JPH01146710A - Resin mold for manufacturing wax model - Google Patents

Resin mold for manufacturing wax model

Info

Publication number
JPH01146710A
JPH01146710A JP30666587A JP30666587A JPH01146710A JP H01146710 A JPH01146710 A JP H01146710A JP 30666587 A JP30666587 A JP 30666587A JP 30666587 A JP30666587 A JP 30666587A JP H01146710 A JPH01146710 A JP H01146710A
Authority
JP
Japan
Prior art keywords
mold
resin
wax
layer
grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30666587A
Other languages
Japanese (ja)
Inventor
Toshimichi Matsukawa
松川 年道
Yoshimi Sasaki
佐々木 義美
Seiji Miyamoto
誠司 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Precision Ltd
Original Assignee
Hitachi Metals Precision Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Precision Ltd filed Critical Hitachi Metals Precision Ltd
Priority to JP30666587A priority Critical patent/JPH01146710A/en
Publication of JPH01146710A publication Critical patent/JPH01146710A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To increase cooling efficiency of a resin mold of poor heat conductivity and enhance the productibity of injection molded products by using resin only, fine Cu or Al grains of a given diameter, or a material containing powdery grains of an ally of the metals for the mold surface, and epoxy resin containing powdery grains of metal or alloy for a second layer, and providing a metal continuous body such as a net, a rod, a tube or the like for the other layers. CONSTITUTION:A wax model is covered with a resin layer 3 as thin as possible. Its outer periphery is lined with an epoxy resin second layer 4 containing aluminum powder, of average diameter of 50mum or less, aluminum grains or the like. A metal continuous body 2 such as a cooling pipe or the like is provided through the second layer. Further, an aluminum mold 1 of good heat conductivity is used for the outer periphery. heat conductivity of a resin mold for lost wax can be improved to shorten the wax molding cycle.

Description

【発明の詳細な説明】 〔産業上の利用分野〕  ′ 本発明はロストワックス法におけるワックス模型の製造
方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] ' The present invention relates to a method for manufacturing a wax model using the lost wax method.

〔従来の技術〕[Conventional technology]

三次元形状のワックス模型を複数個製造する効率的な方
法は、現在のところ、型を用いて射出成形によって行う
以外には見当らない。しかしながら昨今の少量多品種生
産の時代においては、製品の移り変りが′激しく、その
都度、新しい型の設計、製作が必要となり、コスト高と
なったり、時間がかかる等の閘題が生じてきた。このた
め、少量多品種の精鋳品の製品開発の高速化に対応する
型製造技術として、従来の金型に代って樹脂を型材料と
して使用する樹脂型が発達してきた。樹脂型は、従来の
金型に較べ、製作期間が約4分の1と短く、製作量も約
4分の1で済むのでロストワックス模型用型においても
、樹脂型が使用されるようになったが、その熱伝導性の
悪さから型の゛冷却性が悪く、成形サイクルが長いこと
が欠点であった。
At present, there is no efficient method for manufacturing a plurality of three-dimensional wax models other than injection molding using a mold. However, in the current era of low-volume, high-mix production, products change rapidly, and each time a new mold needs to be designed and manufactured, resulting in problems such as high costs and time. For this reason, resin molds that use resin as a mold material have been developed in place of conventional molds as a mold manufacturing technology that supports the speeding up of product development for precision castings in small quantities and in a wide variety of products. Compared to conventional molds, resin molds take about a quarter of the time to produce and require about a quarter of the production volume, so resin molds have come to be used in lost wax model molds as well. However, due to its poor thermal conductivity, the cooling performance of the mold was poor and the molding cycle was long.

これを解決するためにアルミ粉入りエポキシ樹脂が発案
されたがこれでもB1−5u合金の1/70程度である
。    □ 本発明はこのような状況により、従来型設計、型製作で
有利ではあるが、反面冷却性4の面で劣り成形サイクル
の長かった樹脂型において、樹脂材質及び型膜゛計方法
を検討し、型の冷却性の向上を図り、ワックス成形サイ
クルタイムを短縮する方法を提供しようとするものであ
る。
To solve this problem, an epoxy resin containing aluminum powder was proposed, but even this is about 1/70 of the B1-5u alloy. □ Under these circumstances, the present invention has been developed to study the resin material and mold film measurement method for resin molds, which are advantageous in conventional design and mold manufacturing, but are inferior in terms of cooling performance4 and have a long molding cycle. The present invention aims to provide a method for improving mold cooling performance and shortening wax molding cycle time.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ロストワックス射出成形機の場合 ■ ワックス材料を加熱し半溶融状態にする。 For lost wax injection molding machine ■ Heat the wax material to a semi-molten state.

■ 金型に半溶融状態のワックスを圧入する。■ Press the semi-molten wax into the mold.

■ 金型にワックスが充填した状態で圧力保持する。■ Maintain pressure while the mold is filled with wax.

■ ワックスが金型内で固化するまで冷却保持する。■ Keep the wax cool in the mold until it solidifies.

■ 金型からワックス模型を取り出す。■ Remove the wax model from the mold.

という工程をとる。This process is taken.

したがって金型はワックスとの熱交換器の役割りを果た
すのであり、熱伝導率が良ければ良い程、熱の放出が早
く、ワックスの冷却も早くなる。このワックスの冷却の
速さは、そのまま成形時間に結びつき、即ち熱伝導率の
良い程、成型時間が短くなり生産効率はアップする。し
かし、樹脂型に一般に使用されているエポキシ樹脂は、
熱伝導率が金属の数百分の1程度であり、金型の冷却性
は非常に悪い。
Therefore, the mold plays the role of a heat exchanger with the wax, and the better the thermal conductivity, the faster the heat is released and the faster the wax is cooled. The cooling speed of the wax is directly linked to the molding time; that is, the better the thermal conductivity, the shorter the molding time and the higher the production efficiency. However, the epoxy resin commonly used for resin molds is
Its thermal conductivity is about one hundredth of that of metal, and its mold cooling properties are extremely poor.

表1に主な金型材料と樹脂材料の熱伝導性を記す。本発
明は製作工数の面では良いが、熱伝導性の悪い樹脂型の
冷却効率を上げて、射出成型品の生産効率を大幅に上げ
るものである。
Table 1 shows the thermal conductivity of the main mold materials and resin materials. Although the present invention is good in terms of manufacturing man-hours, it improves the cooling efficiency of a resin mold with poor thermal conductivity, thereby significantly increasing the production efficiency of injection molded products.

表1 各種型材料による熱伝導率比較 〔問題点を解決するための手段〕 熱を加えられ、可塑状態となったワックスは射出成形機
により、型の中へ射出される。ワックスは型の中に充填
された後、熱を型に放出して凝固する。これを繰り返す
時、熱伝導性の悪い型であれば、ワックスの熱放出に時
間を要し、サイクルタイムが長くなる。また面引けと称
する冷却不均一による寸法バラツキが発生する。すなわ
ちワックス成形の生産効率および品質アップを図るため
には、いかにしてワックスの熱を外に逃がすかにかかっ
てくる。
Table 1 Comparison of thermal conductivity of various mold materials [Means for solving the problem] Wax, which has been heated and becomes plastic, is injected into a mold by an injection molding machine. After the wax is filled into the mold, it emits heat into the mold and solidifies. When repeating this process, if the mold has poor thermal conductivity, it will take time for the wax to release heat, resulting in a longer cycle time. Also, dimensional variations occur due to non-uniform cooling, which is called surface shrinkage. In other words, in order to improve the production efficiency and quality of wax molding, it depends on how the heat of the wax can be released to the outside.

本発明方法は、ワックスに直接触れる部分、すなわち型
表面には、樹脂のみもしくは平均粒径0.05 lTl
l11以下の細かいCo、An!またはこれらの合金の
粉粒入すの材料、2N目には上記金属または合金の粉粒
入りエポキシ樹脂を使用し、熱伝導率を高めた樹脂型を
使用し、ワックス模型の成形を行うことを特徴とするも
のである。また本発明において、第2N目以降に網、棒
、管等の金属の連続体を介在させて熱伝導をさらに増進
するものである。
In the method of the present invention, only the resin or the average particle size of 0.05 lTl is used on the part that comes into direct contact with the wax, that is, on the mold surface.
Fine Co, An below l11! Alternatively, use an epoxy resin containing powder of the above metal or alloy for the 2N material, and use a resin mold with high thermal conductivity to mold the wax model. This is a characteristic feature. Further, in the present invention, a continuous metal body such as a net, a rod, a tube, etc. is interposed after the 2Nth point to further improve heat conduction.

まず本発明において、エポキシ樹脂を2層以上とした理
由について説明する。樹脂型に要求される性質として、 ■ 型の強度が高いこと。
First, the reason why two or more layers of epoxy resin are used in the present invention will be explained. The properties required for resin molds are: ■ The mold must have high strength.

■ 型の表面粗度が良く離型性の良いこと。■ The surface roughness of the mold is good and the mold releasability is good.

■ 熱伝導性が良いこと。■ Good thermal conductivity.

が挙げられる。can be mentioned.

エポキシ樹脂にアルミ粉を混合した場合、その割合いが
高い程、熱伝導性は良くなる。
When aluminum powder is mixed with epoxy resin, the higher the ratio, the better the thermal conductivity.

従来、樹脂の熱伝導率を良くするため、粒度350nl
esh (44#m) 〜500mesh程度のアルミ
粉を混入させることは行われていたが、型表面の面粗度
保持のため、アルミ粉は細かい粉に限定されていた。し
かし、本発明により、型を2層以上に分けることで型表
面は、薄い樹脂もしくはアルミ粉入り樹脂層、その廻り
をアルミ等の粉および粒度1.5閣程度の粗いアルミ等
の粒を混ぜた状態で作れば、熱伝導率は良くなり、型表
面粗度も良い状態に保てる。また型表面は樹脂の薄い層
で作り、その他の部分を熱伝導率の良いアルミ粉入すの
樹脂で作る事により金型の強度を高める効果をも狙って
いる。
Conventionally, in order to improve the thermal conductivity of the resin, the particle size was 350nl.
Aluminum powder of about esh (44 #m) to 500 mesh has been mixed in, but in order to maintain the surface roughness of the mold surface, the aluminum powder was limited to fine powder. However, according to the present invention, by dividing the mold into two or more layers, the surface of the mold is a thin resin or resin layer containing aluminum powder, and the surrounding area is mixed with aluminum powder and coarse particles of aluminum with a particle size of about 1.5 mm. If the mold is made in this condition, the thermal conductivity will be good and the surface roughness of the mold will be maintained in a good condition. In addition, the mold surface is made of a thin layer of resin, and the other parts are made of resin containing aluminum powder, which has good thermal conductivity, with the aim of increasing the strength of the mold.

また、網等の連続体は、それぞれ独立に存在する金属粉
粒に比し、連続体であることにより、熱伝導向上効果を
非常に高めることが判明した。
It has also been found that a continuous body such as a net greatly enhances the effect of improving heat conduction compared to metal powder grains that exist independently.

〔実施例〕〔Example〕

本発明を実施例に基づいて説明する。 The present invention will be explained based on examples.

表2に使用した樹脂及びアルミ粒、アルミ粒の配合比を
示す。
Table 2 shows the blending ratio of the resin, aluminum particles, and aluminum particles used.

表2 第1図に樹脂型の例を示す。Table 2 Figure 1 shows an example of a resin mold.

ワックス模型を極力薄い樹脂層1Nにておおう。Cover the wax model with a 1N resin layer as thin as possible.

その外周をアルミ粒及びアルミ粒入りの樹脂第2層にて
裏打ちする。この第2層中に冷却パイプ等の金属連続体
を通す。また外周を熱伝導性の面よりアルミ型とする。
The outer periphery is lined with aluminum grains and a second layer of resin containing aluminum grains. A metal continuum, such as a cooling pipe, is passed through this second layer. Also, the outer periphery is made of aluminum for better thermal conductivity.

このとき、樹脂層は、第1層。At this time, the resin layer is the first layer.

第2層とも極力薄くした方がペターである。It is better to make the second layer as thin as possible.

〔発明の効果〕〔Effect of the invention〕

以上のごとく本発明によれば、ロストワックス用樹脂型
の熱伝導性を高めることが出来、ワックス成形サイクル
の短縮となる。そしてワックス模型成形の生産効率を高
められるものである。
As described above, according to the present invention, the thermal conductivity of the resin mold for lost wax can be increased, and the wax molding cycle can be shortened. Moreover, the production efficiency of wax model molding can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はロストワックス用樹脂型モデルの例を示す図で
ある。 1ニアルミ枠、2:冷却パイプ、3:第1N、4:第2
層、5:型空間。
FIG. 1 is a diagram showing an example of a resin mold model for lost wax. 1 aluminum frame, 2: cooling pipe, 3: 1st N, 4: 2nd
Layer 5: Type space.

Claims (1)

【特許請求の範囲】 1、加熱ワックス材料を加圧注入、凝固させてワックス
模型を製造する樹脂型において、型表面部はエポキシ樹
脂またはこれに平均粒径50μm以下のAlもしくはC
uまたはこれらの合金でなる粉粒を添加した層、該型表
面部の後方に前記金属または合金でなる粉粒を前記添量
以上添加したエポキシ樹脂層として、2層以上としたこ
とを特徴とするワックス模型製造用樹脂型。 2、型表面から第2層以降に金属でなる網、棒、冷却管
等金属連続体を介在させたことを特徴とする特許請求の
範囲第1項記載のワックス模型製造用樹脂型。
[Claims] 1. In a resin mold for producing a wax model by injecting and solidifying a heated wax material under pressure, the surface of the mold is made of epoxy resin or Al or C with an average particle size of 50 μm or less.
It is characterized by having two or more layers, including a layer to which powder grains made of u or an alloy thereof are added, and an epoxy resin layer to which powder grains made of the metal or alloy are added in the amount or more at the rear of the mold surface. A resin mold for making wax models. 2. A resin mold for manufacturing a wax model according to claim 1, characterized in that a metal continuous body such as a metal net, rod, or cooling pipe is interposed from the second layer onwards from the mold surface.
JP30666587A 1987-12-03 1987-12-03 Resin mold for manufacturing wax model Pending JPH01146710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30666587A JPH01146710A (en) 1987-12-03 1987-12-03 Resin mold for manufacturing wax model

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30666587A JPH01146710A (en) 1987-12-03 1987-12-03 Resin mold for manufacturing wax model

Publications (1)

Publication Number Publication Date
JPH01146710A true JPH01146710A (en) 1989-06-08

Family

ID=17959843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30666587A Pending JPH01146710A (en) 1987-12-03 1987-12-03 Resin mold for manufacturing wax model

Country Status (1)

Country Link
JP (1) JPH01146710A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152974A (en) * 1987-03-26 1992-10-06 Solvay S.A. Process for the manufacture of a powder of mixed metal oxides, and mixed metal oxide powders
US5156754A (en) * 1989-08-07 1992-10-20 Nissan Motor Co., Ltd. Metal-powder filled epoxy resin mold
JP2001232444A (en) * 2000-01-10 2001-08-28 General Electric Co <Ge> Casting having high heat transfer surface, and mold and pattern for forming the same
CN108097870A (en) * 2017-12-29 2018-06-01 荆门市亿美工业设计有限公司 Upper-turn-type ring mould claps powder complete machine
CN108097869A (en) * 2017-12-29 2018-06-01 荆门市亿美工业设计有限公司 A kind of upper-turn-type claps powder device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152974A (en) * 1987-03-26 1992-10-06 Solvay S.A. Process for the manufacture of a powder of mixed metal oxides, and mixed metal oxide powders
US5156754A (en) * 1989-08-07 1992-10-20 Nissan Motor Co., Ltd. Metal-powder filled epoxy resin mold
JP2001232444A (en) * 2000-01-10 2001-08-28 General Electric Co <Ge> Casting having high heat transfer surface, and mold and pattern for forming the same
CN108097870A (en) * 2017-12-29 2018-06-01 荆门市亿美工业设计有限公司 Upper-turn-type ring mould claps powder complete machine
CN108097869A (en) * 2017-12-29 2018-06-01 荆门市亿美工业设计有限公司 A kind of upper-turn-type claps powder device
CN108097870B (en) * 2017-12-29 2019-11-12 荆门市亿美工业设计有限公司 Upper-turn-type ring mould claps powder complete machine
CN108097869B (en) * 2017-12-29 2019-11-12 荆门市亿美工业设计有限公司 A kind of upper-turn-type bat powder device

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