JPS61125412U - - Google Patents

Info

Publication number
JPS61125412U
JPS61125412U JP1023085U JP1023085U JPS61125412U JP S61125412 U JPS61125412 U JP S61125412U JP 1023085 U JP1023085 U JP 1023085U JP 1023085 U JP1023085 U JP 1023085U JP S61125412 U JPS61125412 U JP S61125412U
Authority
JP
Japan
Prior art keywords
resin
metal powder
containing metal
embedded
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1023085U
Other languages
Japanese (ja)
Other versions
JPH0242419Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1023085U priority Critical patent/JPH0242419Y2/ja
Publication of JPS61125412U publication Critical patent/JPS61125412U/ja
Application granted granted Critical
Publication of JPH0242419Y2 publication Critical patent/JPH0242419Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る合成樹脂成形用樹脂型の
断面図、第2図は従来の合成樹脂成形用樹脂型の
断面図である。 1……固定型、4……可動型、5……注型樹脂
層、8……冷却用管、9……長尺金属材。
FIG. 1 is a sectional view of a synthetic resin molding mold according to the present invention, and FIG. 2 is a sectional view of a conventional synthetic resin molding mold. 1... fixed type, 4... movable type, 5... cast resin layer, 8... cooling tube, 9... long metal material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属粉入り樹脂からなる合成樹脂成形用樹脂型
において、金属粉入り樹脂層中に冷却用管および
熱伝導性の高い長尺金属材を多数個埋設したこと
を特徴とする合成樹脂成形用樹脂型。
A resin mold for synthetic resin molding made of resin containing metal powder, characterized in that a large number of cooling tubes and long metal materials with high thermal conductivity are embedded in the resin layer containing metal powder. .
JP1023085U 1985-01-28 1985-01-28 Expired JPH0242419Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1023085U JPH0242419Y2 (en) 1985-01-28 1985-01-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1023085U JPH0242419Y2 (en) 1985-01-28 1985-01-28

Publications (2)

Publication Number Publication Date
JPS61125412U true JPS61125412U (en) 1986-08-07
JPH0242419Y2 JPH0242419Y2 (en) 1990-11-13

Family

ID=30491219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1023085U Expired JPH0242419Y2 (en) 1985-01-28 1985-01-28

Country Status (1)

Country Link
JP (1) JPH0242419Y2 (en)

Also Published As

Publication number Publication date
JPH0242419Y2 (en) 1990-11-13

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