CN103433450B - A kind of preparation method of integrated chip unit - Google Patents
A kind of preparation method of integrated chip unit Download PDFInfo
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- CN103433450B CN103433450B CN201310389285.8A CN201310389285A CN103433450B CN 103433450 B CN103433450 B CN 103433450B CN 201310389285 A CN201310389285 A CN 201310389285A CN 103433450 B CN103433450 B CN 103433450B
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- integrated chip
- chip unit
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Abstract
A preparation method for integrated chip unit, comprising: 1, adopts paddling process prepare composite material sizing agent and be heated; 2, core is placed in casting mold, is arranged on after preheating on centrifugal casting machine together with casting mold; 3, open centrifugal casting machine and pour into a mould, after being poured, opening electromagnetic field generator, carry out blank forming, after shaping, closing centrifugal casting machine and electromagnetic field generator, take out foundry goods and cut, form electronic packing part blank; 4, single part blank cut and removes core pattern, then carrying out machining and obtain electronic packing part; 5, electronic chip is loaded encapsulating parts, data wire is drawn from fairlead simultaneously, then two rectangle electronic packing parts are assembled together and form integrated chip unit.Use the obtained enhancing particle of this method to occur without cluster of grains, a material is evenly distributed, without slag inclusion pore.Thus obtained integrated chip unit has, and thermal conductivity is good, density is low, heat endurance high.
Description
Technical field
The present invention relates to a kind of preparation method of integrated chip unit.
Background technology
Along with the high speed development of information technology, the chip integration in electronic device is more and more higher, and power is increasing, requires also more and more higher to the thermal diffusivity of encapsulating material.At present, in engineering practice, the W-Cu alloy of extensive use is second generation electronic package material.Adopt W-Cu reasonable offer electronic packing part, technical maturity, linear expansion coefficient (5.9-10X10
-6k) low, and semiconductor chip matching is better.But its thermal conductivity factor (150-220W/mK) is lower, and heat-sinking capability is poor, is not suitable for the application of high-power electronic device; Further, its density (15-17g/cm
3) large, be difficult to be applied to the field of density sensitive at some, such as the field such as Aero-Space, portable electronic instrument.In addition, the price of W and Cu self is high, cause following process and application cost higher.Since the nineties in last century, along with the appearance of various High Density Packaging Technology, research and development high heat conduction used for sealing electronic device, low bulk, low density metals base composite material parts and forming technique just become the focus in this field.
In studying numerous metal-base composites used for electronic packaging, the aluminum matrix composite of SiC particle reinforce becomes with its excellent performance the third generation electronic package material being expected to alternative W-Cu alloy most.The aluminium composite material of SiC particle reinforce has the low (density: 2.8-3.1g/cm of density
3), thermal conductivity good (thermal conductivity factor 240-480W/mK), the high (linear expansion coefficient: 6-15X10 of heat endurance
-6the feature such as K).Reported employing SiC particle reinforce aluminium composite material prepares the technology of electronic packing part, mainly contains powder metallurgic method, prefabricated blank method, liquid infiltration, centre spinning etc.Wherein, centre spinning preparation technology is the simplest, and is applicable to large-scale production, and cost is low.
Centre spinning is adopted to prepare the aluminum matrix composite electronic packing part of SiC particle reinforce, its principle is the density contrast utilizing SiC and aluminium liquid, by the effect of centrifugal force, density is greater than the particle segregation of aluminium liquid in the blank cavity of electronic packing part, forms the particulate reinforced composite part of high-volume fractional.Adopt the method, can reach 40%-75% by SiC grain volume fraction, and, as required, can carry out designing to the volume fraction of particle easily by reasonable disposition composite material sizing agent and control centrifugal rotational speed and control.While flospinning, density is less than the gentle direction segregation of steeping oneself-meeting contrary with movement of particles of slag inclusion of aluminium liquid, thus ensure that the cleaning of material.But the method also has a wretched insufficiency part, it is exactly the agglomeration of SiC particle.The existence of cluster of grains, reduces the contact area of particle and aluminum substrate, thus reduces its thermal conductivity and heat endurance.
Summary of the invention
In view of this, the invention provides a kind of preparation method of integrated chip unit, the encapsulating parts thermal conductivity that the method obtains is good, density is low, heat endurance is high.
The preparation method of rectangle electronic packing part of the present invention, specifically comprises the following steps:
Step 1, adopts paddling process prepare composite material sizing agent and heated by composite material sizing agent;
Step 2, is placed in core in casting mold, and is arranged on after preheating on centrifugal casting machine together with casting mold;
Step 3, opens centrifugal casting machine and pours into a mould, and after being poured, opening electromagnetic field generator and produces magnetic field, carry out blank forming, after shaping, close centrifugal casting machine and electromagnetic field generator, take out foundry goods and cut, form electronic packing part blank;
Step 4, cuts single part blank and removes core pattern, then carries out machining and obtains the rectangle electronic packing part that two have fairlead;
Step 5, loads encapsulating parts by electronic chip, is drawn by data wire from fairlead simultaneously, is then assembled together by two rectangle electronic packing parts and forms integrated chip unit.
Further, in described step 1, composite material sizing agent selects Al-Si system alloy to be matrix alloy, and strengthening particle is SiC particle.
Further, the particle diameter of described SiC particle is between 5-80 μm.
Further, the volume fraction of described SiC particle is the 20%-40% of composite material sizing agent.
Further, in described step 3, the direction in magnetic field is vertical or parallel with centrifugal casting mould axis direction.
Further, the intensity in described magnetic field is 0.01 ~ 0.5T.
Further, described casting mold is made up of non-magnet_conductible material.
Further, the preheat temperature of described casting mold is 300-450 DEG C.
Further, the temperature of described composite material sizing agent heating is 680-780 DEG C.
Further, in described step 3, the rotating speed of centrifugal casting machine is 1000-4000r/min.
Beneficial effect of the present invention is: in the present invention, and composite material sizing agent is in electromagnetic centrifugal Composite Field, and because casting mold and the aluminium composite material solidified are non-permeable material, therefore it is not by the impact of electromagnetic force, still rotates with setting speed.And during melt cutting magnetic line, the electromagnetic force being in reverse to casting mold direction of rotation can be subject to, cause the rotary speed of melt lower than casting mold.Under this stressing conditions, when solidification front is from the process of outer layers towards inner layers movement, repeatedly washing away of melt will be subject to, thus the cluster of grains being in solidification front place is broken up, and make it to be uniformly distributed in skin.Use the obtained enhancing particle of this method to occur without cluster of grains, a material is evenly distributed, without slag inclusion and pore.Thus obtained integrated chip unit has, and thermal conductivity is good, density is low, heat endurance high.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described;
Fig. 1 is the formation schematic diagram of cluster of grains in centrifugal casting SiC particle reinforce aluminium composite material electronic packing part process;
Fig. 2 is the casting mold structure figure of electromagnetic centrifugal casting shaping SiC particle reinforce aluminium composite material electronic packing part;
Fig. 3 is that core puts schematic diagram;
Fig. 4 is the refinement schematic diagram of cluster of grains in electromagnetic centrifugal casting forming process;
Fig. 5 is Single Electron encapsulating parts blank drawing after electromagnetic centrifugal casting is shaped;
Fig. 6 is Single Electron encapsulating parts blank B-B face sectional view after electromagnetic centrifugal casting is shaped;
Fig. 7 is half of integrated chip cellular construction figure (front view) after machining;
Fig. 8 is half of integrated chip cellular construction figure (top view) after machining.
Wherein cluster of grains 1, solidifies part 2, particle 3, slag inclusion, bubble 4, casting mold 5, die cavity 6, core 7, pilot hole 8, and fairlead 9A4 represents that electromagnetic force direction A3 represents that casting mold direction of rotation B1 represents electromagnetic field direction
Detailed description of the invention
Hereinafter with reference to accompanying drawing, the preferred embodiments of the present invention are described in detail.
The agglomeration (arrow in figure represents the respective direction of motion) that Fig. 1 discloses flospinning principle and causes.After particle 3 moves to skin, solidified part 2 forward position and limit, its movement velocity can be more and more less, and finally rest on outer a certain position, and now follow-up particle is still assembled in outer layers, therefore, with the raising of skin granulate volume fraction, the reunion of particle will inevitably be there is, form cluster of grains 1.
Shown in Fig. 2, casting mold comprises upper die and lower die, core and alignment pin and forms.External force ensures that strengthening particle can assemble in blank part die cavity, and core is positioned over die cavity skin.
Fig. 3 is the distribution of core in die cavity.As can be seen from Figure 3, in actual production, can as required, the number of appropriate design blank cavity, enhances productivity.Mold material is non-permeable material, can select the materials such as stainless steel, copper alloy, graphite.
Fig. 4 is the refinement schematic diagram (arrow in figure represents the respective direction of motion) of cluster of grains in electromagnetic centrifugal casting forming process.Its Forming Theory is consistent with single centrifugal casting, and namely density is greater than the outside die cavity 6 of SiC phase of aluminium liquid, and density is less than slag inclusion, the bubble 4 internally die cavity of aluminium liquid.That electromagnetic centrifugal is shaped can effective micronized particles group with single centrifugal casting difference.As shown in Figure 4, in electromagnetic centrifugal Composite Field, because casting mold 5 and the aluminium composite material solidified are non-permeable material, therefore it is not by the impact of electromagnetic force, still rotates with setting speed.And during melt cutting magnetic line, the electromagnetic force being in reverse to casting mold direction of rotation A3 can be subject to, cause the rotary speed of melt lower than casting mold.Under this stressing conditions, when solidification front is from the process of outer layers towards inner layers movement, repeatedly washing away of melt will be subject to, thus the cluster of grains being in solidification front place is broken up, and make it to be uniformly distributed in skin.
Embodiment 1:
Raw material: SiC grain diameter is 60-80 μm, matrix is Al-Si system alloy, and the volume fraction of SiC particle is 20%.
Step 1, first adopt paddling process prepare composite material sizing agent, and be heated to 680-700 DEG C stand-by.
Step 2, is accurately placed in core in casting mold, and is arranged on centrifugal casting machine be preheated to 300 DEG C together with casting mold after.
Step 3, open centrifugal casting machine, pour into a mould under the low speed, after being poured, centrifugal rotational speed is adjusted to the 1000r/min of setting, open electromagnetic field generator simultaneously, carry out blank forming, after shaping, close centrifugal casting machine and magnetic field generator, take out foundry goods and by foundry goods along the dotted line cutting shown in Fig. 3, just form single rectangle electronic packing part blank as illustrated in Figures 5 and 6.In the present embodiment, electromagnetic field intensity is 0.01T, and electromagnetic field has two kinds of applying modes, the first, electromagnetic field is parallel to the axle center of casting mold, as shown in Figure 2 (wherein B1 represents the direction of electromagnetic field), and electromagnetic field direction can be identical with diagram, also can be contrary; The second, electromagnetic field is perpendicular to casting mold axle center, and as shown in Figure 2, electromagnetic field direction can be identical with diagram, also can be contrary.Two kinds of applying modes all can guarantee melt cutting magnetic line in rotary course, produce electromagnetic force.
Step 4, cuts single blank part (shown in Fig. 5 and 6) along B-B face, and removes core 7, then carries out machining just formation electronic packing part as shown in FIG. 7 and 8.Wherein, the front view of half of encapsulating parts that Fig. 7 shows, the top view of what Fig. 8 showed is encapsulating parts.Due to two half of part full symmetrics of this rectangle electronic packing part, therefore, half of part is not just repeating in addition.
Step 5, loads encapsulating parts by electronic chip, is drawn by data wire from fairlead 9 simultaneously, then, by four pilot holes 8, two half of Assembly of the parts is being played a just formation integrated chip unit.
In the present embodiment, the volume fraction strengthening particle is about 40%.Occur without cluster of grains, even particle distribution, without slag inclusion and pore.And the last integrated chip unit formed has, and thermal conductivity is good, density is low, heat endurance high.
Embodiment 2:
Compared with other embodiment, the difference of the present embodiment is, SiC grain diameter is 40-60 μm, the volume fraction of SiC particle is 25%, the heating-up temperature of composite material sizing agent is 700-720 DEG C, the temperature of casting mold preheating is 350 DEG C, and the rotating speed of centrifugal casting machine is 1500r/min, and magnetic field intensity is 0.1T.
In the present embodiment, the volume fraction strengthening particle is about 50%.Occur without cluster of grains, even particle distribution, without slag inclusion and pore.And the last integrated chip unit formed has, and thermal conductivity is good, density is low, heat endurance high.
Embodiment 3
Compared with other embodiment, the difference of the present embodiment is, SiC grain diameter is 20-40 μm, the volume fraction of SiC particle is 30%, the heating-up temperature of composite material sizing agent is 720-740 DEG C, the temperature of casting mold preheating is 400 DEG C, and the rotating speed of centrifugal casting machine is 2000r/min, and magnetic field intensity is 0.3T.
In the present embodiment, the volume fraction strengthening particle is about 60%.Occur without cluster of grains, even particle distribution, without slag inclusion and pore.And the last integrated chip unit formed has, and thermal conductivity is good, density is low, heat endurance high.
Embodiment 4
Compared with other embodiment, the difference of the present embodiment is, SiC grain diameter is 10-20 μm, the volume fraction of SiC particle is 35%, the heating-up temperature of composite material sizing agent is 740-760 DEG C, the temperature of casting mold preheating is 400 DEG C, and the rotating speed of centrifugal casting machine is 3000r/min, and magnetic field intensity is 0.5T.
In the present embodiment, the volume fraction strengthening particle is about 70%.Occur without cluster of grains, even particle distribution, without slag inclusion and pore.And the last integrated chip unit formed has, and thermal conductivity is good, density is low, heat endurance high.
Embodiment 5
Compared with other embodiment, the difference of the present embodiment is, SiC grain diameter is 5-10 μm, the volume fraction of SiC particle is 40%, the heating-up temperature of composite material sizing agent is 760-780 DEG C, the temperature of casting mold preheating is 450 DEG C, and the rotating speed of centrifugal casting machine is 4000r/min, and magnetic field intensity is 0.1T.
In the present embodiment, the volume fraction strengthening particle is about 80%.Occur without cluster of grains, even particle distribution, without slag inclusion and pore.And the last integrated chip unit formed has, and thermal conductivity is good, density is low, heat endurance high.
In actual production, can according to actual needs to the technological parameter of centrifugal casting particulate reinforced composite (as magnetic field and centrifugal rotational speed size and and time relationship, the heating-up temperature, casting mold preheat temperature etc. of composite material sizing agent), raw material types and content carries out various adjustment.Such as, by adjustment matrices of composite material and strengthen the kind of particle, ratio and centrifugal molding process, the particle-reinforced gradient composite materials of other kinds can be prepared, and can to realize enhancement layer be that cataclysm gradient distributes, the controlled design of enhancement layer thickness; By adjusting matrix and strengthening composition, the centrifugal casting technique of particle or take follow-up Metamorphism treatment technique, in composite material sizing agent preparation process, as required, certain trace alloying element (Cu, Ti, Ni, Mn etc.) can be added, in order to improve the intensity of matrix alloy.
What finally illustrate is, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, above-described embodiment analyzes emphatically centrifugal force and magnetic field changes in time and the magnetic field load time on the impact of properties of product, but this does not get rid of the load mode in other centrifugal force and magnetic field, related personnel can make many variations as required.
Claims (7)
1. a preparation method for integrated chip unit, is characterized in that: specifically comprise the following steps:
Step 1, adopts paddling process prepare composite material sizing agent and heated by composite material sizing agent;
Step 2, is placed in core in casting mold, and is arranged on after preheating on centrifugal casting machine together with casting mold;
Step 3, opens centrifugal casting machine and pours into a mould, and after being poured, opening electromagnetic field generator and generates an electromagnetic field, carry out blank forming, after shaping, close centrifugal casting machine and electromagnetic field generator, take out foundry goods and cut, form electronic packing part blank;
Step 4, cuts single part blank and removes core pattern, then carries out machining and obtains the rectangle electronic packing part that two have fairlead;
Step 5, loads encapsulating parts by electronic chip, is drawn by data wire from fairlead simultaneously, is then assembled together by two rectangle electronic packing parts and forms integrated chip unit;
In described step 1, composite material sizing agent selects Al-Si system alloy to be matrix alloy, and strengthening particle is SiC particle;
In described step 3, the direction in magnetic field is vertical or parallel with centrifugal casting mould axis direction;
The intensity of described electromagnetic field is 0.3 ~ 0.5T.
2. the preparation method of integrated chip unit as claimed in claim 1, is characterized in that: the particle diameter of described SiC particle is between 5-80 μm.
3. the preparation method of integrated chip unit as claimed in claim 1 or 2, is characterized in that: the volume fraction of described SiC particle is the 20%-40% of composite material sizing agent.
4. the preparation method of integrated chip unit as claimed in claim 1, is characterized in that: described casting mold is made up of non-magnet_conductible material.
5. the preparation method of integrated chip unit as claimed in claim 1, is characterized in that: the preheat temperature of described casting mold is 300-450 DEG C.
6. the preparation method of integrated chip unit as claimed in claim 1, is characterized in that: the temperature of described composite material sizing agent heating is 680-780 DEG C.
7. the preparation method of integrated chip unit as claimed in claim 1, is characterized in that: in described step 3, the rotating speed of centrifugal casting machine is 1000-4000r/min.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124682A (en) * | 1993-04-10 | 1996-06-19 | 中国科学院金属研究所 | Electromagnetic field centrifugal casting process for metal base composite material |
| CN1257765A (en) * | 1998-12-18 | 2000-06-28 | 中国科学院金属研究所 | Technology for manufacturing seamless alloy pierced billet |
| CN101451203A (en) * | 2008-12-30 | 2009-06-10 | 重庆大学 | Method for preparing SiCp/Al electronic packing part |
| CN102410102A (en) * | 2011-12-05 | 2012-04-11 | 重庆大学 | Authigenic Al3Ni and Si mixed particle aluminium alloy piston for local enhancement and preparation method thereof |
-
2013
- 2013-08-30 CN CN201310389285.8A patent/CN103433450B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124682A (en) * | 1993-04-10 | 1996-06-19 | 中国科学院金属研究所 | Electromagnetic field centrifugal casting process for metal base composite material |
| CN1257765A (en) * | 1998-12-18 | 2000-06-28 | 中国科学院金属研究所 | Technology for manufacturing seamless alloy pierced billet |
| CN101451203A (en) * | 2008-12-30 | 2009-06-10 | 重庆大学 | Method for preparing SiCp/Al electronic packing part |
| CN102410102A (en) * | 2011-12-05 | 2012-04-11 | 重庆大学 | Authigenic Al3Ni and Si mixed particle aluminium alloy piston for local enhancement and preparation method thereof |
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