JPS58102752A - Manufacture of multilayer board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a multilayer board used for multilayer distribution boards and the like.

Multilayer boards are generally damaged after secondary molding due to residual stress caused by curing shrinkage of the resin, tension of the base material, etc.

Dimensional changes occur after etching, soldering, etc.

Therefore, when used in a multilayer wiring board, there is a problem that the positional accuracy of one circuit deteriorates and defects occur during through-hole processing.

Therefore, as a result of repeated research to solve these problems, the inventors found that the resin-impregnated base material used for manufacturing multilayer boards,
It has been found that the intended purpose can be achieved by including glass fiber powder and glass flakes of a predetermined size, either alone or in combination, leading to the present invention.

That is, the present invention is a method for manufacturing a multi-TVM board by laminating and hardening several resin-impregnated base materials, in which the following resin-impregnated base materials are used as appropriate resin-impregnated base materials among the plurality of resin-impregnated base materials. The aim is to use a product containing at least 10,000 of the components (-) and component (B).

Glass fiber powder having an average fiber length of 10 to 500μ and a ratio of (average fiber length)/(if diameter) of 3 to 50.

(81 thickness is 1 to 20 μ, (diameter) / (thickness)
is 20 to 500.

Inorganic fillers (calcium carbonate, silica powder, talc, clay, etc.) are added to a resin solvent bath solution, and the base material is impregnated with this resin solvent bath solution to create a resin-impregnated base material. It has been common practice in the past to improve dimensional accuracy by manufacturing plates, but this invention uses glass fiber powder and glass flakes with the dimensions shown below, rather than ordinary inorganic fillers. By using it as a filler, a particularly remarkable effect of improving dimensional accuracy can be achieved.

As described above, the reason why particularly remarkable effects can be obtained by using glass fiber powder and glass flakes having the dimensions shown in the following is thought to be that their shapes and dimensions effectively work to improve dimensional accuracy.

It is necessary that the glass fiber powder has an average fiber length of 10 to 500 μm and a ratio of (average fiber length)/(diameter) of 3 to 50. That is, if the average fiber length is less than 10 μm, no effect of improving dimensional accuracy can be obtained, and on the contrary, even if it exceeds 500 μm, the effect of improving dimensional accuracy does not increase further and it becomes difficult to achieve uniform dispersion. Furthermore, if (average fiber length)/(diameter) is less than 3, the effect of improving dimensional accuracy is no longer obtained, and on the other hand, if it exceeds 50, the effect of improving dimensional accuracy does not increase any more, and instead, uniform dispersion is impaired. It is from.

The glass flakes need to have a thickness of 1 to 20 μm and a ratio of (diameter)/(thickness) of 20 to 500.

That is, it is substantially difficult to produce glass 7 lakes with a thickness of less than 1 μm, and even if the thickness exceeds 20 μm, the effect of improving dimensional accuracy will be poor, and the surface smoothness will also be poor. Furthermore, if (diameter)/(thickness) is less than 20, the effect of improving dimensional accuracy will be small, and if it exceeds 500, dimensional accuracy will not improve much and uniform dispersion will be hindered. Glass fiber powder and glass flakes are added and dispersed in a resin solvent bath, impregnated into a base material such as glass cloth, and dried, thereby being contained in a resin-impregnated base material (prepreg). In this case, the resin used is a thermosetting resin, a special polyimide resin, or an epoxy resin. The area is 10 to 100% for the resin 100 folded part (hereinafter abbreviated as "part").
It is preferable to set the number to 100 copies. That is, if the additive amount is less than 10 parts, the effect of improving dimensional accuracy is small, and if it exceeds 100 parts, the viscosity of the face increases by 1, making impregnation difficult, and the fluidity during molding deteriorates, resulting in a good molded product. This is because it becomes difficult to get caught.

The resin-impregnated base material obtained as described above is suitably laminated with a resin-impregnated base material containing glass fiber powder, glass 7 lake, or a resin-impregnated base material that does not contain such glass fiber powder, etc., and is cured to form a multilayer. The board is broken.

The multilayer board thus obtained has extremely high dimensional accuracy, with dimensional changes suppressed after secondary forming, etching, soldering, etc., due to the action of glass fiber powder and glass flakes with the dimensions described above. expensive. Therefore, when this is used in a multilayer wiring board, defects during through-hole processing can be significantly reduced.

Next, examples will be explained along with comparative examples. First, fillers as shown in Table 1 below were prepared.

(Margin below) Table 1 Next, a multilayer board was manufactured using the above filler in the following manner.

[Examples 1 to 3. Example 5] Polyimide resin (manufactured by Rhone-Poulenc, Kerimide 60
1) Dissolve 100 parts in 150 parts of N-methylpyrrolidone and apply a varnish. Add and disperse the filler shown in Table 2 below in only the violet shown in the same table, then impregnate a glass cloth and dry it to form a prepreg. I made it.

Next, this prepreg was cut into 3001 square pieces, two sheets were stacked and hot-press molded (temperature: 200°C, pressure: 50"V'd, time: 10 minutes) to obtain a multilayer board (molded product). [Example] 4
．． Example 6.7] Epoxy resin (manufactured by Shell Chemical Co., Ltd., Epicoat 1046)
A varnish was made using 100 parts of dicyandiamide, 4 parts of dicyandiamide, 0.2 parts of be/zyl dimethylamine, 25 parts of acetone, 20 parts of dimethylformamide, and 20 parts of methylcellosolve, and the fillers shown in Table 2 below. Only the lids shown in the same table were added and dispersed.

After this, a multilayer board was obtained in the same manner as in Examples 1 to 3.

[Comparative Examples 1 and 2] Addition of filler was stopped. A multilayer board was obtained in the same manner as in Example flJ1 and Example 4 except for the above.

[Comparative Examples 3 and 4] Fillers shown in Table 2 below were used in place of the glass fiber powder filler. A multilayer board was obtained in the same manner as in Example 1 except for the above.

Marks A, B, C, and D are marked on the plate surfaces of the multilayer boards obtained in the above Examples and Comparative Examples as shown in the drawings.
The dimensions between the two were measured. Note that the arrow indicates the direction of movement during varnish impregnation. Next, two sheets of prepreg and one sheet of copper foil were laminated under the multilayer board and hot-press molded under the molding conditions of the multilayer board and IHJ-like conditions. After that, it was etched, the copper foil was removed and dried, and the dimensions between AC and BD on the board surface of the multilayer board were measured again to find the rate of change from the initial dimension. It can be seen that the dimensional change rate is considerably smaller than that of the comparative example, and the dimensional accuracy is excellent.

(Hereafter, the rest is white)

[Brief explanation of the drawing]

The drawing is an explanatory diagram of measurement of the dimensional change rate. Patent applicant Matsushita Electric Works Co., Ltd. Agent: Patent Attorney Takehiko Matsumoto

Claims (4)

[Claims] (1) A method of manufacturing a multilayer board by laminating and curing a plurality of resin-impregnated base materials, in which an appropriate resin-impregnated base material among the plurality of resin-impregnated base materials is the following (~ components and ( C) A method for manufacturing a multilayer board characterized by using a material containing at least one of the components. A certain glass fiber powder. 2) Glass flakes having a thickness of 1 to 20μ and a ratio of (diameter)/(thickness) of 20 to 500. (2) A resin-impregnated base material containing at least one of component ~ and (3) is prepared by adding and dispersing at least one of component ~ and component (c) to a resin solvent solution, and impregnating the base material with this. A method for producing a multilayer board according to claim 1, which is produced by drying the multilayer board. (3) The multilayer board according to claim 2, wherein the wrinkles added to at least one of the component (c) and the component (c) are set at 10 to 100 parts per 100 parts of the resin. manufacturing method. (4) The method for producing a multilayer board according to any one of claims 1 to 3, wherein the resin of the resin-impregnated base material is a polyimide resin or an epoxy resin.