JPH0241446U - - Google Patents
Info
- Publication number
- JPH0241446U JPH0241446U JP12050688U JP12050688U JPH0241446U JP H0241446 U JPH0241446 U JP H0241446U JP 12050688 U JP12050688 U JP 12050688U JP 12050688 U JP12050688 U JP 12050688U JP H0241446 U JPH0241446 U JP H0241446U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed
- lead frame
- frame assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Description
第1図aは本考案の樹脂封止型半導体装置の製
造工程を説明するための断面図、第1図bは本考
案の樹脂封止型半導体装置の平面図、第2図は本
考案の他の変形例を示し、同図aは、その断面図
、同図bは、その平面図、第3図a,bは本考案
のさらに他の変形例をそれぞれ示す部分断面図、
第4図は、従来の樹脂封止型半導体装置に製造工
程を説明するための断面図である。
1…リード、2…チツプ載置部、3…半導体チ
ツプ、4…金属細線、5…立上り部、6…水平支
持部、7…取付穴、8…リードフレーム、9…樹
脂封止用金型、10…上金型、11…下金型、1
2,16,17…樹脂封止部、13…取付穴、1
4…取付穴用凸部、15a,15b…凸部、16
…キヤビテイ、19,20,22,23…凹部、
21…切欠部。
FIG. 1a is a cross-sectional view for explaining the manufacturing process of the resin-sealed semiconductor device of the present invention, FIG. 1b is a plan view of the resin-sealed semiconductor device of the present invention, and FIG. 3A is a sectional view thereof, FIG. 3B is a plan view thereof, and FIGS. 3A and 3B are partial sectional views each showing still another modification of the present invention,
FIG. 4 is a cross-sectional view for explaining the manufacturing process of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1...Lead, 2...Chip placement part, 3...Semiconductor chip, 4...Metal thin wire, 5...Rising part, 6...Horizontal support part, 7...Mounting hole, 8...Lead frame, 9...Mold for resin sealing , 10...upper mold, 11...lower mold, 1
2, 16, 17...Resin sealing part, 13...Mounting hole, 1
4...Protrusion for mounting hole, 15a, 15b...Protrusion, 16
...Cavity, 19, 20, 22, 23...Recess,
21...Notch.
Claims (1)
部から一方の側へ外部リードが延在し、他方の側
へは前記チツプ載置部から上方への立上り部が形
成され、この立上り部からさらに前記チツプ載置
部に平行に延びる水平支持部を備えたリードフレ
ーム組立体と、このリードフレーム組立体を樹脂
封止用金型のキヤビテイ内に水平かつ空間的に支
持するために、前記リードフレーム組立体の水平
支持部の両面に当接させる前記金型に設けた凸部
によつて形成された凹部を有するとを備えたこと
を特徴とする樹脂封止型半導体装置。 2 前記樹脂封止部に形成された凹部は、一対の
小孔であることを特徴とする第1請求項に記載の
樹脂封止型半導体装置。 3 前記樹脂封止部に形成された凹部は、表面か
ら内部に向つて縮径する円錐形状であることを特
徴とする第2請求項に記載の樹脂封止型半導体装
置。 4 前記樹脂封止部に形成された凹部は、底面が
半球状であることを特徴とする第2請求項に記載
の樹脂封止型半導体装置。 5 前記樹脂封止部に形成された凹部は、一方が
小孔であり、他方が前記樹脂封止部の角に形成さ
れた切欠部であることを特徴とする第1請求項に
記載の樹脂封止型半導体装置。[Claims for Utility Model Registration] 1. A device having a semiconductor chip mounting portion, with external leads extending from the chip mounting portion to one side, and external leads extending upward from the chip mounting portion to the other side. A lead frame assembly is provided with a horizontal support portion formed with a horizontal supporting portion extending parallel to the chip mounting portion from the rising portion, and the lead frame assembly is placed horizontally and in a space within a cavity of a mold for resin sealing. and a recess formed by a projection provided in the mold that is brought into contact with both sides of the horizontal support portion of the lead frame assembly to support the lead frame assembly. Stop type semiconductor device. 2. The resin-sealed semiconductor device according to claim 1, wherein the recess formed in the resin-sealed portion is a pair of small holes. 3. The resin-sealed semiconductor device according to claim 2, wherein the recess formed in the resin-sealed portion has a conical shape whose diameter decreases from the surface toward the inside. 4. The resin-sealed semiconductor device according to claim 2, wherein the recess formed in the resin-sealed portion has a hemispherical bottom surface. 5. The resin according to claim 1, wherein one of the recesses formed in the resin sealing part is a small hole and the other is a notch formed at a corner of the resin sealing part. Sealed semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12050688U JPH0241446U (en) | 1988-09-14 | 1988-09-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12050688U JPH0241446U (en) | 1988-09-14 | 1988-09-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0241446U true JPH0241446U (en) | 1990-03-22 |
Family
ID=31366677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12050688U Pending JPH0241446U (en) | 1988-09-14 | 1988-09-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0241446U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162550A (en) * | 1990-10-26 | 1992-06-08 | Nec Corp | Resin-sealed semiconductor device and manufacture thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6132434A (en) * | 1984-07-24 | 1986-02-15 | Sanken Electric Co Ltd | Manufacture of resin molded semiconductor device |
-
1988
- 1988-09-14 JP JP12050688U patent/JPH0241446U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6132434A (en) * | 1984-07-24 | 1986-02-15 | Sanken Electric Co Ltd | Manufacture of resin molded semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162550A (en) * | 1990-10-26 | 1992-06-08 | Nec Corp | Resin-sealed semiconductor device and manufacture thereof |
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