JPH0238720U - - Google Patents

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Publication number
JPH0238720U
JPH0238720U JP11828588U JP11828588U JPH0238720U JP H0238720 U JPH0238720 U JP H0238720U JP 11828588 U JP11828588 U JP 11828588U JP 11828588 U JP11828588 U JP 11828588U JP H0238720 U JPH0238720 U JP H0238720U
Authority
JP
Japan
Prior art keywords
electronic component
lead wire
case
eyelet
component element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11828588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11828588U priority Critical patent/JPH0238720U/ja
Publication of JPH0238720U publication Critical patent/JPH0238720U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図はこの考案の電子部品の各実施
例を示す縦断側面図、第３図、第４図は従来例を
示す縦断側面図である。 １１……ケース、１２……電子部品素子、１３
，１４……リード線、１５……ハトメ、１６……
半田、１７……エポキシ樹脂、１８……ガラス管
、１９……シリコンゴム。 FIGS. 1 and 2 are longitudinal sectional side views showing each embodiment of the electronic component of this invention, and FIGS. 3 and 4 are longitudinal sectional side views showing a conventional example. 11... Case, 12... Electronic component element, 13
, 14... Lead wire, 15... Eyelet, 16...
Solder, 17...Epoxy resin, 18...Glass tube, 19...Silicone rubber.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース内に所望の電子部品素子を収納して樹脂
を注入固形化した電子部品において、該電子部品
素子のリード線をケースの底部に固定したハトメ
に挿入して外部に引き出すと共に、リード線をハ
トメに半田付けしたことを特徴とする電子部品。 In an electronic component in which a desired electronic component element is housed in a case and resin is injected and solidified, the lead wire of the electronic component element is inserted into an eyelet fixed to the bottom of the case and pulled out to the outside, and the lead wire is inserted into the eyelet. An electronic component characterized by being soldered to.
JP11828588U 1988-09-08 1988-09-08 Pending JPH0238720U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11828588U JPH0238720U (en) 1988-09-08 1988-09-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11828588U JPH0238720U (en) 1988-09-08 1988-09-08

Publications (1)

Publication Number Publication Date
JPH0238720U true JPH0238720U (en) 1990-03-15

Family

ID=31362505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11828588U Pending JPH0238720U (en) 1988-09-08 1988-09-08

Country Status (1)

Country Link
JP (1) JPH0238720U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045697U (en) * 1990-05-01 1992-01-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045697U (en) * 1990-05-01 1992-01-20

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