JPH0244205A - Shape inspector for bonding wire - Google Patents
Shape inspector for bonding wireInfo
- Publication number
- JPH0244205A JPH0244205A JP63195108A JP19510888A JPH0244205A JP H0244205 A JPH0244205 A JP H0244205A JP 63195108 A JP63195108 A JP 63195108A JP 19510888 A JP19510888 A JP 19510888A JP H0244205 A JPH0244205 A JP H0244205A
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- image
- shadow
- sample
- judging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000005286 illumination Methods 0.000 claims description 11
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000003384 imaging method Methods 0.000 description 12
- 238000005259 measurement Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はボンディングワイヤの形状検査装置、特に、半
導体などのワイヤボンディング後のボンディングワイヤ
のループ形状の検査に適用しうるボンディングワイヤの
形状検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention is a bonding wire shape inspection device, particularly a bonding wire shape inspection device that can be applied to inspecting the loop shape of a bonding wire after wire bonding of semiconductors, etc. Regarding.
従来の技術としては、例えば、特公昭６１−２６０１０
５号公報に示されているようにボンディングワイヤの形
状検査装置がある。As a conventional technique, for example, Japanese Patent Publication No. 61-26010
As shown in Japanese Patent No. 5, there is a bonding wire shape inspection device.
従来のボンディングワイヤの形状検査装置は、少くとも
二つの撮像装置と、照明装置と、画像処理装置とを含ん
で構成される。A conventional bonding wire shape inspection device includes at least two imaging devices, an illumination device, and an image processing device.
次に従来のボンディングワイヤの形状検査装置について
図面を参照して詳細に説明する。Next, a conventional bonding wire shape inspection apparatus will be described in detail with reference to the drawings.
第４図は従来のボンディングワイヤの形状検査装置を示
す模式図である。FIG. 4 is a schematic diagram showing a conventional bonding wire shape inspection device.
第４図に示すボンディングワイヤの形状検査装置は、照
明装置５４と、撮像装置５５ａ、５５ｂ。The bonding wire shape inspection apparatus shown in FIG. 4 includes an illumination device 54 and imaging devices 55a and 55b.
５５ｃとハーフミラ−５６と画像処理装置５７とを含ん
でいる９
ここで撮像装置５５ａ、５５ｃは、その光軸５８ａ、５
８ｃが撮像装置５５ｂの光軸５８ｂと角度θをなすよう
に配設されている。照明装置５４から出力され、ハーフ
ミラ−５６を介してボンディングワイヤ５３に照射され
た光は、照明と同軸方向から撮像′Ａ置５５ｂと、照明
光軸５８ｂに対し角度±θの位置から撮像装置５５ａ、
５５ｃにより画像をとらえうことかできる。55c, a half mirror 56, and an image processing device 57. Here, the imaging devices 55a, 55c have their optical axes 58a, 5.
8c is arranged to form an angle θ with the optical axis 58b of the imaging device 55b. The light output from the illumination device 54 and irradiated onto the bonding wire 53 via the half mirror 56 is transmitted to an imaging device 55a from a position coaxial with the illumination and an imaging device 55a from a position at an angle ±θ with respect to the illumination optical axis 58b. ,
55c can capture images.
このようにしてえられた第５図（ａ）〜（ｃ）に対して
、画像処理装置５７により、第６図（ａ）〜（ｃ）に示
すようにそれぞれの画面で共通計測点Ｐ、〜Ｐ、、Ｐ、
’〜ｐｎ’、ｐ１″〜Ｐ、”を定め、それぞれの点の計
測座標から三次元座標Ｐ （Ｘ、Ｙ、Ｚ）を求め三次元
形状の検出を行う。5(a) to (c) obtained in this way, the image processing device 57 processes the common measurement points P, ~P,,P,
'~pn', p1''~P,'' are determined, and the three-dimensional coordinates P (X, Y, Z) are determined from the measurement coordinates of each point and the three-dimensional shape is detected.
上述した従来のボンディングワイヤの形状検査装置は、
少なくとも二つ以上の撮像装置により得られる光軸の異
なる画像から共通計測点を定め、それぞれの点から三次
元座標を求めるために２つ以上のＪｌｔみ収り光学系を
必要とするという欠点があった、
〔課題を解決するための手段〕
本発明のボンディングワイヤの形状検査装置は、試料を
位置決めするＸ−Ｙステージと、前記試料を斜方から照
明する照明装置と、前記試料の撮像装置と、該撮像装置
の合焦点機構と、前記撮像装置から得られる画像に対し
て、画像内の複数ケ所において像の有無を判定する画像
処理部とを含んで構成される。The conventional bonding wire shape inspection device described above is
The disadvantage is that two or more JLT focusing optical systems are required to determine a common measurement point from images with different optical axes obtained by at least two or more imaging devices and to obtain three-dimensional coordinates from each point. [Means for Solving the Problems] A bonding wire shape inspection apparatus of the present invention includes an X-Y stage for positioning a sample, an illumination device for obliquely illuminating the sample, and an imaging device for the sample. , a focusing mechanism of the imaging device, and an image processing unit that determines the presence or absence of images at a plurality of locations in the image obtained from the imaging device.
次に、本発明の実施例について、図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は１本発明の一実施例を示す構成図である。FIG. 1 is a block diagram showing an embodiment of the present invention.
第１図に示すボンディングワイヤの形状検査装置は、試
ｆｌｌと、試料１を位置決めするＸ−Ｙステージ２と、
ＴＶカメラ３と、試ｆ１１を斜めより照明する照明装置
４と、Ｔ、Ｖ カメラ３の焦点合せ用のＺステージ５
と、Ｔ、Ｖ、カメラ３の制御用Ｔ、Ｖ、カメラコン１−
ロール６と、Ｔ、Ｖ。The bonding wire shape inspection apparatus shown in FIG. 1 includes a sample full, an X-Y stage 2 for positioning a sample 1,
A TV camera 3, a lighting device 4 that illuminates the test f11 from an angle, and a Z stage 5 for focusing the T and V cameras 3.
and T, V, for controlling camera 3, T, V, camera controller 1-
Roll 6, T, V.
カメラ３の画像処理部７と、制御系８とを含んで構成さ
れる。It is configured to include an image processing section 7 of the camera 3 and a control system 8.
試料１のボンディングワイヤの形状を第２図（ａ）、（
ｂ）、（ｃ）に示す。第２図において、ボンディングワ
・イヤ１３は照明装置４”からの斜方照明によりボンデ
ィングワイヤの影１４を生じる。The shape of the bonding wire of sample 1 is shown in Figure 2 (a), (
Shown in b) and (c). In FIG. 2, the bonding wire 13 produces a bonding wire shadow 14 due to oblique illumination from the illumination device 4''.
第２図（ａ＞、（ｂ）、（ｃ）のボンディングワイヤの
Ｔ Ｖ、カメラ３による撮像の画像を第３図（ａ）、（
ｂ）、（ｃ）に示す。The images taken by the TV and camera 3 of the bonding wires in FIGS.
Shown in b) and (c).
第３図において、ボンディングワイヤ２３とボンディン
グワイヤの影２４の生じる位置に判断位置２１ａ〜２１
１”を画像処理装置７上で設定する。In FIG. 3, judgment positions 21a to 21 are located at positions where the bonding wire 23 and the shadow 24 of the bonding wire occur.
1” on the image processing device 7.
第２図（ｂ）に示すボンディングワイヤ１３′上に谷が
生じた場合、第３図（ｂ）の画像が撮像される。ボンデ
ィングワイヤ２３′は、正常な位置として判断位置２１
ｄ′、２１ｅ 、２１ｆ′を満えする。しかし、ボン
ディングワイヤの影２４′はボンディングワイヤ１３′
の谷が影１４′にうつし出され、判断位置２１ｂ′、２
１ｃ’からはずれ不良と判断比きる。When a valley occurs on the bonding wire 13' shown in FIG. 2(b), the image shown in FIG. 3(b) is captured. The bonding wire 23' is in the determined position 21 as a normal position.
d', 21e, and 21f' are satisfied. However, the shadow 24' of the bonding wire 13'
The valley of is exposed in the shadow 14', and the judgment position 21b', 2
If it deviates from 1c', it is determined to be defective.
第２図（ｃ）に示すボンディングワイヤ１３′がななめ
になっていた場合、第３図（ｃ）の画像が撮像される。When the bonding wire 13' shown in FIG. 2(c) is diagonal, the image shown in FIG. 3(c) is captured.
ボンディングワイヤの影２４″が判断位置２１ａ″、２
１ｂ″、２１ｃ″を満足する場合にも、判断位置２１ｄ
″ ２１ｅ ２１ｆ ″がはずれ不良と判断される
。The shadow 24'' of the bonding wire is the judgment position 21a'', 2
Even when satisfying 1b'' and 21c'', the judgment position 21d
``21e 21f'' is determined to be defective.
本発明のボンディングワイヤの形状検査装置は、２つ以
上の撮像装置を得られる２方向以上からの画（象より三
次元形状を検出する代りに、斜方照明により生ずるボン
ディングワイヤの影と、ボンディングワイヤ像を利用す
ることにより一方向がらの画像のみで検査できるという
効果がある。The bonding wire shape inspection device of the present invention detects images from two or more directions using two or more imaging devices (instead of detecting the three-dimensional shape from the The use of wire images has the advantage that inspection can be performed using only images from one direction.
第１図は本発明の一実施例を示す模式図、第２図＜ａ＞
、（ｂ）、（ｃ）は第１図のボンディングワイヤの形状
状態図、第３図（ａ）、（ｂ）（ｃ）は第２図（ａ＞、
（ｂ）、（ｃ）の入力画像、第４図は従来の一例を示す
模式図、第５図（ａ）、（ｂ）、（ｃ）は従来例の入力
画像、第６図（ａ）、（ｂ）、（ｃ）は第５図（ａ）（
Ｌ＋）、（ｃ）の処理図である。
１・・試料、２・・Ｘ−Ｙステージ、３・・・Ｔ、Ｖカ
メラ、４・・・照明装置、５・・・Ｚステージ、６・・
・ＴＶ、カメラコントローラ、７・・・画像処理部、８
・・・制御部、１３．１３’、１３″・・・ボンディン
グワイヤ、１４．１４’ 、１４”・・・ボンディング
ワイヤの影、２３．２３’ 、２Ｂ”・・・ボンディン
グワイヤ、２４．２４’ 、２４″・・・ボンディング
ワイヤの影、２１ａ、２１ｂ、２１ｃ、２１ｄ、２１ｅ
、２１ｆ−判断位置、２１ａ’ 、２１ｂ’ 、２１ｃ
′ ２１ｄ′、２１ｅ’、２１ｆ’−・・判断位置、２
１ａ″、２１ｂ”、２１ｃ 、２１ｄ″２１８″ ２
１ｆ” ・・判断位置、５３・・・ボンデイン７ワイヤ
、５４・・・照明装置、５５ａ、ｂ、ｃ・・・撮像装置
、５６・・・ハーフミラ−１５７・・・画像処理装置、
５８ａ、ｂ、ｃ・・光軸、
Ｐｌ〜Ｐｎ・・共通計測点、Ｐｌ′〜Ｐｎ′・・・共通
計測点、Ｐ１″〜Ｐ１″ ・・共通計測点、ｈ′ （Ｍ
）、ｈ″ （Ｍ＞・・ワイヤルーズの高さ。FIG. 1 is a schematic diagram showing an embodiment of the present invention, FIG. 2 <a>
, (b), (c) are shape state diagrams of the bonding wire in Fig. 1, and Fig. 3 (a), (b), and (c) are Fig. 2 (a>,
Input images of (b) and (c), FIG. 4 is a schematic diagram showing a conventional example, FIG. 5 (a), (b), and (c) are input images of the conventional example, and FIG. 6 (a) , (b), (c) are shown in Figure 5 (a) (
FIG. 1... Sample, 2... X-Y stage, 3... T, V camera, 4... Illumination device, 5... Z stage, 6...
・TV, camera controller, 7...image processing section, 8
...Control unit, 13.13', 13"...Bonding wire, 14.14', 14"...Shadow of bonding wire, 23.23', 2B"...Bonding wire, 24.24 ', 24''...Shadow of bonding wire, 21a, 21b, 21c, 21d, 21e
, 21f-judgment position, 21a', 21b', 21c
'21d', 21e', 21f'--judgment position, 2
1a″, 21b″, 21c, 21d″218″ 2
1f"... Judgment position, 53... Bonde 7 wire, 54... Illumination device, 55a, b, c... Imaging device, 56... Half mirror 157... Image processing device,
58a, b, c...Optical axis, Pl~Pn...Common measurement point, Pl'~Pn'...Common measurement point, P1''~P1''...Common measurement point, h' (M
), h''(M>...Wire loose height.
Claims (1)
から照明する照明装置と、前記試料の撮像装置と、該撮
像装置の合焦点機構と、前記撮像装置から得られる画像
に対して、画像内の複数ケ所において像の有無を判定す
る画像処理部とを含むことを特徴とするボンディングワ
イヤの形状検査装置。An X-Y stage for positioning a sample, an illumination device for obliquely illuminating the sample, an image pickup device for the sample, a focusing mechanism for the image pickup device, and an image acquisition device for the image obtained from the image pickup device. A bonding wire shape inspection device comprising: an image processing unit that determines the presence or absence of an image at a plurality of locations within the bonding wire shape inspection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63195108A JP2689505B2 (en) | 1988-08-03 | 1988-08-03 | Bonding wire shape inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63195108A JP2689505B2 (en) | 1988-08-03 | 1988-08-03 | Bonding wire shape inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244205A true JPH0244205A (en) | 1990-02-14 |
| JP2689505B2 JP2689505B2 (en) | 1997-12-10 |
Family
ID=16335641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63195108A Expired - Lifetime JP2689505B2 (en) | 1988-08-03 | 1988-08-03 | Bonding wire shape inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2689505B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10208978B4 (en) * | 2002-02-28 | 2005-06-23 | Robert Bosch Gmbh | Method and device for determining a height profile of a wire connection |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59150433A (en) * | 1983-02-05 | 1984-08-28 | Fujitsu Ltd | Wire inspection apparatus |
| JPS59171129A (en) * | 1983-03-17 | 1984-09-27 | Fujitsu Ltd | Automatic wiring inspection device |
| JPS63143828A (en) * | 1986-12-03 | 1988-06-16 | ビユ−・エンジニアリング・インコ−ポレ−テツド | Semiconductor device tester |
-
1988
- 1988-08-03 JP JP63195108A patent/JP2689505B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59150433A (en) * | 1983-02-05 | 1984-08-28 | Fujitsu Ltd | Wire inspection apparatus |
| JPS59171129A (en) * | 1983-03-17 | 1984-09-27 | Fujitsu Ltd | Automatic wiring inspection device |
| JPS63143828A (en) * | 1986-12-03 | 1988-06-16 | ビユ−・エンジニアリング・インコ−ポレ−テツド | Semiconductor device tester |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10208978B4 (en) * | 2002-02-28 | 2005-06-23 | Robert Bosch Gmbh | Method and device for determining a height profile of a wire connection |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2689505B2 (en) | 1997-12-10 |
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