JPH0239968B2 - - Google Patents
Info
- Publication number
- JPH0239968B2 JPH0239968B2 JP60053593A JP5359385A JPH0239968B2 JP H0239968 B2 JPH0239968 B2 JP H0239968B2 JP 60053593 A JP60053593 A JP 60053593A JP 5359385 A JP5359385 A JP 5359385A JP H0239968 B2 JPH0239968 B2 JP H0239968B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding material
- sheet
- printed circuits
- insulating board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012778 molding material Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000004898 kneading Methods 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
産業上の利用分野
本発明は、電気電子機器などの電気絶縁材とし
て使用される印刷回路用絶縁板の製造法に関す
る。
従来の技術
印刷回路用絶縁板は、紙あるいは各種繊維の
布、マツト等のシート状基材にフエノール樹脂、
メラミン樹脂、ポリエステル樹脂、エポキシ樹
脂、シリコン樹脂等の熱硬化性樹脂を含浸乾燥し
て得たプリプレグを複数枚積み重ね、これを加熱
加圧成形して製造している。
発明が解決しようとする問題点
しかし、上記シート状基材は、パルプやガラス
繊維等を紙、ガラス布等に加工したものであり、
その製造工数が多くかかり、コスト高となる欠点
がある。これを改善するために、パルプ、ガラス
繊維等の充填材と樹脂を混合混練してなる粒状乃
至粉状の成形材料を射出成形や圧縮成形して板状
の成形品を得、これを印刷回路用絶縁板として使
用することも提案されているが、板層が薄い場
合、曲げ強さ等の強度が十分でなくまだ広く実用
化されていない。
本発明は、低コストで機械的強度を十分に保持
した印刷回路用絶縁板を提供することを目的とす
る。
問題点を解決するための手段
上記目的を達成するために、本考案は、シート
状基材に樹脂を含浸乾燥したプリプレグと、充填
材と樹脂を混合混練してなる粒状乃至粉状の成形
材料とを用意し、前記成形材料を中心層に位置す
るようにプリプレグで挾んで加熱加圧することを
特徴とするものである。
作 用
本発明では、中心層が成形材料で構成されるた
め、その分シート状基材の使用量が減つて低コス
トとなり、絶縁板の機械的強度も両表面に配置さ
れたシート状基材で十分に確保される。
実施例
本発明で使用するシート状基材とは、紙、ガラ
ス布、綿布、ポリエステル布などであり、これに
フエノール樹脂、メラミン樹脂、ポリエステル樹
脂、エポキシ樹脂、シリコン樹脂等の熱硬化性樹
脂を含浸乾燥してプリプレグとする。また、粒状
乃至粉状成形材料は、ガラス繊維、ガラス粉、ク
レー等の無機充填材、パルプ、木粉等の有機充填
材と前記熱硬化性樹脂を混合混練して得たもので
ある。
次に本発明の一実施例を説明する。
実施例 １
ガラス繊維（長さ３mm）50重量部とエポキシ樹
脂（シエル化学製、商品名エピコート1001）40重
量部、硬化剤としてジシアンジアミド７重量部、
触媒として２−エチル−４メチルイミダゾール
0.5重量部からなる樹脂組成物とを通常の方法で
混合混練して成形材料を得た。一方、前記樹脂組
成物をメチルエチルケトンに溶解して固形分50％
のワニスとし、これをガラス布に含浸して140℃
で５分間乾燥しプリプレグを得た。
上記用意した成形材料をプリプレグで挾み金型
内で加熱加圧成形して印刷回路用絶縁板を得た。
比較例 １
実施例１における成形材料のみを用いて金型内
で加熱加圧成形し、実施例１と同一厚さの印刷回
路用絶縁板を得た。
第１表に、実施例１、比較例１で得た絶縁板の
性能を示す。
INDUSTRIAL APPLICATION FIELD The present invention relates to a method for manufacturing an insulating board for printed circuits used as an electrical insulating material for electrical and electronic equipment. Conventional technology Insulating boards for printed circuits are made by using a sheet-like base material such as paper, cloth made of various fibers, matte, etc., and a phenol resin,
It is manufactured by stacking a plurality of prepregs obtained by impregnating and drying thermosetting resins such as melamine resin, polyester resin, epoxy resin, silicone resin, etc., and molding them under heat and pressure. Problems to be Solved by the Invention However, the above-mentioned sheet-like base material is made by processing pulp, glass fiber, etc. into paper, glass cloth, etc.
The drawback is that it requires a large number of manufacturing steps and is expensive. In order to improve this, a granular or powdery molding material made by mixing and kneading a filler such as pulp or glass fiber with a resin is injection molded or compression molded to obtain a plate-shaped molded product, and this is used as a printed circuit board. It has also been proposed to be used as an insulating board for industrial use, but when the board layer is thin, the strength such as bending strength is insufficient and it has not yet been widely put into practical use. An object of the present invention is to provide an insulating board for printed circuits that is low in cost and has sufficient mechanical strength. Means for Solving the Problems In order to achieve the above object, the present invention provides a granular or powdery molding material made by mixing and kneading a sheet-like base material impregnated with a resin and dried prepreg, a filler and a resin. The method is characterized in that the molding material is sandwiched between prepregs so as to be located in the center layer, and heated and pressurized. Effects In the present invention, since the center layer is composed of a molding material, the amount of sheet-like base material used is reduced accordingly, resulting in lower costs, and the mechanical strength of the insulating plate is improved by using the sheet-like base materials disposed on both surfaces. will be sufficiently secured. Examples The sheet-like substrate used in the present invention is paper, glass cloth, cotton cloth, polyester cloth, etc., and thermosetting resin such as phenol resin, melamine resin, polyester resin, epoxy resin, silicone resin, etc. is applied to this material. Impregnate and dry to make prepreg. The granular or powdery molding material is obtained by mixing and kneading the thermosetting resin with an inorganic filler such as glass fiber, glass powder, or clay, or an organic filler such as pulp or wood flour. Next, one embodiment of the present invention will be described. Example 1 50 parts by weight of glass fiber (length 3 mm), 40 parts by weight of epoxy resin (manufactured by Ciel Chemical Co., Ltd., trade name Epicote 1001), 7 parts by weight of dicyandiamide as a hardening agent,
2-ethyl-4methylimidazole as catalyst
A molding material was obtained by mixing and kneading 0.5 parts by weight of a resin composition using a conventional method. On the other hand, the resin composition was dissolved in methyl ethyl ketone and the solid content was 50%.
varnish, impregnated glass cloth with it and heated to 140℃.
The prepreg was dried for 5 minutes to obtain a prepreg. The molding material prepared above was sandwiched between prepregs and molded under heat and pressure in a mold to obtain an insulating board for printed circuits. Comparative Example 1 An insulating board for printed circuits having the same thickness as Example 1 was obtained by heat-pressing molding in a mold using only the molding material in Example 1. Table 1 shows the performance of the insulating plates obtained in Example 1 and Comparative Example 1.
【表】
発明の効果
第１表から明らかなように、本発明によれば機
械的強度の良好な印刷回路用絶縁板を得られ、シ
ート状基材の使用量が少ないことから安価に製造
できる点、その工業的価値は極めて大である。[Table] Effects of the Invention As is clear from Table 1, according to the present invention, an insulating board for printed circuits with good mechanical strength can be obtained, and since the amount of sheet-like base material used is small, it can be manufactured at low cost. However, its industrial value is extremely large.
Claims (1)
グと、充填材と樹脂を混合混練してなる粒状乃至
粉状成形材料とを用意し、前記成形材料を中心層
に位置するようプリプレグで挾んで加熱加圧成形
することを特徴とする印刷回路用絶縁板の製造
法。1 Prepare a prepreg obtained by impregnating a resin into a sheet-like base material and drying it, and a granular or powdery molding material made by mixing and kneading a filler and a resin, sandwich the molding material between the prepregs so that it is located in the center layer, and heat it. A method for manufacturing an insulating board for printed circuits, which is characterized by pressure molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5359385A JPS61213115A (en) | 1985-03-18 | 1985-03-18 | Manufacture of insulation board for printinted circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5359385A JPS61213115A (en) | 1985-03-18 | 1985-03-18 | Manufacture of insulation board for printinted circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61213115A JPS61213115A (en) | 1986-09-22 |
| JPH0239968B2 true JPH0239968B2 (en) | 1990-09-07 |
Family
ID=12947173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5359385A Granted JPS61213115A (en) | 1985-03-18 | 1985-03-18 | Manufacture of insulation board for printinted circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61213115A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106700588A (en) * | 2016-12-09 | 2017-05-24 | 广西北海浩邦新能源科技有限公司 | Environmentally-friendly plate material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54150480A (en) * | 1978-05-18 | 1979-11-26 | Asahi Chem Ind Co Ltd | Continuous manufacture of metal foil clad laminate |
| JPS55107466A (en) * | 1979-02-14 | 1980-08-18 | Matsushita Electric Works Ltd | Preparation of laminate |
| JPS56105923A (en) * | 1980-01-26 | 1981-08-22 | Matsushita Electric Works Ltd | Manufacture of laminated sheet coated with metallic foil |
-
1985
- 1985-03-18 JP JP5359385A patent/JPS61213115A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54150480A (en) * | 1978-05-18 | 1979-11-26 | Asahi Chem Ind Co Ltd | Continuous manufacture of metal foil clad laminate |
| JPS55107466A (en) * | 1979-02-14 | 1980-08-18 | Matsushita Electric Works Ltd | Preparation of laminate |
| JPS56105923A (en) * | 1980-01-26 | 1981-08-22 | Matsushita Electric Works Ltd | Manufacture of laminated sheet coated with metallic foil |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61213115A (en) | 1986-09-22 |
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