JPH0238452Y2 - - Google Patents

Info

Publication number
JPH0238452Y2
JPH0238452Y2 JP8886985U JP8886985U JPH0238452Y2 JP H0238452 Y2 JPH0238452 Y2 JP H0238452Y2 JP 8886985 U JP8886985 U JP 8886985U JP 8886985 U JP8886985 U JP 8886985U JP H0238452 Y2 JPH0238452 Y2 JP H0238452Y2
Authority
JP
Japan
Prior art keywords
heater chip
guide
wire
conductors
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8886985U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61205139U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8886985U priority Critical patent/JPH0238452Y2/ja
Publication of JPS61205139U publication Critical patent/JPS61205139U/ja
Application granted granted Critical
Publication of JPH0238452Y2 publication Critical patent/JPH0238452Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary

Landscapes

  • Wire Bonding (AREA)
JP8886985U 1985-06-14 1985-06-14 Expired JPH0238452Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8886985U JPH0238452Y2 (en, 2012) 1985-06-14 1985-06-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8886985U JPH0238452Y2 (en, 2012) 1985-06-14 1985-06-14

Publications (2)

Publication Number Publication Date
JPS61205139U JPS61205139U (en, 2012) 1986-12-24
JPH0238452Y2 true JPH0238452Y2 (en, 2012) 1990-10-17

Family

ID=30642420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8886985U Expired JPH0238452Y2 (en, 2012) 1985-06-14 1985-06-14

Country Status (1)

Country Link
JP (1) JPH0238452Y2 (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610983B2 (ja) * 1989-01-24 1997-05-14 株式会社村田製作所 熱圧着用ヒータチップ
JPH0757424B2 (ja) * 1989-05-29 1995-06-21 株式会社村田製作所 熱圧着用ヒータチップ

Also Published As

Publication number Publication date
JPS61205139U (en, 2012) 1986-12-24

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