JPH0244339U - - Google Patents

Info

Publication number
JPH0244339U
JPH0244339U JP12291388U JP12291388U JPH0244339U JP H0244339 U JPH0244339 U JP H0244339U JP 12291388 U JP12291388 U JP 12291388U JP 12291388 U JP12291388 U JP 12291388U JP H0244339 U JPH0244339 U JP H0244339U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
semiconductor element
sealing structure
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12291388U
Other languages
English (en)
Japanese (ja)
Other versions
JP2526469Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12291388U priority Critical patent/JP2526469Y2/ja
Publication of JPH0244339U publication Critical patent/JPH0244339U/ja
Application granted granted Critical
Publication of JP2526469Y2 publication Critical patent/JP2526469Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12291388U 1988-09-20 1988-09-20 混成集積回路の封止構造 Expired - Lifetime JP2526469Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12291388U JP2526469Y2 (ja) 1988-09-20 1988-09-20 混成集積回路の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12291388U JP2526469Y2 (ja) 1988-09-20 1988-09-20 混成集積回路の封止構造

Publications (2)

Publication Number Publication Date
JPH0244339U true JPH0244339U (enrdf_load_stackoverflow) 1990-03-27
JP2526469Y2 JP2526469Y2 (ja) 1997-02-19

Family

ID=31371291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12291388U Expired - Lifetime JP2526469Y2 (ja) 1988-09-20 1988-09-20 混成集積回路の封止構造

Country Status (1)

Country Link
JP (1) JP2526469Y2 (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109147U (enrdf_load_stackoverflow) * 1973-01-12 1974-09-18
JPS5821850A (ja) * 1981-08-03 1983-02-08 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPS622778U (enrdf_load_stackoverflow) * 1985-06-21 1987-01-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49109147U (enrdf_load_stackoverflow) * 1973-01-12 1974-09-18
JPS5821850A (ja) * 1981-08-03 1983-02-08 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPS622778U (enrdf_load_stackoverflow) * 1985-06-21 1987-01-09

Also Published As

Publication number Publication date
JP2526469Y2 (ja) 1997-02-19

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