JPH024238U - - Google Patents
Info
- Publication number
- JPH024238U JPH024238U JP8209088U JP8209088U JPH024238U JP H024238 U JPH024238 U JP H024238U JP 8209088 U JP8209088 U JP 8209088U JP 8209088 U JP8209088 U JP 8209088U JP H024238 U JPH024238 U JP H024238U
- Authority
- JP
- Japan
- Prior art keywords
- frequency power
- high frequency
- matching unit
- power switch
- switching mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8209088U JPH024238U (cs) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8209088U JPH024238U (cs) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024238U true JPH024238U (cs) | 1990-01-11 |
Family
ID=31306853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8209088U Pending JPH024238U (cs) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024238U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03171623A (ja) * | 1989-10-03 | 1991-07-25 | Applied Materials Inc | 半導体ウェーハ製造用プラズマ処理方法 |
-
1988
- 1988-06-20 JP JP8209088U patent/JPH024238U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03171623A (ja) * | 1989-10-03 | 1991-07-25 | Applied Materials Inc | 半導体ウェーハ製造用プラズマ処理方法 |
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