JPH0238115B2 - - Google Patents
Info
- Publication number
- JPH0238115B2 JPH0238115B2 JP58193625A JP19362583A JPH0238115B2 JP H0238115 B2 JPH0238115 B2 JP H0238115B2 JP 58193625 A JP58193625 A JP 58193625A JP 19362583 A JP19362583 A JP 19362583A JP H0238115 B2 JPH0238115 B2 JP H0238115B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- polishing
- abrasive
- particle size
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 claims description 26
- 238000005498 polishing Methods 0.000 claims description 15
- 235000012431 wafers Nutrition 0.000 claims description 15
- 239000006061 abrasive grain Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000005350 fused silica glass Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 4
- 239000012670 alkaline solution Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910003902 SiCl 4 Inorganic materials 0.000 description 2
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58193625A JPS6086187A (ja) | 1983-10-17 | 1983-10-17 | 半導体ウエ−ハ研摩用砥粒 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58193625A JPS6086187A (ja) | 1983-10-17 | 1983-10-17 | 半導体ウエ−ハ研摩用砥粒 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6086187A JPS6086187A (ja) | 1985-05-15 |
| JPH0238115B2 true JPH0238115B2 (cs) | 1990-08-29 |
Family
ID=16311047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58193625A Granted JPS6086187A (ja) | 1983-10-17 | 1983-10-17 | 半導体ウエ−ハ研摩用砥粒 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6086187A (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3303544B2 (ja) * | 1994-07-27 | 2002-07-22 | ソニー株式会社 | 半導体装置の製造方法および配線層表面研磨用のスラリーおよび配線層表面研磨用のスラリーの製造方法 |
| US10144850B2 (en) | 2015-09-25 | 2018-12-04 | Versum Materials Us, Llc | Stop-on silicon containing layer additive |
-
1983
- 1983-10-17 JP JP58193625A patent/JPS6086187A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6086187A (ja) | 1985-05-15 |
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