JPH0241591B2 - - Google Patents
Info
- Publication number
- JPH0241591B2 JPH0241591B2 JP5512082A JP5512082A JPH0241591B2 JP H0241591 B2 JPH0241591 B2 JP H0241591B2 JP 5512082 A JP5512082 A JP 5512082A JP 5512082 A JP5512082 A JP 5512082A JP H0241591 B2 JPH0241591 B2 JP H0241591B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- layer
- plating
- wire
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 59
- 238000000576 coating method Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 23
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 17
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 15
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 229910052725 zinc Inorganic materials 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 229910007567 Zn-Ni Inorganic materials 0.000 description 4
- 229910007614 Zn—Ni Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910001245 Sb alloy Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 241000080590 Niso Species 0.000 description 2
- 229910007565 Zn—Cu Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910007610 Zn—Sn Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 229940074439 potassium sodium tartrate Drugs 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512082A JPS58181888A (ja) | 1982-04-02 | 1982-04-02 | 銀被覆材料とその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5512082A JPS58181888A (ja) | 1982-04-02 | 1982-04-02 | 銀被覆材料とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58181888A JPS58181888A (ja) | 1983-10-24 |
| JPH0241591B2 true JPH0241591B2 (zh) | 1990-09-18 |
Family
ID=12989891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5512082A Granted JPS58181888A (ja) | 1982-04-02 | 1982-04-02 | 銀被覆材料とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58181888A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000062341A1 (fr) * | 1999-04-08 | 2000-10-19 | Shinko Electric Industries Co., Ltd. | Grille de connexion pour dispositif semi-conducteur |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS601853A (ja) * | 1983-06-17 | 1985-01-08 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
| JPS60201651A (ja) * | 1984-03-26 | 1985-10-12 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
| JP2009079250A (ja) * | 2007-09-26 | 2009-04-16 | Dowa Metaltech Kk | 最表層として銀合金層が形成された銅または銅合金部材およびその製造方法 |
| JP5879093B2 (ja) * | 2011-10-26 | 2016-03-08 | 株式会社フジクラ | コネクタの製造方法及び銀のめっき方法 |
| JP5767662B2 (ja) * | 2013-02-24 | 2015-08-19 | 古河電気工業株式会社 | 端子材とその製造方法およびそれを用いる端子の製造方法 |
| JP7395389B2 (ja) * | 2020-03-09 | 2023-12-11 | Ｄｏｗａメタルテック株式会社 | 銀めっき材およびその製造方法 |
-
1982
- 1982-04-02 JP JP5512082A patent/JPS58181888A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000062341A1 (fr) * | 1999-04-08 | 2000-10-19 | Shinko Electric Industries Co., Ltd. | Grille de connexion pour dispositif semi-conducteur |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58181888A (ja) | 1983-10-24 |
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