JPH0242905B2 - - Google Patents
Info
- Publication number
- JPH0242905B2 JPH0242905B2 JP10351282A JP10351282A JPH0242905B2 JP H0242905 B2 JPH0242905 B2 JP H0242905B2 JP 10351282 A JP10351282 A JP 10351282A JP 10351282 A JP10351282 A JP 10351282A JP H0242905 B2 JPH0242905 B2 JP H0242905B2
- Authority
- JP
- Japan
- Prior art keywords
- shower
- etching
- liquid
- reciprocating drive
- shower unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 38
- 238000005530 etching Methods 0.000 claims description 25
- 238000012545 processing Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 6
- 238000012856 packing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10351282A JPS58221282A (ja) | 1982-06-15 | 1982-06-15 | エツチングマシンのシヤワ−装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10351282A JPS58221282A (ja) | 1982-06-15 | 1982-06-15 | エツチングマシンのシヤワ−装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13416782A Division JPS58221280A (ja) | 1982-07-31 | 1982-07-31 | エツチングマシンによるシヤワ−方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58221282A JPS58221282A (ja) | 1983-12-22 |
| JPH0242905B2 true JPH0242905B2 (enExample) | 1990-09-26 |
Family
ID=14356010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10351282A Granted JPS58221282A (ja) | 1982-06-15 | 1982-06-15 | エツチングマシンのシヤワ−装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58221282A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02153081A (ja) * | 1988-12-05 | 1990-06-12 | Fuji Plant Kogyo Kk | エッチング方法および装置 |
| KR101386677B1 (ko) * | 2012-10-30 | 2014-04-29 | 삼성전기주식회사 | 미세회로 제조방법 |
| JP6180232B2 (ja) * | 2013-08-22 | 2017-08-16 | 株式会社Ｊｃｕ | エッチング装置用スプレー配管ユニット |
-
1982
- 1982-06-15 JP JP10351282A patent/JPS58221282A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58221282A (ja) | 1983-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR950034537A (ko) | 레지스트 처리방법 및 레지스트 처리장치 | |
| KR100299333B1 (ko) | 기판세정장치 | |
| KR19990082694A (ko) | 액정표시패널의제조방법및이것에사용되는세정장치 | |
| KR19980019114A (ko) | 도포방법 및 도포장치(coating method and apparatus) | |
| US6421932B2 (en) | Method and apparatus for drying substrate plates | |
| CN100390931C (zh) | 基板处理装置、基板处理方法及图案形成方法 | |
| JPH0242905B2 (enExample) | ||
| CN103834948B (zh) | 一种双槽沟槽蚀刻机 | |
| JP2008049226A (ja) | 予備吐出装置 | |
| JP4776380B2 (ja) | 処理装置及び処理方法 | |
| JPS59193029A (ja) | 洗浄方法およびその装置 | |
| JP4122674B2 (ja) | 基板乾燥装置及び乾燥方法 | |
| KR20200099972A (ko) | 액처리 장치 및 액처리 방법 | |
| JP2001102289A (ja) | 基板処理装置および基板処理方法 | |
| JP4602567B2 (ja) | 基板の洗浄装置 | |
| JPH11307434A (ja) | 基板処理装置 | |
| TW200305357A (en) | Three-dimensional swinging spray device of acid cleaning machine in PCB process | |
| JP2001035778A (ja) | 基板処理装置 | |
| CN211606956U (zh) | 一种蚀刻装置 | |
| JP3394649B2 (ja) | 基板処理装置 | |
| JPS58221280A (ja) | エツチングマシンによるシヤワ−方法 | |
| JP2729723B2 (ja) | ラビング処理後の基板の洗浄方法並びに洗浄装置 | |
| JP2004360000A (ja) | 基板処理方法および基板処理装置 | |
| JPH058604Y2 (enExample) | ||
| JPH07204547A (ja) | 薄板部材の液処理装置 |