JPH0292667U - - Google Patents
Info
- Publication number
- JPH0292667U JPH0292667U JP150689U JP150689U JPH0292667U JP H0292667 U JPH0292667 U JP H0292667U JP 150689 U JP150689 U JP 150689U JP 150689 U JP150689 U JP 150689U JP H0292667 U JPH0292667 U JP H0292667U
- Authority
- JP
- Japan
- Prior art keywords
- case
- recess
- electronic device
- electronic component
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第1図は本考案の一実施例の断面図である。第
2図は従来例の断面図である。
1……ケース収納型電子装置、2,3……電子
部品、2a,2b,3a,3b……リード線、4
A,4B……入出力端子、5……ケース、7,8
A,8B……凹部、9……導電性接着剤、10…
…樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention. FIG. 2 is a sectional view of a conventional example. 1... Case-storable electronic device, 2, 3... Electronic component, 2a, 2b, 3a, 3b... Lead wire, 4
A, 4B...Input/output terminal, 5...Case, 7, 8
A, 8B... recess, 9... conductive adhesive, 10...
…resin.
Claims (1)
したケース収納型電子装置において、 前記ケースの内部にリード線固定用凹部を設け
、この凹部に電子部品のリード線を挿入するとと
もに導電性接着剤を注入し、電子部品のリード線
を前記凹部に固定したことを特徴とするケース収
納型電子装置。[Scope of Claim for Utility Model Registration] A case-housed electronic device in which electronic components are arranged inside a case and sealed with resin, wherein a recess for fixing a lead wire is provided inside the case, and the lead of the electronic component is inserted into the recess. A case-storable electronic device, characterized in that a lead wire of an electronic component is fixed in the recess by inserting a wire and injecting a conductive adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989001506U JPH0711408Y2 (en) | 1989-01-10 | 1989-01-10 | Case storage type electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989001506U JPH0711408Y2 (en) | 1989-01-10 | 1989-01-10 | Case storage type electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0292667U true JPH0292667U (en) | 1990-07-23 |
JPH0711408Y2 JPH0711408Y2 (en) | 1995-03-15 |
Family
ID=31201452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989001506U Expired - Lifetime JPH0711408Y2 (en) | 1989-01-10 | 1989-01-10 | Case storage type electronic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0711408Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015058904A (en) * | 2013-09-20 | 2015-03-30 | ダイキョーニシカワ株式会社 | Formation method of conductive circuit to vehicular window panel |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58154566U (en) * | 1982-04-10 | 1983-10-15 | ニツコ−金属工業株式会社 | Connection structure of terminal and conductor |
JPS61237382A (en) * | 1985-04-12 | 1986-10-22 | 松下電器産業株式会社 | Mounting of lead |
JPS6397201U (en) * | 1986-12-13 | 1988-06-23 |
-
1989
- 1989-01-10 JP JP1989001506U patent/JPH0711408Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58154566U (en) * | 1982-04-10 | 1983-10-15 | ニツコ−金属工業株式会社 | Connection structure of terminal and conductor |
JPS61237382A (en) * | 1985-04-12 | 1986-10-22 | 松下電器産業株式会社 | Mounting of lead |
JPS6397201U (en) * | 1986-12-13 | 1988-06-23 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015058904A (en) * | 2013-09-20 | 2015-03-30 | ダイキョーニシカワ株式会社 | Formation method of conductive circuit to vehicular window panel |
Also Published As
Publication number | Publication date |
---|---|
JPH0711408Y2 (en) | 1995-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |