is a resist supply container, (2) is a pump, (8) is a filter, (4) is a resist nozzle, (
5) is to the semiconductor sea urchin, (6) is the discharge pipe, (7) is the resist drain pipe, (8) is the needle valve, (9) is the cup,
αQ is the rotation motor, συ is the resist liquid drain, z is the transparent tube, αJ is the outer tube, mouth 4 is the inner tube, (151 is the resist droplet. In addition, in the figure, the same reference numerals refer to the same or equivalent parts. Figure 2
Claims (1)
を排出する機構を有するレジスト塗布装置において、排
出したレジストの量及び排出状態を目視可能とする治具
を備えたことを特徴とするレジスト塗布装置。A resist coating device having a mechanism for discharging a part of the resist in order to remove air bubbles generated in the resist, characterized in that the resist coating device is equipped with a jig that makes it possible to visually check the amount of resist discharged and the discharge state. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP937290A JPH03212929A (en) | 1990-01-17 | 1990-01-17 | Applying device of resist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP937290A JPH03212929A (en) | 1990-01-17 | 1990-01-17 | Applying device of resist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03212929A true JPH03212929A (en) | 1991-09-18 |
Family
ID=11718639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP937290A Pending JPH03212929A (en) | 1990-01-17 | 1990-01-17 | Applying device of resist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03212929A (en) |
-
1990
- 1990-01-17 JP JP937290A patent/JPH03212929A/en active Pending
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