JPH0456661U - - Google Patents
Info
- Publication number
- JPH0456661U JPH0456661U JP9991590U JP9991590U JPH0456661U JP H0456661 U JPH0456661 U JP H0456661U JP 9991590 U JP9991590 U JP 9991590U JP 9991590 U JP9991590 U JP 9991590U JP H0456661 U JPH0456661 U JP H0456661U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- adhesive tape
- lead wires
- tape
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
Landscapes
- Packages (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図ａ，ｂは本考案の一実施例のリード線付
電子部品のテーピング体の正面図およびその底面
の拡大図、第２図ａ，ｂは本考案の他の実施例の
正面図およびその底面の拡大図、第３図ａ，ｂは
従来のリード線付電子部品のテーピング体の一例
の正面図およびその底面の拡大図である。
１，１１，１２……電子部品のリード線、２…
…テープ台紙、３……粘着テープ、４……送り穴
。
Figures 1a and b are a front view and an enlarged view of the bottom of a taping body for an electronic component with lead wires according to one embodiment of the present invention, and Figures 2a and b are a front view and an enlarged view of another embodiment of the present invention. FIGS. 3A and 3B are a front view and an enlarged view of the bottom of an example of a conventional taping body for an electronic component with a lead wire. 1, 11, 12...Electronic component lead wire, 2...
...Tape mount, 3...Adhesive tape, 4...Sprocket hole.
Claims (1)
の間に挿入接着し、さらにテープ台紙と粘着テー
プを貫通した送り穴を設けてなるリード線付電子
部品のテーピング体において、テープ台紙と粘着
テープの間に挿入し接着する電子部品のリード線
の先端部分を、リード線の直径の１．２倍以上の
幅になるよう潰し、また、潰した部分の長さが粘
着テープの幅寸法より短かいことを特徴とするリ
ード線付電子部品のテーピング体。 In the taping body for electronic components with lead wires, the lead wires of the electronic components are inserted and bonded between the tape mount and the adhesive tape, and a feed hole is provided through the tape mount and the adhesive tape. The tip of the lead wire of the electronic component to be inserted and bonded must be crushed to a width of at least 1.2 times the diameter of the lead wire, and the length of the crushed portion must be shorter than the width of the adhesive tape. A taping body for electronic components with lead wires, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9991590U JPH0456661U (en) | 1990-09-25 | 1990-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9991590U JPH0456661U (en) | 1990-09-25 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456661U true JPH0456661U (en) | 1992-05-14 |
Family
ID=31842178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9991590U Pending JPH0456661U (en) | 1990-09-25 | 1990-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456661U (en) |
-
1990
- 1990-09-25 JP JP9991590U patent/JPH0456661U/ja active Pending
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