JPH0238720U - - Google Patents
Info
- Publication number
- JPH0238720U JPH0238720U JP11828588U JP11828588U JPH0238720U JP H0238720 U JPH0238720 U JP H0238720U JP 11828588 U JP11828588 U JP 11828588U JP 11828588 U JP11828588 U JP 11828588U JP H0238720 U JPH0238720 U JP H0238720U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- case
- eyelet
- component element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Description
第1図、第2図はこの考案の電子部品の各実施
例を示す縦断側面図、第3図、第4図は従来例を
示す縦断側面図である。
11……ケース、12……電子部品素子、13
,14……リード線、15……ハトメ、16……
半田、17……エポキシ樹脂、18……ガラス管
、19……シリコンゴム。
FIGS. 1 and 2 are longitudinal sectional side views showing each embodiment of the electronic component of this invention, and FIGS. 3 and 4 are longitudinal sectional side views showing a conventional example. 11... Case, 12... Electronic component element, 13
, 14... Lead wire, 15... Eyelet, 16...
Solder, 17...Epoxy resin, 18...Glass tube, 19...Silicone rubber.
Claims (1)
を注入固形化した電子部品において、該電子部品
素子のリード線をケースの底部に固定したハトメ
に挿入して外部に引き出すと共に、リード線をハ
トメに半田付けしたことを特徴とする電子部品。 In an electronic component in which a desired electronic component element is housed in a case and resin is injected and solidified, the lead wire of the electronic component element is inserted into an eyelet fixed to the bottom of the case and pulled out to the outside, and the lead wire is inserted into the eyelet. An electronic component characterized by being soldered to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11828588U JPH0238720U (en) | 1988-09-08 | 1988-09-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11828588U JPH0238720U (en) | 1988-09-08 | 1988-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0238720U true JPH0238720U (en) | 1990-03-15 |
Family
ID=31362505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11828588U Pending JPH0238720U (en) | 1988-09-08 | 1988-09-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238720U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH045697U (en) * | 1990-05-01 | 1992-01-20 |
-
1988
- 1988-09-08 JP JP11828588U patent/JPH0238720U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH045697U (en) * | 1990-05-01 | 1992-01-20 |
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