JPH01116461U - - Google Patents
Info
- Publication number
- JPH01116461U JPH01116461U JP1988011433U JP1143388U JPH01116461U JP H01116461 U JPH01116461 U JP H01116461U JP 1988011433 U JP1988011433 U JP 1988011433U JP 1143388 U JP1143388 U JP 1143388U JP H01116461 U JPH01116461 U JP H01116461U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- resin
- semiconductor device
- protrusion
- coming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011433U JPH01116461U (enExample) | 1988-01-29 | 1988-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011433U JPH01116461U (enExample) | 1988-01-29 | 1988-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116461U true JPH01116461U (enExample) | 1989-08-07 |
Family
ID=31219982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011433U Pending JPH01116461U (enExample) | 1988-01-29 | 1988-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116461U (enExample) |
-
1988
- 1988-01-29 JP JP1988011433U patent/JPH01116461U/ja active Pending