JPH024142B2 - - Google Patents
Info
- Publication number
- JPH024142B2 JPH024142B2 JP55064117A JP6411780A JPH024142B2 JP H024142 B2 JPH024142 B2 JP H024142B2 JP 55064117 A JP55064117 A JP 55064117A JP 6411780 A JP6411780 A JP 6411780A JP H024142 B2 JPH024142 B2 JP H024142B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- heating
- heating block
- dual
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/0711—
-
- H10W72/073—
-
- H10W72/07337—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6411780A JPS56161648A (en) | 1980-05-16 | 1980-05-16 | Heating block for pellet fitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6411780A JPS56161648A (en) | 1980-05-16 | 1980-05-16 | Heating block for pellet fitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56161648A JPS56161648A (en) | 1981-12-12 |
| JPH024142B2 true JPH024142B2 (OSRAM) | 1990-01-26 |
Family
ID=13248796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6411780A Granted JPS56161648A (en) | 1980-05-16 | 1980-05-16 | Heating block for pellet fitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56161648A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0617286Y2 (ja) * | 1984-10-18 | 1994-05-02 | 日本電気株式会社 | ヒ−タブロック |
| JPS61176126A (ja) * | 1985-01-31 | 1986-08-07 | Nec Corp | ダイボンデイング装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54768U (OSRAM) * | 1977-06-06 | 1979-01-06 | ||
| JPS5527619A (en) * | 1978-08-17 | 1980-02-27 | Mitsubishi Electric Corp | Die bonding device |
| JPS5548938A (en) * | 1978-10-05 | 1980-04-08 | Toshiba Corp | Manufacturing of semiconductor device |
-
1980
- 1980-05-16 JP JP6411780A patent/JPS56161648A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56161648A (en) | 1981-12-12 |
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