JPH0243811B2 - - Google Patents
Info
- Publication number
- JPH0243811B2 JPH0243811B2 JP60130242A JP13024285A JPH0243811B2 JP H0243811 B2 JPH0243811 B2 JP H0243811B2 JP 60130242 A JP60130242 A JP 60130242A JP 13024285 A JP13024285 A JP 13024285A JP H0243811 B2 JPH0243811 B2 JP H0243811B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- annealing
- rolled
- lead frame
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60130242A JPS61288036A (ja) | 1985-06-15 | 1985-06-15 | リードフレーム材用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60130242A JPS61288036A (ja) | 1985-06-15 | 1985-06-15 | リードフレーム材用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61288036A JPS61288036A (ja) | 1986-12-18 |
| JPH0243811B2 true JPH0243811B2 (cs) | 1990-10-01 |
Family
ID=15029528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60130242A Granted JPS61288036A (ja) | 1985-06-15 | 1985-06-15 | リードフレーム材用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61288036A (cs) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5252722B2 (ja) * | 2009-03-26 | 2013-07-31 | 福田金属箔粉工業株式会社 | 高強度・高導電性銅合金及びその製造方法 |
| JP6278812B2 (ja) * | 2014-04-21 | 2018-02-14 | 株式会社Shカッパープロダクツ | 銅合金材、電気自動車用の配電部材及びハイブリッド自動車用の配電部材 |
| KR20200129027A (ko) * | 2018-03-20 | 2020-11-17 | 후루카와 덴키 고교 가부시키가이샤 | 구리 합금 선재 및 구리 합금 선재의 제조 방법 |
| DE102018122574B4 (de) * | 2018-09-14 | 2020-11-26 | Kme Special Products Gmbh | Verwendung einer Kupferlegierung |
| US20240116110A1 (en) * | 2022-10-04 | 2024-04-11 | Iowa State University Research Foundation, Inc. | Oxidation resistant high conductivity copper alloys |
-
1985
- 1985-06-15 JP JP60130242A patent/JPS61288036A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61288036A (ja) | 1986-12-18 |
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