JPH0242430U - - Google Patents
Info
- Publication number
- JPH0242430U JPH0242430U JP1988121990U JP12199088U JPH0242430U JP H0242430 U JPH0242430 U JP H0242430U JP 1988121990 U JP1988121990 U JP 1988121990U JP 12199088 U JP12199088 U JP 12199088U JP H0242430 U JPH0242430 U JP H0242430U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- resin adhesive
- wire bonder
- lead frame
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0198—
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/07173—
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- H10W72/073—
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- H10W72/075—
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- H10W72/884—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121990U JPH0242430U (enExample) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121990U JPH0242430U (enExample) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242430U true JPH0242430U (enExample) | 1990-03-23 |
Family
ID=31369507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121990U Pending JPH0242430U (enExample) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242430U (enExample) |
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1988
- 1988-09-16 JP JP1988121990U patent/JPH0242430U/ja active Pending