JPH0242419Y2 - - Google Patents
Info
- Publication number
- JPH0242419Y2 JPH0242419Y2 JP1023085U JP1023085U JPH0242419Y2 JP H0242419 Y2 JPH0242419 Y2 JP H0242419Y2 JP 1023085 U JP1023085 U JP 1023085U JP 1023085 U JP1023085 U JP 1023085U JP H0242419 Y2 JPH0242419 Y2 JP H0242419Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- cooling
- thermal conductivity
- high thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1023085U JPH0242419Y2 (h) | 1985-01-28 | 1985-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1023085U JPH0242419Y2 (h) | 1985-01-28 | 1985-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61125412U JPS61125412U (h) | 1986-08-07 |
| JPH0242419Y2 true JPH0242419Y2 (h) | 1990-11-13 |
Family
ID=30491219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1023085U Expired JPH0242419Y2 (h) | 1985-01-28 | 1985-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242419Y2 (h) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7381599B2 (en) | 1993-09-20 | 2008-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
-
1985
- 1985-01-28 JP JP1023085U patent/JPH0242419Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7381599B2 (en) | 1993-09-20 | 2008-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US7525158B2 (en) | 1993-09-20 | 2009-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having pixel electrode and peripheral circuit |
| US7569856B2 (en) | 1993-09-20 | 2009-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61125412U (h) | 1986-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0242419Y2 (h) | ||
| JPH024771Y2 (h) | ||
| JPH0753393B2 (ja) | 円筒状又は円柱状成形品の射出成形用金型及び成形品 | |
| JPH0138590B2 (h) | ||
| JPH0242420Y2 (h) | ||
| JPH0561026B2 (h) | ||
| AU633154B2 (en) | Method of controlling the rate of heat extraction in mould casting | |
| JPH07155897A (ja) | 鋳型構造及び鋳造方法 | |
| JPH0425842B2 (h) | ||
| JPS6343045Y2 (h) | ||
| CN207154758U (zh) | 一种用于铸模内铁水的冷却装置 | |
| JPS61121916A (ja) | 成形用金型 | |
| JPS60261656A (ja) | ダイカスト用成形型 | |
| JPH0593644U (ja) | 連続鋳造用チューブラモールド | |
| JPH01146710A (ja) | ワックス模型製造用樹脂型 | |
| JP2000246419A (ja) | 成形金型及び成形方法 | |
| JPS6132735Y2 (h) | ||
| JPS62118943A (ja) | 鋳造金型 | |
| CN215144523U (zh) | 一种镁合金棒半连续铸造工艺中的结晶器 | |
| JPH0133274B2 (h) | ||
| Jie | Heat transfer characteristics of lost foam casting process of magnesium alloy | |
| JP2002210781A (ja) | 合成樹脂成形用金型 | |
| JPH0338022B2 (h) | ||
| JPS6359786B2 (h) | ||
| JPH03174965A (ja) | 射出成形方法および装置 |