JPH0242419Y2 - - Google Patents
Info
- Publication number
- JPH0242419Y2 JPH0242419Y2 JP1023085U JP1023085U JPH0242419Y2 JP H0242419 Y2 JPH0242419 Y2 JP H0242419Y2 JP 1023085 U JP1023085 U JP 1023085U JP 1023085 U JP1023085 U JP 1023085U JP H0242419 Y2 JPH0242419 Y2 JP H0242419Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- cooling
- thermal conductivity
- high thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は射出成形用筒易樹脂型に関するもので
あり、試作成形品または少量成形品製作用の射出
成形用筒易樹脂型として利用される。[Detailed description of the invention] (Industrial application field) The present invention relates to an easy-to-use resin mold for injection molding, and is used as an easy-to-use resin mold for injection molding for producing prototype molded products or small-volume molded products. .
（従来の技術）
従来の合成樹脂成形用型は第２図に示すよう
に、固定型１１および可動型１２の型枠１３，１
３内に金属粉入り樹脂、例えば鉄粉、銅粉、アル
ミ粉などを含有するエポキシ系樹脂から形成され
た注型樹脂層１４，１４およびキヤビテイ１５を
形成する表装樹脂層１６，１６が配設されている
（例えば、特公昭58−54971号公報）。(Prior Art) As shown in FIG. 2, a conventional synthetic resin molding mold has molds 13, 1 of a fixed mold 11 and a movable mold 12.
Casting resin layers 14, 14 made of epoxy resin containing metal powder, for example, iron powder, copper powder, aluminum powder, etc., and facing resin layers 16, 16 forming the cavity 15 are disposed within 3. (For example, Japanese Patent Publication No. 58-54971).
（考案が解決しようとする問題点）
型枠１３内に配設された樹脂層１４，１６は熱
伝導性が悪いため、樹脂型、すなわち固定型１１
および可動型１２の冷却能が小さく、射出成形中
の固定型１１および可動型１２の温度調節および
成形温度の安定維持ができず、溶融樹脂の固化速
度が遅く、成形品の品質を著しく低下させてい
た。(Problem to be solved by the invention) Since the resin layers 14 and 16 arranged in the formwork 13 have poor thermal conductivity, the resin mold, that is, the fixed mold 11
Also, the cooling capacity of the movable mold 12 is small, making it impossible to adjust the temperature of the fixed mold 11 and the movable mold 12 during injection molding and to maintain a stable molding temperature, resulting in a slow solidification rate of the molten resin, which significantly deteriorates the quality of the molded product. was.
本考案が解決しようとする問題点は、容易に樹
脂型の温度調節および成形温度の安定維持を行う
ことである。 The problem to be solved by the present invention is to easily adjust the temperature of a resin mold and maintain a stable molding temperature.
（問題点を解決するための手段）
上記問題点を解決するための手段は、金属粉入
り樹脂層中に冷却用管および熱伝導性の高い長尺
金属材を多数個埋設することである。(Means for Solving the Problems) A means for solving the above problems is to embed a large number of cooling tubes and long metal materials with high thermal conductivity in the metal powder-containing resin layer.
（作用） 上記手段は次のように作用する。(effect) The above means works as follows.
射出成形において、射出された溶融樹脂がキヤ
ビテイ内に充填される。このとき、冷却用管には
冷却水、油等の冷媒が通されており、樹脂型は冷
却用管および熱伝導性の高い長尺金属材を介して
強制的に冷却され、前記溶融樹脂は冷却用管を通
る冷媒によつて速やかに熱を奮われ固化する。 In injection molding, a cavity is filled with injected molten resin. At this time, a coolant such as cooling water or oil is passed through the cooling tube, and the resin mold is forcibly cooled through the cooling tube and a long metal material with high thermal conductivity, and the molten resin is cooled. It is quickly heated by the refrigerant passing through the cooling pipe and solidifies.
（実施例）
以下、上記手段の一具体例を示す実施例につい
て説明する。(Example) Hereinafter, an example showing a specific example of the above means will be described.
第１図に本考案に係る合成樹脂成形用樹脂型が
示され、固定型１と可動型２と可動型２に保持さ
れたスプルーブツシユ３とからなる。固定型１お
よび可動型２は型枠４，４内に金属粉入り樹脂、
例えば、鉄粉、銅粉、アルミ粉などを夫々単独若
しくは併用して含有するエポキシ系樹脂から形成
された注型樹脂層５，５およびキヤビテイ７を形
成する表装樹脂層６，６が配設され、さらに注型
樹脂層５，５中に冷却水、油等の冷媒の通る金属
製冷却用管８，８およぴ熱伝導性の高い棒状部材
および／または管状部材から形成された長尺金属
材９，９が多数個設けられている。スプルーブツ
シユ３にはスプルー３ａが形成され、キヤビテイ
７と連通している。 FIG. 1 shows a resin mold for molding synthetic resin according to the present invention, which consists of a fixed mold 1, a movable mold 2, and a sprue bush 3 held by the movable mold 2. The fixed mold 1 and the movable mold 2 have resin containing metal powder in the molds 4, 4,
For example, casting resin layers 5, 5 formed from an epoxy resin containing iron powder, copper powder, aluminum powder, etc., either alone or in combination, and facing resin layers 6, 6 forming the cavity 7 are disposed. , furthermore, metal cooling tubes 8, 8 through which a refrigerant such as cooling water or oil passes through the casting resin layers 5, 5, and a long metal formed from a rod-shaped member and/or a tubular member with high thermal conductivity. A large number of materials 9, 9 are provided. A sprue 3a is formed in the sprue bush 3 and communicates with the cavity 7.
射出成形において、溶融樹脂を射出ノズル（図
示せず）から樹脂型内に射出する。樹脂型内に射
出された溶融樹脂はスプルー３ａを通り、キヤビ
テイ７内に充填される。このとき、冷却用管８，
８には冷却水、油等の冷媒が通されており、樹脂
型は冷却用管８，８および熱伝導性の高い長尺金
属材９，９を介して強制的に冷却され、キヤビテ
イ７に充填された溶融樹脂は冷却用管８，８を通
る冷媒によつて速やかに熱を奮われ固化され、所
望形状の成形品となる。 In injection molding, molten resin is injected into a resin mold from an injection nozzle (not shown). The molten resin injected into the resin mold passes through the sprue 3a and is filled into the cavity 7. At this time, the cooling pipe 8,
A refrigerant such as cooling water or oil is passed through 8, and the resin mold is forcibly cooled through cooling pipes 8, 8 and long metal materials 9, 9 with high thermal conductivity, and then cooled into cavity 7. The filled molten resin is quickly heated and solidified by the refrigerant passing through the cooling tubes 8, 8, and becomes a molded product of a desired shape.
（考案の効果） 本考案は次の効果を生ずる。(Effect of idea) The present invention produces the following effects.
金属粉入り樹脂層中に冷媒の通る冷却用管およ
び熱伝導性の高い長尺金属材が多数個設けられて
いるから、樹脂型の冷却能が大となるので、樹脂
型の温度調節および成形温度の安定維持が容易に
でき、さらに耐熱性が向上するので、大幅なる型
寿命を延長しうることが可能となつた。 The resin layer containing metal powder is equipped with cooling tubes through which the refrigerant passes and a large number of long metal materials with high thermal conductivity, which increases the cooling capacity of the resin mold, making it easy to control the temperature of the resin mold and mold it. Since it is easy to maintain a stable temperature and the heat resistance is improved, it has become possible to significantly extend the life of the mold.
冷却用管および熱伝導性の高い長尺金属材によ
り樹脂型および樹脂型内に注入された溶融樹脂を
強制的に冷却するから、成形品の固化が早くなる
とともに成形品の離型性が向上するので、成形サ
イクルタイムが短縮できる。 The resin mold and the molten resin injected into the resin mold are forcibly cooled using a cooling tube and a long metal material with high thermal conductivity, which results in faster solidification of the molded product and improved mold release properties. Therefore, molding cycle time can be shortened.
第１図は本考案に係る合成樹脂成形用樹脂型の
断面図、第２図は従来の合成樹脂成形用樹脂型の
断面図である。
１……固定型、４……可動型、５……注型樹脂
層、８……冷却用管、９……長尺金属材。
FIG. 1 is a sectional view of a resin mold for molding synthetic resin according to the present invention, and FIG. 2 is a sectional view of a conventional resin mold for molding synthetic resin. 1... fixed type, 4... movable type, 5... cast resin layer, 8... cooling tube, 9... long metal material.
Claims (1)
において、金属粉入り樹脂層中に冷却用管および
熱伝導性の高い長尺金属材を多数個埋設したこと
を特徴とする合成樹脂成形用樹脂型。 A resin mold for synthetic resin molding made of resin containing metal powder, characterized in that a large number of cooling tubes and long metal materials with high thermal conductivity are embedded in the resin layer containing metal powder. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1023085U JPH0242419Y2 (en) | 1985-01-28 | 1985-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1023085U JPH0242419Y2 (en) | 1985-01-28 | 1985-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61125412U JPS61125412U (en) | 1986-08-07 |
| JPH0242419Y2 true JPH0242419Y2 (en) | 1990-11-13 |
Family
ID=30491219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1023085U Expired JPH0242419Y2 (en) | 1985-01-28 | 1985-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242419Y2 (en) |
-
1985
- 1985-01-28 JP JP1023085U patent/JPH0242419Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61125412U (en) | 1986-08-07 |
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