JP2689505B2 - Bonding wire shape inspection device - Google Patents
Bonding wire shape inspection deviceInfo
- Publication number
- JP2689505B2 JP2689505B2 JP63195108A JP19510888A JP2689505B2 JP 2689505 B2 JP2689505 B2 JP 2689505B2 JP 63195108 A JP63195108 A JP 63195108A JP 19510888 A JP19510888 A JP 19510888A JP 2689505 B2 JP2689505 B2 JP 2689505B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- wire
- shape inspection
- image
- inspection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はボンディングワイヤの形状検査装置、特に、
半導体などのワイヤボンディング後のボンディングワイ
ヤのループ形状の検査に適用しうるボンディングワイヤ
の形状検査装置に関する。The present invention relates to a bonding wire shape inspection device, and more particularly,
The present invention relates to a bonding wire shape inspection device applicable to inspection of a bonding wire loop shape after wire bonding of a semiconductor or the like.
従来の技術としては、例えば、特公昭61−260105号公
報に示されているようにボンディングワイヤの形状検査
装置がある。As a conventional technique, for example, there is a bonding wire shape inspection device as disclosed in Japanese Patent Publication No. 61-260105.
従来のボンディングワイヤの形状検査装置は、少くと
も二つの撮像装置と、照明装置と、画像処理装置とを含
んで構成される。A conventional bonding wire shape inspection device is configured to include at least two imaging devices, an illumination device, and an image processing device.
次に従来のボンディングワイヤの形状検査装置につい
て図面を参照して詳細に説明する。Next, a conventional bonding wire shape inspection apparatus will be described in detail with reference to the drawings.
第４図は従来のボンディングワイヤの形状検査装置を
示す模式図である。FIG. 4 is a schematic view showing a conventional bonding wire shape inspection apparatus.
第４図に示すボンディングワイヤの形状検査装置は、
照明装置54と、撮像装置55a,55b,55cとハーフミラー56
と画像処理装置57とを含んでいる。The bonding wire shape inspection device shown in FIG.
Illumination device 54, imaging devices 55a, 55b, 55c and half mirror 56
And an image processing device 57.
ここで撮像装置55a,55cは、その光軸58a,58cが撮像装
置55bの光軸58bと角度θをなすように配設されている。
照明装置54から出力され、ハーフミラー56を介してボン
ディングワイヤ53に照射された光は、照明と同軸方向か
ら撮像装置55bと、照明光軸58bに対し角度±θの位置か
ら撮像装置55a,55cにより画像をとらえうことができ
る。Here, the image pickup devices 55a and 55c are arranged such that their optical axes 58a and 58c form an angle θ with the optical axis 58b of the image pickup device 55b.
The light output from the illuminating device 54 and applied to the bonding wire 53 via the half mirror 56 is image pickup device 55b from the direction coaxial with the illumination, and image pickup devices 55a and 55c from the position of an angle ± θ with respect to the illumination optical axis 58b. The image can be captured by.
このようにしてえられた第５図（ａ）〜（ｃ）に対し
て、画像処理装置57により、第６図（ａ）〜（ｃ）に示
すようにそれぞれの画面で共通計測点P1〜PnP1′〜
Pn′,P1″〜Pn″を定め、それぞれの点の計測座標から
三次元座標Ｐ（X,Y,Z）を求め三次元形状の検出を行
う。For the thus obtained FIGS. 5 (a) to 5 (c), the image processing device 57 causes the common measurement point P 1 on each screen as shown in FIGS. 6 (a) to 6 (c). ~ P n P 1 ′ ~
P n ′, P 1 ″ to P n ″ are set, three-dimensional coordinates P (X, Y, Z) are obtained from the measured coordinates of each point, and the three-dimensional shape is detected.
上述した従来のボンディングワイヤの形状検査装置
は、少なくとも二つ以上の撮像装置により得られる光軸
の異なる画像から共通計測点を定め、それぞれの点から
三次元座標を求めるために２つ以上の読み取り光学系を
必要とするという欠点があった。The above-mentioned conventional bonding wire shape inspection apparatus determines common measurement points from images having different optical axes obtained by at least two or more image pickup apparatuses, and two or more readings are performed to obtain three-dimensional coordinates from each point. There was a drawback that it required an optical system.
上記問題点を解決するために、本発明のボンディング
ワイヤの形状検査装置は、ステージ上に配置されたワイ
ヤを斜方から照明する照明手段と、前記ワイヤ及び該ワ
イヤの影を撮像する撮像手段と、前記撮像手段から得ら
れる画像上の予め設定された複数の判定点おいて、前記
ワイヤ及び該ワイヤの影の像が存在するか否かを判定す
る判定手段とを備えるものである。In order to solve the above-mentioned problems, a bonding wire shape inspection apparatus of the present invention includes an illumination unit that obliquely illuminates a wire arranged on a stage, and an imaging unit that images the wire and a shadow of the wire. And a determination means for determining whether or not the image of the wire and the shadow of the wire exists at a plurality of preset determination points on the image obtained from the imaging means.
次に、本発明の実施例について、図面を参照して詳細
に説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は、本発明の一実施例を示す構成図である。 FIG. 1 is a configuration diagram showing one embodiment of the present invention.
第１図に示すボンディングワイヤの形状検査装置は、
試料１と、試料１を位置決めするＸ・Ｙステージ２と、
TVカメラ３と、試料１を斜めより照明する照明装置４
と、T.V.カメラ３の焦点合せ用のＺステージ５と、T.V.
カメラ３の制御用T.V.カメラコントロール６と、T.V.カ
メラ３の画像処理部７と、制御系８とを含んで構成され
る。The bonding wire shape inspection device shown in FIG.
A sample 1 and an XY stage 2 for positioning the sample 1,
TV camera 3 and illumination device 4 for illuminating the sample 1 obliquely
And the Z stage 5 for focusing the TV camera 3 and the TV
A control TV camera control 6 of the camera 3, an image processing unit 7 of the TV camera 3, and a control system 8 are included.
試料１のボンディングワイヤの形状を第２図（ａ），
（ｂ），（ｃ）に示す。第２図において、ボンディング
ワイヤ13は照明装置４からの斜方照明によりボンディン
グワイヤの影14を生じる。The shape of the bonding wire of Sample 1 is shown in FIG.
(B) and (c) show. In FIG. 2, the bonding wire 13 produces a shadow 14 of the bonding wire due to oblique illumination from the lighting device 4.
第２図（ａ），（ｂ），（ｃ）のボンディングワイヤ
のT.V.カメラ３による撮像の画像を第３図（ａ），
（ｂ），（ｃ）に示す。The images taken by the TV camera 3 of the bonding wires of FIGS. 2 (a), (b) and (c) are shown in FIG. 3 (a),
(B) and (c) show.
第３図において、ボンディングワイヤ23とボンディン
グワイヤの影24を生じる位置に判断位置21a〜21fを画像
処理装置７上で設定する。In FIG. 3, determination positions 21a to 21f are set on the image processing apparatus 7 at positions where the bonding wire 23 and the shadow 24 of the bonding wire are generated.
第２図（ｂ）に示すボンディングワイヤ13′上に谷が
生じた場合、第３図（ｂ）の画像が撮像される。ボンデ
ィングワイヤ23′は、正常な位置として判断位置21d′,
21e′,21f′を満足する。しかし、ボンディングワイヤ
の影24′はボンディングワイヤ13′の谷が影14′にうつ
し出され、判断位置21b′,21c′からはずれ不良と判断
出きる。When a valley occurs on the bonding wire 13 'shown in FIG. 2 (b), the image of FIG. 3 (b) is taken. The bonding wire 23 'is judged to be the normal position 21d',
It satisfies 21e ′ and 21f ′. However, in the shadow 24 'of the bonding wire, the valley of the bonding wire 13' is projected to the shadow 14 ', and it can be determined that the shadow is defective from the determination positions 21b' and 21c '.
第２図（ｃ）に示すボンディングワイヤ13′がななめ
になっていた場合、第３図（ｃ）の画像が撮像される。
ボンディングワイヤの影24″が判断位置21a″,21b″,21
c″を満足する場合にも、判断位置21d″,21e″,21f″が
はずれ不良と判断される。When the bonding wire 13 'shown in FIG. 2 (c) is licked, the image of FIG. 3 (c) is taken.
The shadow 24 ″ of the bonding wire is the judgment position 21a ″, 21b ″, 21
Even when c ″ is satisfied, the judgment positions 21d ″, 21e ″, 21f ″ are judged to be defective.
本発明のボンディングワイヤの形状検査装置は、２つ
以上の撮像装置を得られる２方向以上からの画像より三
次元形状を検出する代りに、斜方照明により生ずるボン
ディングワイヤの影と、ボンディングワイヤ像を利用す
ることにより一方向からの画像のみで検査できるという
効果がある。The bonding wire shape inspection apparatus according to the present invention, instead of detecting a three-dimensional shape from images from two or more directions in which two or more image pickup devices can be obtained, a shadow of the bonding wire caused by oblique illumination and a bonding wire image. By using, there is an effect that inspection can be performed only from an image from one direction.
第１図は本発明の一実施例を示す模式図、第２図
（ａ），（ｂ），（ｃ）は第１図のボンディングワイヤ
の形状状態図、第３図（ａ），（ｂ），（ｃ）は第２図
（ａ），（ｂ），（ｃ）の入力画像、第４図は従来の一
例を示す模式図、第５図（ａ），（ｂ），（ｃ）は従来
例の入力画像、第６図（ａ），（ｂ），（ｃ）は第５図
（ａ），（ｂ），（ｃ）の処理図である。 １……試料、２……Ｘ−Ｙステージ、３……T.V.カメ
ラ、４……照明装置、５……Ｚステージ、６……T.V.カ
メラコントローラ、７……画像処理部、８……制御部、
13,13′,13″……ボンディングワイヤ、14,14′,14″…
…ボンディングワイヤの影、23,23′,23″……ボンディ
ングワイヤ、24,24′,24″……ボンディングワイヤの
影、21a,21b,21c,21d,21e,21f……判断位置、21a′,21
b′,21c′,21d′,21e′,21f′……判断位置、21a″,21
b″,21c″,21d″,21e″,21f″……判断位置、53……ボ
ンディングワイヤ、54……照明装置、55a,b,c……撮像
装置、56……ハーフミラー、57……画像処理装置、58a,
b,c……光軸、 P1〜Pn……共通計測点、P1′〜Pn′……共通計測点、
P1″〜Pn″……共通計測点、ｈ′（Ｍ）,h″（Ｍ）……
ワイヤループの高さ。FIG. 1 is a schematic view showing an embodiment of the present invention, FIGS. 2 (a), (b), and (c) are shape state diagrams of the bonding wire in FIG. 1, and FIGS. 3 (a) and 3 (b). ) And (c) are input images of FIGS. 2 (a), (b) and (c), FIG. 4 is a schematic view showing an example of the conventional art, and FIGS. 5 (a), (b) and (c). Is a conventional input image, and FIGS. 6 (a), (b), and (c) are processing diagrams of FIGS. 5 (a), (b), and (c). 1 ... Sample, 2 ... XY stage, 3 ... TV camera, 4 ... Illumination device, 5 ... Z stage, 6 ... TV camera controller, 7 ... Image processing unit, 8 ... Control unit ,
13,13 ′, 13 ″ …… Bonding wire, 14,14 ′, 14 ″…
… Shading of bonding wire, 23,23 ′, 23 ″ …… Shading of bonding wire, 24,24 ′, 24 ″ …… Shading of bonding wire, 21a, 21b, 21c, 21d, 21e, 21f …… Decision position, 21a ′ ,twenty one
b ', 21c', 21d ', 21e', 21f '... Judgment position, 21a ", 21
b ″, 21c ″, 21d ″, 21e ″, 21f ″ …… judgment position, 53 …… bonding wire, 54 …… illuminator, 55a, b, c …… imaging device, 56 …… half mirror, 57 …… Image processing device, 58a,
b, c …… optical axis, P 1 〜P n …… common measurement point, P 1 ′ ～ P n ′ …… common measurement point,
P 1 ″ -P n ″ …… Common measurement points, h ′ (M), h ″ (M)
The height of the wire loop.
Claims (1)
照明する照明手段と、 前記ワイヤ及び該ワイヤの影を撮像する撮像手段と、 前記撮像手段から得られる画像上の予め設定された複数
の判定点おいて、前記ワイヤ及び該ワイヤの影の像が存
在するか否かを判定する判定手段と を備えることを特徴とするボンディングワイヤの形状検
査装置。1. An illuminating means for illuminating a wire arranged on a stage from an oblique direction, an imaging means for imaging the wire and a shadow of the wire, and a plurality of preset images on an image obtained from the imaging means. And a determination means for determining whether or not the wire and an image of the shadow of the wire exist at the determination point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63195108A JP2689505B2 (en) | 1988-08-03 | 1988-08-03 | Bonding wire shape inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63195108A JP2689505B2 (en) | 1988-08-03 | 1988-08-03 | Bonding wire shape inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244205A JPH0244205A (en) | 1990-02-14 |
| JP2689505B2 true JP2689505B2 (en) | 1997-12-10 |
Family
ID=16335641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63195108A Expired - Lifetime JP2689505B2 (en) | 1988-08-03 | 1988-08-03 | Bonding wire shape inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2689505B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10208978B4 (en) * | 2002-02-28 | 2005-06-23 | Robert Bosch Gmbh | Method and device for determining a height profile of a wire connection |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59150433A (en) * | 1983-02-05 | 1984-08-28 | Fujitsu Ltd | Wire inspection apparatus |
| JPS59171129A (en) * | 1983-03-17 | 1984-09-27 | Fujitsu Ltd | Automatic wiring inspection device |
| JPS63143828A (en) * | 1986-12-03 | 1988-06-16 | ビユ−・エンジニアリング・インコ−ポレ−テツド | Semiconductor device tester |
-
1988
- 1988-08-03 JP JP63195108A patent/JP2689505B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244205A (en) | 1990-02-14 |
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