JPH03212929A - Applying device of resist - Google Patents

Applying device of resist

Info

Publication number
JPH03212929A
JPH03212929A JP937290A JP937290A JPH03212929A JP H03212929 A JPH03212929 A JP H03212929A JP 937290 A JP937290 A JP 937290A JP 937290 A JP937290 A JP 937290A JP H03212929 A JPH03212929 A JP H03212929A
Authority
JP
Japan
Prior art keywords
resist
amount
discharged
state
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP937290A
Other languages
Japanese (ja)
Inventor
Yosuke Matsue
松江 洋介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP937290A priority Critical patent/JPH03212929A/en
Publication of JPH03212929A publication Critical patent/JPH03212929A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To facilitate periodical check of the amount and the state of a resist to be discharged, by equipping a device with a jig which enables visual checkup of the amount of the discharged resist and the state of discharge thereof. CONSTITUTION:When a resist is dripped onto a semiconductor wafer 5 by operating a pump 2, the resist passes through a needle valve 8 together with a bubble collected in a filter 3, every time the resist is discharged from a resist nozzle 4, and it drips as a resist liquid 15 from the fore end of an inner tube 14. The amount of this liquid and the state of dripping thereof can be checked up visually with ease through a transparent outer tube 13. According to this constitution, the quantity of the resist drop 15 is adjusted by opening and closing the valve 8 while checking up the quantity visually, and thereby an optimum quantity and an optimum state can be maintained.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体製造装置の特にレジスト塗布装置に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor manufacturing equipment, particularly to resist coating equipment.

〔従来の技術〕[Conventional technology]

第3図は従来のレジスト(感光性樹脂)塗布装置の断面
図である。図において、(1)はレジスト供給容器、(
2)はポンプ、(8)はフィルタ、(4)はレジストノ
ズル、(6)は半導体ウェハ、(6)は気泡を含んだレ
ジストの排出管、(γ)はレジスト排液箱、(8)は排
出量m整用のニードルバルブ、(9)はカップ、叫は回
転用モータ、συはレジスト排液である。
FIG. 3 is a sectional view of a conventional resist (photosensitive resin) coating device. In the figure, (1) is a resist supply container, (
2) is a pump, (8) is a filter, (4) is a resist nozzle, (6) is a semiconductor wafer, (6) is a resist discharge pipe containing air bubbles, (γ) is a resist drain box, (8) (9) is a cup, (9) is a rotation motor, and συ is a resist drain liquid.

次に動作について説明する。ポンプ(2)によって吸い
出されたレジストはフィルタ(8)によって濾過てれて
、レジストノズル(4)より半導体ウェハ(6)に滴下
でれる。半導体ウェハ(6)は回転用モータ(llle
Kより回転され、半導体ウェハ(6)表面に均一にレジ
ストが塗布される。レジスト中に発生した気泡はフィル
タ(8)上部に溜シ、レジストと共に排出管(6)を辿
りレジスト排液箱(7)に排出される。排出するレジス
ト排液aυの量はニードルバルブ(8)によって調整さ
れる。
Next, the operation will be explained. The resist sucked out by the pump (2) is filtered by a filter (8) and dripped onto the semiconductor wafer (6) from the resist nozzle (4). The semiconductor wafer (6) is rotated by a rotating motor (lle
The semiconductor wafer (6) is rotated by a rotational speed K, and a resist is uniformly applied to the surface of the semiconductor wafer (6). Air bubbles generated in the resist are collected in the upper part of the filter (8) and are discharged together with the resist through the discharge pipe (6) to the resist drainage box (7). The amount of resist drain liquid aυ to be discharged is adjusted by a needle valve (8).

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のレジスト装置は以上のように構成されていたので
排出管の先端がレジスト排液箱内にあるため、レジスト
の排出量及び状態を定期的に確認することが困難であり
、必要以上の量を排出してレジストを無駄に消費したり
、逆に排出されずに、気泡が溜まり、レジスト内に異物
が発生し塗布膜厚が均一にならないという問題点があっ
た。
Conventional resist devices were configured as described above, and because the tip of the discharge pipe was located inside the resist drain box, it was difficult to regularly check the discharge amount and condition of resist, and it was difficult to check the discharge amount and condition of the resist on a regular basis. There are problems in that the resist is wasted by discharging the resist, or conversely, the resist is not discharged, causing air bubbles to accumulate and foreign matter to occur in the resist, resulting in an uneven coating film thickness.

この発明は上記のような問題点を解消する丸めになされ
たもので、排出されるレジストの量及び状態を定期的に
確認することを容易にすることができるレジスト塗布装
置を得ることを目的とする。
This invention has been developed to solve the above-mentioned problems, and its purpose is to provide a resist coating device that can easily check the amount and condition of discharged resist on a regular basis. do.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るレジスト塗布装置は、ニードルバルブと
レジスト排液箱の間の排出管の途中に、排出管より直径
が大きく、排出管との接続部から5m程度の長さの内管
を有し透明な外管を持つ透明管を備えたものである。
The resist coating device according to the present invention has an inner pipe in the middle of the discharge pipe between the needle valve and the resist drain box, which has a larger diameter than the discharge pipe and has a length of about 5 m from the connection part with the discharge pipe. It has a transparent tube with a transparent outer tube.

〔作用〕[Effect]

この発明における透明管は、レジスト内管より涙滴状に
滴下し、外管が透明であるために排出されるレジストの
量及び状態を容易に確実に確認することを可能とする。
The transparent tube in the present invention allows the resist to drip from the inner tube in the form of a teardrop, and since the outer tube is transparent, it is possible to easily and reliably confirm the amount and condition of the discharged resist.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第1
図はレジスト塗布装置の断面図である。
An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of the resist coating device.

固接おいて、(1)〜συは第2図の従来例に示したも
のと同等であるので説明を省略する。(I2はニードル
バルブ(8)とレジスト排液箱(γ)との間に取りつけ
られた透明管である。
As a matter of fact, (1) to συ are equivalent to those shown in the conventional example of FIG. 2, so their explanation will be omitted. (I2 is a transparent tube installed between the needle valve (8) and the resist drain box (γ).

第2図は第1図に示す透明管(lzの断面図でα3は透
明な外管、(14は内管で、排出管(6)に接続されて
いる。σ9は涙滴状に滴下するレジスト滴である。
Figure 2 is a cross-sectional view of the transparent tube (lz) shown in Figure 1, where α3 is a transparent outer tube, (14 is an inner tube, which is connected to the discharge tube (6), and σ9 is a teardrop-shaped droplet. It is a resist drop.

次に動作について説明する。半導体ウェハ(5)にレジ
ストを滴下するためにポンプ(2)t−動作きせるとレ
ジストノズル(4)からレジストを吐出する毎にフィル
タ(8)に溜った気泡と共にレジストがニードルバルブ
(8)を通過して内管■の先端よりレジスト滴(19と
して滴下する。この量及び滴下状態は外管(131を通
して容易に目視で確認することが出来る。
Next, the operation will be explained. When the pump (2) is activated to drop the resist onto the semiconductor wafer (5), each time the resist is discharged from the resist nozzle (4), the resist along with the air bubbles accumulated in the filter (8) closes the needle valve (8). After passing through, the resist droplet (19) is dropped from the tip of the inner tube (2).The amount and state of the drop can be easily confirmed visually through the outer tube (131).

レジスト滴(151の量は目視で確認しながらニードル
バルブ(8)を開閉することで調整を行ない、最適な量
、状態を維持することが可能となる。
The amount of the resist droplets (151) can be adjusted by opening and closing the needle valve (8) while visually checking the amount, thereby making it possible to maintain the optimum amount and condition.

なお、上記実施例では透明管α2をレジスト排液箱(γ
)のすぐ上に取りつけた例を示したが、ニードルバルブ
(8)とレジスト排液箱(γ)の間で、かつレジスト排
液箱(γ)よシ高い位置であれば、どの場所でも良く、
装置の前面部等の常時確認が容易な場所に設置しても良
い。
In the above embodiment, the transparent tube α2 is connected to the resist drain box (γ
), but it can be installed anywhere between the needle valve (8) and the resist drain box (γ) and higher than the resist drain box (γ). ,
It may be installed in a location where it can be easily checked at all times, such as on the front of the device.

またレジスト排液αυをレジスト排液箱(γ)に捨てて
しまう例を示したが、レジスト供給容器(1)に戻す場
合でも上記実施例と同様の効果を奏する。
Although an example has been shown in which the resist drain liquid αυ is discarded into the resist drain box (γ), the same effect as in the above embodiment can be obtained even when the resist drain liquid αυ is returned to the resist supply container (1).

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、気泡を含んだレジスト
を排出する途中に涙滴状に滴下する構造にした透明管を
備えたので、レジスト排液の量を正確に確認、調整する
ことが可能となり、レジストの節減及び塗布膜厚の不均
一性の防止が得られる効果がある。
As described above, according to the present invention, since the transparent tube is provided with a structure in which resist containing bubbles is dripped in a teardrop shape while being discharged, it is possible to accurately check and adjust the amount of resist drained. This has the effect of saving resist and preventing non-uniformity in coating film thickness.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例によるレジスト塗布装置を
示す断面図、第2図は第1図に示す透明管の断面図、第
3図は従来のレジスト塗布装置を示す断面図である。 図ににおいて、(1)はレジスト供給容器、(2)はポ
ンプ、(8)はフィルタ、(4)はレジストノズル、(
5)は半導体ウニへ、(6)は排出管、(7)はレジス
ト排液管、(8)はニードルバルブ、(9)はカップ、
αQは回転用モータ、συはレジスト排液、任zは透明
管、αJは外管、口4は内管、 (151はレジスト滴
である。 なお、図中、同一符号は同一 又は相当部分を示す。 代 第2図
FIG. 1 is a cross-sectional view of a resist coating apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the transparent tube shown in FIG. 1, and FIG. 3 is a cross-sectional view of a conventional resist coating apparatus. In the figure, (1) is a resist supply container, (2) is a pump, (8) is a filter, (4) is a resist nozzle, (
5) is to the semiconductor sea urchin, (6) is the discharge pipe, (7) is the resist drain pipe, (8) is the needle valve, (9) is the cup,
αQ is the rotation motor, συ is the resist liquid drain, z is the transparent tube, αJ is the outer tube, mouth 4 is the inner tube, (151 is the resist droplet. In addition, in the figure, the same reference numerals refer to the same or equivalent parts. Figure 2

Claims (1)

【特許請求の範囲】[Claims] レジスト内に発生する気泡を除くためにレジストの一部
を排出する機構を有するレジスト塗布装置において、排
出したレジストの量及び排出状態を目視可能とする治具
を備えたことを特徴とするレジスト塗布装置。
A resist coating device having a mechanism for discharging a part of the resist in order to remove air bubbles generated in the resist, characterized in that the resist coating device is equipped with a jig that makes it possible to visually check the amount of resist discharged and the discharge state. Device.
JP937290A 1990-01-17 1990-01-17 Applying device of resist Pending JPH03212929A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP937290A JPH03212929A (en) 1990-01-17 1990-01-17 Applying device of resist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP937290A JPH03212929A (en) 1990-01-17 1990-01-17 Applying device of resist

Publications (1)

Publication Number Publication Date
JPH03212929A true JPH03212929A (en) 1991-09-18

Family

ID=11718639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP937290A Pending JPH03212929A (en) 1990-01-17 1990-01-17 Applying device of resist

Country Status (1)

Country Link
JP (1) JPH03212929A (en)

Similar Documents

Publication Publication Date Title
FI110581B (en) Method and apparatus for painting or coating a base layer
JPS61104623A (en) Rotary coater
JP2007268521A (en) Pretreatment unit for coating film forming apparatus, pretreatment method for coating film forming apparatus, coating film forming apparatus and coating film forming method
JP3573504B2 (en) Method for manufacturing semiconductor device
JP4531998B2 (en) Waste liquid separation and recovery system and waste liquid separation and recovery method
KR100209117B1 (en) Process and device for lacquering or coating a substrate by a capillary slot
JPH03212929A (en) Applying device of resist
JP4033600B2 (en) Resist coating device
JPS62211920A (en) Apparatus for supplying resist liquid
JP3597612B2 (en) Applicator for coating liquid on substrate
KR0121510Y1 (en) Coating soluting removing device with a blubble-remover
TWI822988B (en) Liquid processing device and liquid processing method
JPH09290199A (en) Cup cleaning device and rotating type substrate processing device
JP4141805B2 (en) Single wafer coating method
JPH02198131A (en) Removal of unnecessary resist adhering to substrate and spin-coat apparatus
JPH11239755A (en) Method and device for coating liquid
JPH0628224Y2 (en) Substrate rotation processing device
JPH0729789A (en) Coating device
JPS5910364A (en) Rotary coating device
JPS5864027A (en) Semiconductor manufacturing device
JP3832537B2 (en) Treatment liquid supply device
JPH11290792A (en) Treating liquid feeder
JP2001179157A (en) Coating nozzle for liquid and coating device and coating method
JPH04123529U (en) Rotary coating device
JPS61206221A (en) Spin coating device