JPH0244339U - - Google Patents
Info
- Publication number
- JPH0244339U JPH0244339U JP12291388U JP12291388U JPH0244339U JP H0244339 U JPH0244339 U JP H0244339U JP 12291388 U JP12291388 U JP 12291388U JP 12291388 U JP12291388 U JP 12291388U JP H0244339 U JPH0244339 U JP H0244339U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- semiconductor element
- sealing structure
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12291388U JP2526469Y2 (ja) | 1988-09-20 | 1988-09-20 | 混成集積回路の封止構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12291388U JP2526469Y2 (ja) | 1988-09-20 | 1988-09-20 | 混成集積回路の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244339U true JPH0244339U (OSRAM) | 1990-03-27 |
| JP2526469Y2 JP2526469Y2 (ja) | 1997-02-19 |
Family
ID=31371291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12291388U Expired - Lifetime JP2526469Y2 (ja) | 1988-09-20 | 1988-09-20 | 混成集積回路の封止構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2526469Y2 (OSRAM) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49109147U (OSRAM) * | 1973-01-12 | 1974-09-18 | ||
| JPS5821850A (ja) * | 1981-08-03 | 1983-02-08 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
| JPS622778U (OSRAM) * | 1985-06-21 | 1987-01-09 |
-
1988
- 1988-09-20 JP JP12291388U patent/JP2526469Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49109147U (OSRAM) * | 1973-01-12 | 1974-09-18 | ||
| JPS5821850A (ja) * | 1981-08-03 | 1983-02-08 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
| JPS622778U (OSRAM) * | 1985-06-21 | 1987-01-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2526469Y2 (ja) | 1997-02-19 |