JPH0239588B2 - PURANETARIISHIKISEIMAKUSOCHINIOKERUMAKUATSUSHUSEISOCHI - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a film thickness correction device in a planetary film forming apparatus.

"Prior Art" Japanese Patent Laid-Open No. 131129/1983 describes at least one base holder arranged to rotate around its axis, and a base holder arranged to face and revolve together with the base holder. A planetary film forming apparatus having a revolution type film thickness correction plate is disclosed.

This planetary type film forming apparatus was developed in order to eliminate the drawbacks of the planetary type film forming apparatus, which combines a fixed fixed film thickness correction plate with a rotating substrate holder. For example, it is configured as described below.

That is, in FIGS. 7 and 8 showing one embodiment of the planetary film forming apparatus disclosed in the above-mentioned patent publication, the reference numeral 1 denotes a particle source such as an evaporation source in a vacuum evaporation apparatus or a target in a sputtering apparatus. shows. An annular member, designated 2, is arranged to rotate (revolution) about a vertical axis passing through the particle source 1, and to this annular member 2, a substrate holder assembly 4 is attached via a mounting arm 3.
is installed. In the illustrated embodiment, three substrate holder assemblies 4 are arranged at approximately equal intervals.
Each base holder assembly 4 includes a rotary bearing 5 fixed to the mounting arm 3, a friction wheel 6 rotatably supported by the rotary bearing 5, and a base holder 7 fixedly attached to the friction wheel 6. Become. The friction wheel 6 is constantly in frictional contact with an annular friction track 8 whose center is on a vertical axis passing through the particle source 1 . When the annular member 2 rotates (revolutions) about a vertical axis passing through the particle source 1, at the same time the friction wheel 6 rolls due to frictional contact with the friction track 8. Therefore, the base holder 7 fixed to the friction wheel 6 rotates around its own rotational axis while revolving together with the annular member 2 around the vertical axis. A substrate (not shown) on which the particles coming from the particle source 1 are to be deposited and adhered as a film is attached to the surface of the substrate holder 7 (the right side in FIG. 8).

Such a planetary film forming apparatus further includes a revolving type film thickness correction plate 9 disposed facing the surface of the substrate holder 7, which rotates on the annular member 2 (or rotates together with the annular member 2, but does not rotate on its axis). It is fixed to a support arm 10 that is removably attached to a fixed member such as a mounting arm 3 or a rotation bearing 5).
Therefore, when the annular member 2 rotates (revolutions),
The revolution type film thickness correction plate 9 revolves together with this.

Next, the shape of the revolution type film thickness correction plate 9 will be explained with reference to FIGS. 9 and 10. In FIG. 9, the average film thickness distribution when the film forming apparatus is operated without film thickness correction is shown by a curve S, which is generally determined by experiment. In FIG. 9, T _i represents the value of the film thickness T at a distance X _i along the radial direction from the rotation center O of the substrate holder 7 (the point where the rotation axis of the substrate holder intersects the surface of the substrate holder). , T _p indicates the minimum value of the film thickness T (within the surface of the substrate holder 7) in the average film thickness distribution curve S. Also, the 10th
As shown in the figure, the origin O (the point where the axis of rotation of the substrate holder intersects the surface of the revolution-type film thickness correction plate) is located on the periphery of the revolution-type film thickness correction liquid 9. Generally, the revolution-type film thickness correction plate is Since it is placed close to the holder, two points _{P i and} In Q _i , P _i
Let the angle between O and Q _i O be θ _i degrees. Based on this premise, the shape of the revolution type film thickness correction plate 9 is determined so that Q _i /360=T _i −T _p /T _i (1) is satisfied.

The revolution type film thickness correction plate 9 is adjusted so as to satisfy the above-mentioned formula (1).
When the shape of the substrate holder 7 is determined, when the substrate holder 7 rotates one rotation with respect to the revolution type film thickness correction plate 9, the rotation center O (this is It is clear that at the point X _i , the film thickness is reduced by the value θ _i /360 when no film thickness correction is performed, so the equation According to (1), the film thickness T which was T _i without film thickness correction is T _i
×(T _i −T _p )/T _i is reduced to become T _p . In this way, the revolution-type film thickness correction plate 9 achieves film thickness correction such that the film thickness becomes T _p over the entire surface of the substrate holder 7 .

In reality, when the directionality of the film thickness distribution is large, the revolving type film thickness correction plate 9 has many (three in the illustrated example) blades 9a, as shown in FIG.
It is divided into propeller types consisting of 9b and 9c. These blades are connected to each other at a central portion 11 near the origin (center of rotation of the substrate holder). In addition, in the revolution type film thickness correction plate 9 shown in FIG. 11, the sum of arc lengths P _ai Q _ai , P _bi Q _bi and P _ci Q _ci along a circle with radius X _i centered on the origin is 10th
Corresponds to P _i Q _i in the figure.

"Problems to be Solved by the Invention" The planetary film forming apparatus disclosed in the above-mentioned published patent application, which has the above-mentioned revolving type film thickness correcting plate 9, is different from the previous one having the fixed rotating type film thickness correcting plate. Although it is superior in many respects to the previous version, there are significant restrictions on the board shape. When the revolution type film thickness correction plate 9 as shown in FIG. This makes it difficult to secure support. Therefore, in such a case, film thickness correction cannot be achieved near the rotation center O. Furthermore, when a revolution type film thickness correction plate 9 as shown in FIG. 11 is adopted, since the central axis 11 is located near the center of rotation of the substrate holder, film formation is not achieved at this location. , the film thickness becomes zero.

Therefore, it is an object of the present invention to eliminate the above-mentioned drawbacks or problems of the planetary film forming apparatus disclosed in the above-mentioned published patent application.

"Means for Solving the Problems" In order to eliminate the above-mentioned drawbacks, that is, to solve the problems, according to the present invention, a revolution type film thickness correction plate that does not reach close to the center of rotation of the substrate holder is used. Further, a fixed film thickness correction plate is placed near the orbit of the rotation center.

"Operation" According to the present invention, at a location away from the center of rotation of the substrate holder, the film thickness correction is achieved by the revolution type film thickness correction plate in the same manner as that disclosed in the above-mentioned Japanese Patent Publication No. Near the center of rotation of the substrate holder, the effect of the rotation of the substrate holder can be practically ignored, so sufficient thickness correction can be achieved by simply placing a fixed film thickness correction plate near the orbit of the center of rotation. . In this way, film formation with corrected film thickness can be performed over substantially the entire surface of a large substrate holder without expanding the revolution type film thickness correction plate to the center of rotation.

Embodiments In the following, embodiments of the present invention will be described with reference to FIGS. 1 to 6.

The embodiment of the present invention differs from the conventional one described above with reference to FIGS. 7 to 11 in the shape of the revolution type film thickness correction plate, and also has features that are not included in the conventional one. 7 to 1 except that a fixed film thickness correction plate is included.
Since it can be configured the same as the planetary type film forming apparatus disclosed in the above-mentioned published patent application shown in FIG.
The matters explained under the headings are used as is,
The explanation will be omitted or simplified here.

According to the present invention, as shown in FIGS. 1 and 2, the annular member 2 is removably attached to the annular member 2 (or a member that revolves together with the annular member but does not rotate, such as the mounting arm 3 or the rotary bearing 5). The revolution type film thickness correction plate 9 fixed to the support arm 10 and arranged to face the surface of the substrate holder 7 is
It has a shape that does not reach close to the center of rotation of the base holder 7. In other words, it is cut out near the center of rotation. The film thickness correction device according to the present invention has a fixed film thickness correction plate 12 in addition to the revolution type film thickness correction plate 9, which is located near the orbit 13 of the rotation center of the substrate holder 7, and is, for example, The support member 14 is attached to a casing (not shown) of the device or the like and the support member 14 is fixed therein.

As shown in FIG. 3, the revolution type film thickness correction plate 9
In the shape shown in FIG. 10, it has a shape in which a circular portion with a diameter φ centered on the rotation center O of the substrate holder 7 (the origin of this revolution type film thickness correction plate) is cut out.
According to such a revolution type film thickness correction plate, as shown in FIG.
The film thickness distribution as shown in the figure (see also the figure) is
Then, the film thickness becomes constant T _p after being modified as explained in relation to equation (1), and when x < φ/2, the film thickness distribution S remains unchanged without being modified at all, and thus the fourth
A film thickness distribution as shown by R in the figure is obtained.

The fixed type film thickness correction plate 12 is the revolving type film thickness correction plate 9
This is to correct the portion of x<φ/2 that was not corrected, and the point to note at this time is that the mid-range x<φ/2 to be corrected with the fixed film thickness correction plate 12.
φ/2 is limited near the center of rotation O, and therefore the influence of rotation on the film thickness can be ignored. Therefore, the fixed film thickness correction plate 1 is used instead of the revolving type film thickness correction plate 9.
Even if 2 is adopted, there is virtually no change in the correction effect.

The fixed film thickness correction plate 12 generally has a rectangular shape, and in order to be able to correct the area where x<φ/2, as shown in FIG. have the same height and orbit 1
They are arranged so as to extend vertically from φ/2 above φ/2 to φ/2 below. The fixed film thickness correction plate 12 is further generally arranged in a curved manner along the orbit of revolution,
When its length is l, its angle from the center P of the orbit 13 is θ degrees, and the radius of the orbit 13 is r, then l therefore θ satisfies the following equation (2). selected as follows.

l/2πr=θ〓/360=T′ _i −T _p /T′ _i (2) However, T′ _i is X′ _i as shown in FIG.
When is between O and φ/2, each represents an arbitrary value of the film thickness T on the S curve. In this way, while the base holder 7 makes one revolution along the orbit, x
It is clear that in the range <φ/2, the film thickness is reduced to θ〓/360, which is the value without correction, so the film thickness, which was approximately T′ _i without correction, is fixed film thickness correction. It can be seen that the plate 12 reduces it to substantially T _p .

As another example, the following may also be considered. The revolution type film thickness correction plate 9 shown in FIG.
Similar to the example in which the blades are divided into several blades as shown in FIG. 1, the revolution type film thickness correction plate 9 according to the present invention shown in FIG. Alternatively, it can be divided into propeller-type blades 9a, 9b, and 9c. However, in this case, since the circular part with diameter φ is cut out, in reality, each blade 9a, 9b and 9
c are connected to each other by thin connecting members 15a and 15b, as shown in FIG. 6, for example.

"Effect of the invention" Thus, the above-mentioned revolution type film thickness correction plate 9
By using the fixed type film thickness correction plate 12 in combination, film thickness correction can be achieved such that the film thickness becomes substantially T _p both in areas where x is larger than φ/2 and in areas where x is smaller than φ/2.

[Brief explanation of drawings]

1 is a partial cross-sectional view of an embodiment of the film thickness correction device in a planetary film forming apparatus according to the present invention; FIG. 2 is a diagram simply showing the elements shown in FIG. 1; 3 is a diagram showing an example of the revolution type film thickness correction plate in the embodiment of the present invention, FIG. 4 is a diagram showing the film thickness distribution when the revolution type film thickness correction plate of FIG. 3 is used, and FIG. The figure shows a modification of Figure 3.
FIG. 6 is a diagram showing the actual shape of the revolution type film thickness correction plate shown in FIG. 5, FIG. FIG. 9 is a diagram showing the average film thickness distribution without film thickness correction, and FIGS. 10 and 11 are views each showing an example of a revolution type film thickness correction plate in a conventional device. It is. In the drawings, 7 is a base holder, 9 is a revolving film thickness correction plate, 12 is a fixed film thickness correction plate, 13 is an orbit around the center of rotation, and O is the center of rotation.

Claims (1)

[Claims] 1. In a planetary film forming apparatus having at least one substrate holder arranged to revolve around its own axis and a revolution type film thickness correction plate arranged to face the substrate holder and revolve together with the substrate holder, the substrate A film thickness correction device characterized in that a revolving type film thickness correction plate that does not reach close to the rotation center of the holder is used, and a fixed type film thickness correction plate is fixed near the orbit of the rotation center.