JPH0243594B2 - - Google Patents
Info
- Publication number
- JPH0243594B2 JPH0243594B2 JP59032475A JP3247584A JPH0243594B2 JP H0243594 B2 JPH0243594 B2 JP H0243594B2 JP 59032475 A JP59032475 A JP 59032475A JP 3247584 A JP3247584 A JP 3247584A JP H0243594 B2 JPH0243594 B2 JP H0243594B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- condensing
- mirror
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59032475A JPS60177986A (ja) | 1984-02-24 | 1984-02-24 | レ−ザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59032475A JPS60177986A (ja) | 1984-02-24 | 1984-02-24 | レ−ザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60177986A JPS60177986A (ja) | 1985-09-11 |
| JPH0243594B2 true JPH0243594B2 (en:Method) | 1990-09-28 |
Family
ID=12360000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59032475A Granted JPS60177986A (ja) | 1984-02-24 | 1984-02-24 | レ−ザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60177986A (en:Method) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2051829T3 (es) * | 1988-09-07 | 1994-07-01 | Leeuwarder Papier | Metodo de proporcionar lineas hendidas en materia de envasado. |
| ES2912564T3 (es) * | 2020-05-08 | 2022-05-26 | Jeanologia Sl | Dispositivo y procedimiento para el tratamiento de pantalones por láser que comprende dos pantaloneras |
| CN112620980A (zh) * | 2021-01-22 | 2021-04-09 | 何元健 | 一种亚克力板激光切割装置 |
| CN116079243B (zh) * | 2023-04-06 | 2023-08-25 | 科大乾延科技有限公司 | 一种基于激光雕刻的显示控制系统 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4830492U (en:Method) * | 1971-08-17 | 1973-04-13 | ||
| JPS51135492A (en) * | 1975-05-20 | 1976-11-24 | Mitsubishi Electric Corp | Laser material processing unit |
| JPS52127391U (en:Method) * | 1976-03-25 | 1977-09-28 | ||
| JPS52141695U (en:Method) * | 1976-04-22 | 1977-10-27 |
-
1984
- 1984-02-24 JP JP59032475A patent/JPS60177986A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60177986A (ja) | 1985-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |