JPS5920624U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS5920624U JPS5920624U JP11540282U JP11540282U JPS5920624U JP S5920624 U JPS5920624 U JP S5920624U JP 11540282 U JP11540282 U JP 11540282U JP 11540282 U JP11540282 U JP 11540282U JP S5920624 U JPS5920624 U JP S5920624U
- Authority
- JP
- Japan
- Prior art keywords
- component body
- resin material
- external lead
- electronic components
- inner end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Ceramic Capacitors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図は従来及び本案の一実施例を示す側断
面図である。
図中、1は部品本体(コンデンサエレメント)、4.5
は外部リード部材、6は導電性接着剤、7は折曲部、8
は樹脂材、8bは下面である。FIGS. 1 and 2 are side sectional views showing an embodiment of the conventional and the present invention. In the figure, 1 is the component body (capacitor element), 4.5
is an external lead member, 6 is a conductive adhesive, 7 is a bent part, 8
is a resin material, and 8b is a lower surface.
Claims (1)
すると共に、部品本体を含む主要部分を樹脂材にてモー
ルド被覆し、かつ外部リード部材の導出端を樹脂材の下
面に沿うように配置したものにおいて、上記外部リード
部材の一方の内端部分を、樹脂材からの露出部分に平行
なるよ・うに部−品本体に沿って配置し、かつ内端部分
と部品本体とを導電性接着剤にて接続したことを特徴と
する電子部品。A device in which multiple external lead members are led out in different directions from the component body, the main part including the component body is molded and covered with a resin material, and the lead-out ends of the external lead members are arranged along the bottom surface of the resin material. In this step, one inner end portion of the external lead member is arranged along the component body so as to be parallel to the exposed portion from the resin material, and the inner end portion and the component body are bonded with a conductive adhesive. An electronic component characterized by being connected by
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11540282U JPS5920624U (en) | 1982-07-28 | 1982-07-28 | electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11540282U JPS5920624U (en) | 1982-07-28 | 1982-07-28 | electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5920624U true JPS5920624U (en) | 1984-02-08 |
Family
ID=30266401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11540282U Pending JPS5920624U (en) | 1982-07-28 | 1982-07-28 | electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5920624U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001057321A (en) * | 1999-08-18 | 2001-02-27 | Nec Corp | Chip type solid electrolytic capacitor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5724730A (en) * | 1980-07-23 | 1982-02-09 | Giken Seisakusho:Kk | Clamshell bucket excavator |
-
1982
- 1982-07-28 JP JP11540282U patent/JPS5920624U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5724730A (en) * | 1980-07-23 | 1982-02-09 | Giken Seisakusho:Kk | Clamshell bucket excavator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001057321A (en) * | 1999-08-18 | 2001-02-27 | Nec Corp | Chip type solid electrolytic capacitor |
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