JPH0241429U - - Google Patents

Info

Publication number
JPH0241429U
JPH0241429U JP1988120507U JP12050788U JPH0241429U JP H0241429 U JPH0241429 U JP H0241429U JP 1988120507 U JP1988120507 U JP 1988120507U JP 12050788 U JP12050788 U JP 12050788U JP H0241429 U JPH0241429 U JP H0241429U
Authority
JP
Japan
Prior art keywords
bent
chip
resin
periphery
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988120507U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988120507U priority Critical patent/JPH0241429U/ja
Publication of JPH0241429U publication Critical patent/JPH0241429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1988120507U 1988-09-14 1988-09-14 Pending JPH0241429U (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988120507U JPH0241429U (enFirst) 1988-09-14 1988-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988120507U JPH0241429U (enFirst) 1988-09-14 1988-09-14

Publications (1)

Publication Number Publication Date
JPH0241429U true JPH0241429U (enFirst) 1990-03-22

Family

ID=31366679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988120507U Pending JPH0241429U (enFirst) 1988-09-14 1988-09-14

Country Status (1)

Country Link
JP (1) JPH0241429U (enFirst)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223135A (ja) * 1984-04-19 1985-11-07 Nec Corp 樹脂封止型半導体装置
JPS6249242B2 (enFirst) * 1979-12-17 1987-10-19 Earth Chemical Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6249242B2 (enFirst) * 1979-12-17 1987-10-19 Earth Chemical Co
JPS60223135A (ja) * 1984-04-19 1985-11-07 Nec Corp 樹脂封止型半導体装置

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