JPH0241654Y2 - - Google Patents

Info

Publication number

JPH0241654Y2

JPH0241654Y2 JP8320485U JP8320485U JPH0241654Y2 JP H0241654 Y2 JPH0241654 Y2 JP H0241654Y2 JP 8320485 U JP8320485 U JP 8320485U JP 8320485 U JP8320485 U JP 8320485U JP H0241654 Y2 JPH0241654 Y2 JP H0241654Y2

Authority

JP

Japan

Prior art keywords

light emitting

light

emitting display

substrate

hole

Prior art date

1985-05-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
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• 239000011159 matrix material Substances 0.000 claims description 22
• 239000000758 substrate Substances 0.000 claims description 22
• 229920005989 resin Polymers 0.000 claims description 21
• 239000011347 resin Substances 0.000 claims description 21
• 238000007789 sealing Methods 0.000 claims description 14
• 239000013013 elastic material Substances 0.000 claims 1
• 230000007547 defect Effects 0.000 description 5
• 230000000694 effects Effects 0.000 description 5
• 239000000463 material Substances 0.000 description 4
• 238000004519 manufacturing process Methods 0.000 description 3
• 239000004593 Epoxy Substances 0.000 description 2
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 230000008901 benefit Effects 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• 239000003973 paint Substances 0.000 description 2
• 230000002093 peripheral effect Effects 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 229920003002 synthetic resin Polymers 0.000 description 2
• 239000000057 synthetic resin Substances 0.000 description 2
• 229920001187 thermosetting polymer Polymers 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 230000008602 contraction Effects 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 230000002950 deficient Effects 0.000 description 1
• 230000004907 flux Effects 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 230000006872 improvement Effects 0.000 description 1
• 230000001678 irradiating effect Effects 0.000 description 1
• 239000007788 liquid Substances 0.000 description 1
• 239000004570 mortar (masonry) Substances 0.000 description 1
• 238000005192 partition Methods 0.000 description 1
• 229920001084 poly(chloroprene) Polymers 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 229920002379 silicone rubber Polymers 0.000 description 1
• 239000004945 silicone rubber Substances 0.000 description 1