JPH0241578A - Chip parts check device - Google Patents

Abstract

PURPOSE:To stably discriminate the mounting state of chip parts by using distribution data of R, G, and B corresponding to the color of an electrode part peculiar to chip parts as the check object and comparing these distribution data with reference distribution data of three primary colors R, G, and B to discriminate the mounting state of chip parts. CONSTITUTION:X and Y coordinates (xm, ym) of the mounting position of chip parts 10, sizes wX and wY of chip parts, R, G, and B distribution data r0, g0, and b0 corresponding to the color of an electrode part 12 of chip parts 10, and an area S0 of the electrode part are registered in a CAD data memory 4. R, G, and B data 01 to 03 in RGB window image data memory 6 and R, G, and B distribution data r0, g0, and b0 of the electrode part 12 in the CAD data memory 4 are compared with each other by a comparator 7, and picture elements corresponding to the electrode part 12 of chip parts 10 in the window are extracted, and an extracted signal (p) is sent to an area calculating part 8. The value S0 of area data g6 of the electrode part 12 in the CAD data memory 4 and an area S sent from the area calculating part 8 are compared with each other by a discriminating part 9. Thus, the mounting state is stably discriminated.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a chip component inspection device, and particularly to a chip component inspection device that can inspect whether a chip component is correctly mounted in a predetermined position in an external appearance inspection of a mounted board. Regarding equipment.

[Conventional technology]

As a conventional technique, for example, Japanese Patent Application Laid-Open No. 60-23140
There is an inspection device as shown in Publication No. 0.

A conventional chip component inspection apparatus includes a test object mounting table, an illumination unit that irradiates light from at least two directions to the test object placed on the test object mounting table, and the test object mounting table. It is configured to include a photographing means disposed above and a comparison processing means for comparing and processing contrast information obtained by the photographing means.

Next, an inspection method using a conventional chip component inspection apparatus will be described in detail with reference to the drawings.

FIG. 6 is a perspective view showing a conventional example.

A printed circuit board 15 to which a minute chip component 14, which is an object to be inspected, is attached is fixed to an object to be inspected mounting table 13, and a predetermined light 17 is spot-irradiated onto the chip component 14 diagonally from above in four directions.

The chip component 14 is photographed by the ITV camera 18, and the contrast information of the photographed chip component 14 is compared with the reference contrast information of the same chip component 14 at an appropriate position, which is stored in advance, by a comparing means 19 composed of a computer. As shown in FIG. 7, by processing the X-direction density histogram and the X-direction density histogram, it can be determined whether the chip component 14, which is the component to be inspected, is correctly placed in a fixed position.

The X direction density histogram and the X direction density histogram shown in FIG. It is obtained by analyzing the X-direction component and Y-direction component of the pattern image B formed by light, and the protruding constant width portions 1+, lz, 13 that appear in the image density histogram are
．． 14 is the upper margin LI + the lower margin for the cream solder land (pad) of the chip component 14 shown in FIG. The data corresponds to degree 2 + left side margin L3r right side margin L4, and the width of It~14 obtained from the histogram is compared with the reference data.Whether the chip component 14 is in the fixed position or not. to judge.

[Problem to be solved by the invention]

The conventional inspection device described above compares the X-direction density histogram obtained from an image taken of the chip component with a spotlight and the density histogram of the chip component as a reference to determine whether the chip component is in a fixed position. 11 to l in the density histogram, which should be caused by the boundary between the chip component and the cream solder land (pad), due to the influence of surrounding electronic components and differences in light reflection due to the shape of the solder. A problem arises in which it is not possible to accurately capture the protruding parts of a certain width that determine The disadvantage was that it had to be adjusted accordingly.

[Means to solve the problem]

The chip component inspection device of the present invention includes a color television camera that images chip components on a mounted board.

The signals from the color television camera are divided into three primary colors (R, G.

B) An A/D converter that separately converts into digital signals, an RGB image memory that stores the digital signals as R, G, and B images separately, and CAD data related to the chip to be inspected is registered in advance. A CAD data memory is used to generate a window that accurately matches the outline of the mounted chip component using the data in the CAD data memory, and each window area of R2O and B is used as basic data for inspection from the RGB image memory. a window image extraction unit that extracts image data only within the window; an R, GB window image memory that stores R, G, and B window image data extracted by the window image data extraction unit; and the RGB window image memory. The color distribution vector determined from the data and the CA of the CAD data memory
a color comparison unit that compares the angle formed by the color distribution vector determined from the D data and the respective sizes to extract pixels corresponding to the electrode portion of the chip component within the window area;
an area calculation section that calculates the area of the electrode section in the window region extracted from the color comparison section; and a comparison between the area of the electrode section in the window region calculated by the area calculation section and CAD data in the CAD data memory. and a determination unit that outputs a determination result of a chip component mounting misalignment or non-mounting.

〔Example〕

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a block diagram showing one embodiment of the present invention.

First, the video signal d1.corresponds to the color ratio, G, B, of the image of the chip component to be inspected taken by the color television camera 1. d2. d3 is converted into digital signals e1 + e2 + e3 by the A/D converter 2, and each is stored in the RGB image memory 3 as 83 images.

On the other hand, as shown in Figure 2, which is an explanatory diagram of the coordinate system and data in the CAD data memory, an X-Y coordinate system is set on the image plane, and the X- and Y-axes are Xw on the mounting board, respectively.
It is parallel to the XW axis and Yw axis of the Yw coordinate system, and is in any state of the mounted chip component 10.

The CAD data of the chip component to be inspected is registered in the CAD data memory 4.

The CAD data includes the X and Y coordinates (Xm, Ym) of the mounting position of the chip component 10 that should be on the image plane and the sizes WX and W of the chip component, which are calculated in advance.
Y, RGB distribution data ro go t)o corresponding to the colors of the electrode portion 120 of the chip component 10 shown in FIG. 3, which is an explanatory diagram of R, GB distribution data, and the area So of the electrode portion.

The above is the operation in the preprocessing stage of the present invention.

After pre-processing, the window image extraction unit 5 extracts the X and Y positions of the chip parts to be mounted 1° from the CAD data memory 4.
Read the data g+ of the coordinates (xml Ym) and the data g2 of the chip size (WX, W y), and calculate the outline of the chip component 10 when it is mounted accurately as shown in FIG. 4, which is an explanatory diagram of the window. R, , G, B image data f, , f, , f3 generated by the data h of window W that coincides with , and only within the area of window W.
are stored in the GB window image memory 6 separately for R, G, and B. Here, the window area can be determined by the first equation.

Next, the color comparator 7 compares the G, G, and B data 0. ．． 02,03 and CAD
RGB distribution data of the electrode section 12 of the data memory 4. +
Compare g O+ bO and chip parts 1 in Quind.
The pixel corresponding to the electrode portion of 0 is extracted and the extracted signal p is sent to the area calculation unit 8.

Here, the processing performed by the color comparison section 7 will be described in detail.

The color comparison unit 7 extracts the GB data 01, 0□, 0 . -It reads out items in pairs. The value of the data just read is ' * g *
Suppose that it was b. ' + g + b to determine the vector C=(r, g, b) shown in FIG. 3. At the same time, the RGB distribution data g3. Read g4+gs and its value 'O+gO+bo
Determine the horizontal vector Co"' (rO+gO+bO).

From the vectors C and co, the magnitude IC1,1col and the angle ψ formed by C and co shown in FIG. 2 are calculated, and a preset threshold TN; T9. When comparing the following equations 2 and 3 at the same time, the pixel corresponds to the electrode section 6 and the output value p is 1, otherwise p is set to 0 and sent to the area calculation section 8.

Next, in the area calculation section 8, a counter operates when the output value p from the color comparison section 7 is 1, and is incremented every time a pixel corresponding to the electrode section 12 is extracted. When color comparison is completed for all pixels within the area of window W, the value of the counter is .

This corresponds to the area S of the electrode part inside the window shown in FIG. 5, which is an explanatory diagram of the area of the electrode part inside the window. Then, the value q of this counter is sent to the determination section 9.

Finally, the determination section 9 determines the electrode section 12 in the CAD data memory 4.
The value So of the area data g6 is compared with the area S sent from the area calculating section 8. The allowable amount of positional deviation of the chip component 10 is set in advance as a threshold value T8 regarding the area, and it is assumed that the mounting position is passed if the fourth formula % formula % (41) is satisfied, and that a positional deviation has occurred if it is not satisfied. If it is close to 0, it is determined that the device is not implemented and has failed, and the determination result t is output.

〔Effect of the invention〕

The chip component inspection apparatus of the present invention uses the distribution data of R2O, B corresponding to the color of the electrode part specific to the chip component to be inspected and compares it with the distribution data of the three primary colors R1G, B serving as a reference. By employing a method of determining the mounting state of chip components, the problem of unstable determination results due to lighting, reflection of light from surrounding electronic components, shadows, etc., can be eliminated using density information alone. Furthermore, from the image taken of the chip component, processing is performed using the GB color distribution using information only within the window that matches the outline of the chip component in a normal mounted state, so even if three primary color data are used, the amount of information is small and the processing speed is high. This has the effect of making it possible to perform a variety of processing.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram of a coordinate system and the inside of a CAD data memory. Fig. 3 is an explanatory diagram of RGB distribution data, Fig. 4 is an explanatory diagram of the window, Fig. 5 is an explanatory diagram of the electrode area within the window, Fig. 6 is a perspective view showing an example of the conventional example, and Fig. 7 is an explanatory diagram of the window. Density histogram of the pattern shown in Figure 6, Figure 8 (a), (b
) is a schematic diagram of imaging. 1...Color TV camera, 2...A/
Dffi exchange IS, 3...808 image memory, 4
... CAD data memory, 5 ... Wind image extraction section, 6 ... GB window image memory, 7 ... Color comparison section, 8 ... ... Area calculation section, 9 ... Judgment section, 10 ... Chip component, 11 ... Pad, 12 ......
Electrode part, 13...°°. Test object mounting table, 14...Chip parts, 15.
...Printed circuit board, 16...Cream solder land (pad), 17...Spot light, 18
...ITV camera, 19...Comparison means, dl, d2. d3...R2O, B video signal,
el, e2゜e3...R, G, B digital signal, fl, f2. f3...B, GB window image data, gl...Chip component mounting position X, Y
Coordinates, g2... Chip component size, g 3r
g 41 g s...R, GB distribution data, g
6...electrode area, h...-window data, 0+, Oz, 03...RGB for one pixel
Window image data, p...Color comparison section output value, q...Counter value, t...Judgment result. Agent Patent Attorney Susumu Uchihara 1 Figure

Claims (1)

[Claims] A color TV camera takes an image of the chip components on the mounted board, and the signals from the color TV camera are converted into three primary colors (R, G).
,B) an A/D converter that separately converts into digital signals;
An RGB image memory that stores the digital signals as R, G, and B images separately, a CAD data memory in which CAD data related to the chip to be inspected is registered in advance, and an accurate a window image extracting unit that generates a window that matches the contour of a chip component mounted on the board and extracts image data only within each of the R, G, and B window areas, which serves as basic data for inspection from the RGB image memory; An RGB window image memory that stores R, G, and B window image data extracted by the window image data extraction unit, and a color distribution vector determined from the data of the RGB window image memory and CA of the CAD data memory.
a color comparison unit that compares the angle formed by the color distribution vector determined from the D data and the respective sizes to extract pixels corresponding to the electrode portion of the chip component within the window area;
an area calculation section that calculates the area of the electrode section in the window region extracted from the color comparison section; and a comparison between the area of the electrode section in the window region calculated by the area calculation section and CAD data in the CAD data memory. What is claimed is: 1. A chip component inspection device comprising: a determination unit that outputs a determination result of a mounting deviation of a chip component and an unmounted chip component.