JPH0240269B2 - - Google Patents

Info

Publication number
JPH0240269B2
JPH0240269B2 JP61099014A JP9901486A JPH0240269B2 JP H0240269 B2 JPH0240269 B2 JP H0240269B2 JP 61099014 A JP61099014 A JP 61099014A JP 9901486 A JP9901486 A JP 9901486A JP H0240269 B2 JPH0240269 B2 JP H0240269B2
Authority
JP
Japan
Prior art keywords
resin
weight
coating film
polyol
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61099014A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62253675A (ja
Inventor
Kazumasa Eguchi
Fumio Nakaya
Shinichi Wakita
Hisatoshi Murakami
Tsunehiko Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP9901486A priority Critical patent/JPS62253675A/ja
Publication of JPS62253675A publication Critical patent/JPS62253675A/ja
Publication of JPH0240269B2 publication Critical patent/JPH0240269B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP9901486A 1986-04-28 1986-04-28 導電塗料 Granted JPS62253675A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9901486A JPS62253675A (ja) 1986-04-28 1986-04-28 導電塗料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9901486A JPS62253675A (ja) 1986-04-28 1986-04-28 導電塗料

Publications (2)

Publication Number Publication Date
JPS62253675A JPS62253675A (ja) 1987-11-05
JPH0240269B2 true JPH0240269B2 (enrdf_load_stackoverflow) 1990-09-11

Family

ID=14235274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9901486A Granted JPS62253675A (ja) 1986-04-28 1986-04-28 導電塗料

Country Status (1)

Country Link
JP (1) JPS62253675A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
JPH03173007A (ja) * 1989-12-01 1991-07-26 Kao Corp 導電性ペースト及び導電性塗膜

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516449A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Semiconductor device
JPS5537848A (en) * 1978-09-08 1980-03-17 Hitachi Ltd Method of clamping secondary conductor for induction motor
JPS6028160B2 (ja) * 1981-12-07 1985-07-03 三井東圧化学株式会社 導電回路の形成方法
JPS6058268A (ja) * 1983-09-08 1985-04-04 Tsudakoma Ind Co Ltd ロ−ラ接触式液剤付与装置のモ−タ制御方法
JPS6131454A (ja) * 1984-07-23 1986-02-13 Tatsuta Electric Wire & Cable Co Ltd 導電性銅ペ−スト組成物

Also Published As

Publication number Publication date
JPS62253675A (ja) 1987-11-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees