JPH0241861Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to the structure of an electronic component, and more particularly to the structure of an electronic component block such as a solid electrolytic capacitor.

Conventionally, it has become necessary to mount a plurality of solid electrolytic capacitors all at once on a printed wiring board. To this end, it is easy to consider preparing a container that can accommodate a predetermined number of solid electrolytic capacitors and storing them in the container. In this case, if the number of solid electrolytic capacitors to be mounted at once differs, it is necessary to prepare and manufacture containers according to the number. Therefore, such a method has poor productivity.

It is also possible to combine the elements into a block based on the state of the elements, but if even one of the plurality of elements is defective or deteriorates during assembly, the block will be rejected. Furthermore, since the device is integrated and covered with an exterior covering, assembly work is troublesome and miniaturization is difficult.

The purpose of this invention is to create an electronic component block in which adjacent electronic components are brought into contact with each other so that the electronic components can be stably fixed on the circuit board when multiple electronic components are mounted on the circuit board. It is to provide.

Another object of the present invention is to provide a structure that makes such an electronic component block compact and easy to manufacture.

FIG. 1 is a perspective view of an embodiment of the present invention.
Electronic component block solid electrolytic capacitor block B
are individual solid electrolytic capacitors B1, B2,
..., Bn. As shown in Fig. 2, each solid electrolytic capacitor B1, B2,..., Bn is housed in a rectangular synthetic resin container 2 with two adjacent sides 1a, 1b open, and the container 2. It consists of a capacitor element 14. Leads 10 and 12, which extend downward and are exposed in FIG. 2, are fixed to the container 2 by partially embedding them in the container wall. lead 1
A connecting portion 5 between one surface 3a where 0 and 12 are exposed and one surface 3b continuous to that one surface is formed by cutting.

The container 2 is placed on the opposite side of the open side 1a of the container 2.
The solid electrolytic capacitor block B is manufactured by connecting a plurality of capacitors so that one side 1a of the capacitors a are facing each other, as shown in FIG. 3, and injecting and solidifying a synthetic resin.

4 and 5 are enlarged perspective views of the lead 10 and its vicinity. The lead 10 has a flat plate shape,
Leads 10 on the surface 3a where the leads 10 are exposed
A recess 7 is formed near the base of. Alternatively, the lead 10 may be bent and processed so as to be substantially parallel to the one surface 3a so as to be accommodated in the recess 7 as shown in FIG. The same applies to the lead 12. This ensures stability of the solid electrolytic capacitor block B when it is mounted on a circuit board. That is, when bending and processing the leads 10 and 12, it is difficult to form them parallel to the one surface 3a of the container 2, and when the leads 10 and 12 protrude beyond the one surface 3a, the solid electrolyte When fixing capacitor block B by soldering etc., the leads 10 and 12 may be misaligned.
There is a possibility that it will not be possible to accurately connect the printed wiring portion on the circuit board. On the other hand, when the bent leads 10 and 12 are housed in the recess 7, there is no risk of displacement, and they can be stably fixed on the circuit board.

In this embodiment, the leads 10 and 12 are formed into a flat plate shape, but in another embodiment, the leads 10 and 12 may be shaped into a cylinder and cut along a plane perpendicular to the axis. In yet another embodiment, solder may be embedded in the recess 7. Furthermore, the recess 7 may be formed in the form of a groove extending into the adjacent surface. By doing so, machining of the recess 7 becomes easier.

FIG. 6 shows a state in which a plurality of solid electrolytic capacitor blocks B are mounted on a circuit board. Solid electrolytic capacitor block B is placed on printed wiring portion 11 of circuit board 9 with leads 10 and 12 in contact with each other, and fixed by soldering or the like. At this time, the connecting portion 5 between the one surface 3a where the leads 10 and 12 are exposed and the surface 3b continuous to the one surface 3a is formed into a planar shape by cutting out the intersection 5a of the one surface 3a and the surface 3b. This prevents molten solder from flowing into the adjacent solid electrolytic capacitor block B. In other words, the leads of another adjacent solid electrolytic capacitor block B are prevented from being erroneously connected by molten solder. Therefore, when mounting a plurality of solid electrolytic capacitor blocks B on the circuit board 9, it is not necessary to leave a gap between them, so that the circuit necessary for mounting the solid electrolytic capacitor blocks B Less space is required on the board 9.

In this embodiment, the connecting portion 5 is formed by cutting into a planar shape, but the connecting portion 5 may be formed by cutting into a curved shape or other shapes.

FIG. 7 is a front view of the container 2, FIG. 8 is a side view thereof, and FIG. 9 is a sectional view taken along the cutting plane line - in FIG. 7. The container 2 has a generally rectangular shape and has edges 6a, 6b, 6c arranged in a frame shape around the periphery of the rectangular bottom 4, and two adjacent sides 1a, 1b are open. It has a shape. Edge 6
A notch 8 is formed at a portion where the outer surfaces of a and 6b are connected. The tip 10a of the flat lead 10 is embedded from the vicinity of the notch 8 of the edge 6b to the center of the edge 6a, and the tip 10a is partially exposed at the notch 8. On the edge 6c side of the edge 6b, there is a tip 12 of a flat lead 12.
a passes through the edge 6b, reaches the bottom surface 4, and is fixed. A capacitor element 14 is housed in such a container 2 as shown in FIG. The capacitor element 14 has a flat plate shape, and a cathode section 16 is formed on its outer surface, and an anode lead wire 18 is led out from one corner of the cathode section 16. The cathode portion 16 is connected to the tip 12a of the lead 12 by, for example, soldering, and the anode lead wire 18 is connected to the tip 12a of the lead 12.
0, and is welded to the tip 10a of the lead 10 exposed at the notch 8. In this example, the notch 8 is formed by the leads 10 and 12.
It also has the meaning of a connecting portion 5 formed by cutting out one surface where is exposed and a surface connected to that one surface.

Such a solid electrolytic capacitor B is manufactured by the following procedure. First, as shown in FIG. 11, a lead frame 21 is prepared in which a large number of pairs of leads 10 and 12 are formed at intervals on a band-shaped support 20.

Next, as shown in FIG.
A container 2 made of thermoplastic resin, for example, polyphenylsulfone resin, is formed at the tip portions 10a and 10b of. Furthermore, a large number of capacitor elements 14 having anode lead wires 18 are manufactured. This capacitor element 1
4 is each anode lead wire 1 as shown in FIG.
8 is welded and supported on a band-shaped support 24. The arrangement interval of each capacitor element 14 is the 12th
The intervals are made to match the arrangement intervals of the containers 2 shown in the figure. Next, as shown in FIG.
is connected to the lead 12 with a conductive bonding agent such as solder, and the anode lead wire 18 is connected to the lead 10 by welding. The anode lead wire is cut after welding. Next, the leads 10 and 12 are cut to an appropriate length.

Finally, a plurality of solid electrolytic capacitors B1, B2..., Bn formed by the above method are prepared, and a container 2 is prepared.
The edges 6a, 6b, 6c of the other container 2a are connected so as to be in contact with the bottom surface 4 of the other container 2a (see FIG. 2), and an appropriate amount of resin is injected from the side 1b where the top is open.
A plurality of temporary solid electrolytic capacitors B1, B2...,
Filling for Bn element coating and capacitor junctions is performed.

In this way, solid electrolytic capacitor block B is completed. In the solid electrolytic capacitor block B having such a configuration, by forming a plurality of individual solid electrolytic capacitors B1, B2,..., Bn in series, the filling of each solid electrolytic capacitor B1, B2,..., Bn can be easily performed. There is no need to do it separately, which improves productivity. Furthermore, since individual solid electrolytic capacitors B1, B2,..., Bn can be bonded at the same time, there is no need to cover each solid electrolytic capacitor B1, B2,..., Bn with synthetic resin. , miniaturization can be achieved. In the present invention, in addition to the open side 1a that the container 2 comes into contact with, another side 1b is also open, making it easier to inject the resin and making it possible to cover the elements and bond each capacitor at the same time. A well-shaped solid electrolytic capacitor block could be formed without increasing the size.

FIG. 15 is a plan view of another solid electrolytic capacitor block B of the present invention. This embodiment is similar to the previous embodiment, and corresponding parts are provided with the same reference numerals. In this embodiment, leads 28, 30 are provided on both sides of the container 2, and a notch 8a is provided in the center of the edge 6a. An anode lead wire 18a is drawn out from the center of the side edge of the capacitor element 14. The solid electrolytic capacitor block B of this embodiment can also be used as a type having leads 28 and 30 while being cut off from the band-shaped support 20a, or can be used as a chip type by bending the separated leads. .

Since the leads 28 and 30 are formed on different surfaces of the container 2a, it is easy to mount it on a flexible printed wiring board, for example.

FIG. 16 is a sectional view of another embodiment of the present invention. In the above-mentioned embodiment, as shown in FIG. 9, the lead 12 passes in a straight line approximately at the center of the edge 6b, so the depth h of the portion where the capacitor element 14 is accommodated in the container 2 is equal to the depth of the edge 6b. However, in this embodiment, by bending the tip end 12a of the lead within the edge 6b, the depth H of the housing portion of the capacitor element 14 can be made deeper than h. . The same applies to the lead 10.

FIG. 17 is a perspective view of another embodiment of the solid electrolytic capacitor block B of the present invention. In the above-described embodiment, the connecting portion 5 was formed by cutting out only one portion, but depending on the arrangement in which the plurality of solid electrolytic capacitor blocks B are installed on the substrate 9, the connecting portion 5 is formed by cutting out only one portion.
As shown in FIG. 7, it may be formed by cutting out the entire circumference of the surface where a large number of leads 10 and 12 are exposed.
Alternatively, the connecting portions 5 may be cut out at two or three locations. Alternatively, as yet another embodiment, a solid material can be formed by cutting out a portion of the surface opposite to the surface where a large number of leads 10 and 12 are exposed, and which is connected to either the lead 10 side or the lead 12 side. The polarity display of the electrolytic capacitor block B may be omitted.

FIG. 18(1) is a front view of another embodiment of the leads 10, 12. Solid electrolytic capacitor block B
When mounting the solid electrolytic capacitor block B on the circuit board 9, the circuit board 9 has a plurality of holes, and the leads 10 and 12 are inserted into the holes.
If the configuration is such that the first
8. As shown in FIG. 1, the ends 34 of the leads 10, 12 are cut at an angle other than 90 degrees with respect to the direction in which the leads 10, 12 extend. This makes it easier to insert the leads 10, 12 into the holes of the circuit board, especially when many of the leads 10, 12 are exposed. Furthermore, this shape is suitable for the lead wire 1 as shown in FIG.
It is easier to manufacture and maintain the shape than the shape formed by the cut surfaces 36a and 36b such that the tip 36 of 0 and 12 is tapered, and the shape formed by the tip 38 curved.

In the above embodiment, the capacitor element 14 includes:
Although a plate-shaped one was used, a disc-shaped one can also be used.

As described above, according to the present invention, since a plurality of single molded containers are combined, the shape is uniform, and no additional mold covering is required. In addition, since inspection can be performed at the stage of assembling blocks, it is possible to prevent defects from being mixed in, and since the blocks are assembled in a container, there is no subsequent deterioration and the yield as blocks is improved. Furthermore, since the leads are accommodated in the recesses formed on the surface where the leads are exposed, the electronic component block can be stably fixed on the circuit board.
Furthermore, since the connecting portion between one surface where the lead is exposed and the remaining surface connected to that surface is cut out, when multiple electronic component blocks are mounted, molten solder can be applied to adjacent electronic component blocks. This prevents connections from being accidentally connected.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a perspective view of solid electrolytic capacitors B1 and B2, Fig. 3 is a perspective view of solid electrolytic capacitor block B, and Fig. 4 is a perspective view of solid electrolytic capacitor block B.
5 and 5 are enlarged perspective views of the vicinity of the leads 10, FIG. 6 is a view showing a plurality of solid electrolytic capacitor blocks mounted on the board 9, FIG. 7 is a front view of the container 2, and FIG. A side view of the container 2, FIG. 9 is a sectional view taken from the cutting plane line - in FIG. 7, and FIG.
11 is a front view of the lead frame 21, and FIG. 12 shows the state in which the container 2 is formed on the leads 10 and 12 of the lead frame 21. 13 is a front view showing the capacitor element 14 supported on the strip support 22, and FIG. 14 is the strip support 20 of the lead frame 21 in FIG. 12.
FIG. 15 is a front view of another embodiment of the present invention, and FIG. 16 is a sectional view of another embodiment of the present invention. FIG. 17 is a perspective view of another embodiment of the present invention, and FIG. 18 is a perspective view of another embodiment of the leads 10, 12. 2, 2a... Container, 3a... One surface, 3b...
Surface, 5...Connection part, 5a...Intersection position, 10,
12, 28, 30...Lead, 14...Capacitor element, B, B1, B2,..., Bn...Solid electrolytic capacitor.

Claims (1)

[Claims for Utility Model Registration] (1) An electronic component element is housed in a rectangular container with two adjacent sides open, and a lead to be connected to the electronic component element is partially embedded in the container. the one open side of the plurality of containers faces and abuts the side opposite to the one open side of an adjacent container, and the containers are filled with synthetic resin and the adjacent containers are filled with synthetic resin. A structure of an electronic component block characterized by a fixed structure. (2) The electronic component is formed in a synthetic resin container so that its outer shape is roughly rectangular, and the leads of the electronic component element are exposed on one surface of the container almost flush with the surface; Utility model registration claim 1, characterized in that the connecting portion between the remaining surface that is continuous with the one surface and the one surface is formed by cutting out the intersection position of the one surface and the remaining surface. Structure of the electronic component block described in Section 1. (3) A recess is formed near the base of the lead on one surface of the container where the lead is bent and the lead is exposed, and the lead is stored in the recess so as to be substantially parallel to the one surface. The structure of an electronic component block according to claim 1 of the utility model registration claim. (4) The structure of the electronic component block according to claim 1, wherein the lead extends protruding from the one surface of the container and is formed in a tapered shape.