JPS61127634U - - Google Patents
Info
- Publication number
- JPS61127634U JPS61127634U JP1152985U JP1152985U JPS61127634U JP S61127634 U JPS61127634 U JP S61127634U JP 1152985 U JP1152985 U JP 1152985U JP 1152985 U JP1152985 U JP 1152985U JP S61127634 U JPS61127634 U JP S61127634U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor
- mount
- semiconductor device
- hanging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1152985U JPS61127634U (enFirst) | 1985-01-29 | 1985-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1152985U JPS61127634U (enFirst) | 1985-01-29 | 1985-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61127634U true JPS61127634U (enFirst) | 1986-08-11 |
Family
ID=30493733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1152985U Pending JPS61127634U (enFirst) | 1985-01-29 | 1985-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127634U (enFirst) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724555A (en) * | 1980-07-22 | 1982-02-09 | Nec Kyushu Ltd | Semiconductor device |
-
1985
- 1985-01-29 JP JP1152985U patent/JPS61127634U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724555A (en) * | 1980-07-22 | 1982-02-09 | Nec Kyushu Ltd | Semiconductor device |