JPH023677Y2 - - Google Patents
Info
- Publication number
- JPH023677Y2 JPH023677Y2 JP1984167221U JP16722184U JPH023677Y2 JP H023677 Y2 JPH023677 Y2 JP H023677Y2 JP 1984167221 U JP1984167221 U JP 1984167221U JP 16722184 U JP16722184 U JP 16722184U JP H023677 Y2 JPH023677 Y2 JP H023677Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- metal
- transparent conductive
- transparent
- metal transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 18
- 239000011241 protective layer Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 43
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007733 ion plating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- -1 gold and silver Chemical class 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は電気機器などの透明電磁遮蔽板に関す
る。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a transparent electromagnetic shielding plate for electrical equipment, etc.
一般に、電磁遮蔽を必要とする電気機器などを
電磁遮蔽する場合には、アルミニウム、銅などの
高導電性材料からなる金属箱等によりコンピユー
ターや計測機器類等の電気機器を覆うのが普通で
ある。
Generally, when electromagnetically shielding electrical equipment that requires electromagnetic shielding, it is common to cover electrical equipment such as computers and measuring instruments with metal boxes made of highly conductive materials such as aluminum and copper. .
ところで、このように電気機器などを金属箱等
により覆つて電磁遮蔽した状態であると、電気機
器の、例えば、デイスプレイなどを外から見たい
場合にこれを見ることができず、また、外からデ
イスプレイなどが見えるようにするため、上記金
属箱に窓を形成したり、金属箱に代えて金網を使
用するようにすると、窓や網目から電磁波が洩れ
るといつた不具合が生じる。 By the way, if electrical equipment is electromagnetically shielded by being covered with a metal box or the like, you will not be able to see the display of the electrical equipment from the outside. If a window is formed in the metal box or a wire mesh is used in place of the metal box in order to make the display visible, problems such as electromagnetic waves leaking through the window or mesh will occur.
そこで本考案の考案者は、実願昭58−204378号
明細書において、電気機器などを外から見える状
態で電磁遮蔽することができるとともに、耐久性
の良い電磁遮蔽板を提案した。この提案の電磁遮
蔽板は、透明樹脂基板と、この透明樹脂基板の少
なくとも片面に透明な表面処理層を介して設けら
れた金（Au）よりなる金属透明導電膜と、該金
属透明導電膜上に設けられた透明でかつ金属透明
導電膜より硬質な保護層とから構成されたもので
ある。そして、この電磁遮蔽板を金属箱等の窓と
して使用する場合には、保護層を設ける際に透明
樹脂基板の端部の金属透明導電膜を露出させてお
き、この露出部分を金属箱に接触させるアース用
の導通部とするのである。 In view of this, the inventor of the present invention proposed an electromagnetic shielding plate that is capable of electromagnetically shielding electrical equipment and the like while being visible from the outside, and has good durability, in Japanese Utility Model Application No. 58-204378. This proposed electromagnetic shielding plate includes a transparent resin substrate, a metal transparent conductive film made of gold (Au) provided on at least one side of the transparent resin substrate via a transparent surface treatment layer, and a metal transparent conductive film on the metal transparent conductive film. and a protective layer that is transparent and harder than the metal transparent conductive film. When using this electromagnetic shielding plate as a window for a metal box, etc., the metal transparent conductive film at the end of the transparent resin substrate is exposed when providing the protective layer, and this exposed portion is contacted to the metal box. It is used as a conductive part for grounding.
前記の電磁遮蔽板にあつては、光線透過率等を
考慮して形成された薄い金属透明導電膜を接触ア
ース部分にすると、その接触アース部分の損傷や
剥離の問題を生じる虞れがある。
In the case of the above-mentioned electromagnetic shielding plate, if a thin metal transparent conductive film formed in consideration of light transmittance and the like is used as a contact ground portion, there is a risk that the contact ground portion may be damaged or peeled off.
また、透明導電膜として、酸化インジウム・酸
化錫、およびこれらの化合物の成膜、あるいは
金、銀などの良導電性金属透明膜、および金属金
網等が知られているが、前記成膜にあつては、必
要とする抵抗値が得られない問題があり、良導電
性金属透明膜にあつては耐摩耗性に問題があつて
一般には、保護コートが必要であり、金網にあつ
ては基板との一体化に手間がかかり、また、デイ
スプレイの文字等がにじんで見えることがあると
いつた問題を有していた。 In addition, as transparent conductive films, films of indium oxide, tin oxide, and their compounds, transparent films of highly conductive metals such as gold and silver, and metal wire mesh are known. In the case of metal mesh, there is a problem that the required resistance value cannot be obtained, in the case of a highly conductive metal transparent film, there is a problem in wear resistance, and a protective coat is generally required, and in the case of wire mesh, the substrate It took a lot of effort to integrate it with the computer, and there were also problems in that the characters on the display sometimes appeared blurred.
本考案は上述した事情に鑑みてなされたもの
で、その目的は、アース導通部となる金属透明導
電膜の端部に損傷や剥離を生じないようにした透
明電磁遮蔽板を提供することを目的とする。
The present invention was developed in view of the above-mentioned circumstances, and its purpose is to provide a transparent electromagnetic shielding plate that prevents damage or peeling from occurring at the end of the metal transparent conductive film that serves as the earth conductive part. shall be.
本考案は、透明樹脂基板の表面にイオンプレー
テイング法、スパツタリング法等の気相メツキ法
により薄膜状の金属透明導電膜を付着させ、該金
属透明導電膜の端部周縁を該金属透明導電膜より
耐摩耗性の高い導電材で被覆してアース部を形成
するとともに、該アース部の少なくとも一部を除
いた部分を前記金属透明導電膜より硬質な透明保
護層により被覆してなるものである。
In the present invention, a thin metal transparent conductive film is attached to the surface of a transparent resin substrate by a vapor phase plating method such as an ion plating method or a sputtering method, and the end periphery of the metal transparent conductive film is coated with the metal transparent conductive film. A grounding part is formed by coating with a conductive material having higher wear resistance, and at least a part of the grounding part is covered with a transparent protective layer that is harder than the metal transparent conductive film. .
金属透明導電膜の端部を覆つた導電材がその導
電性によりアース接触部分としての機能を果たす
とともに、導電材の下に形成された金属透明導電
膜を保護する。
The conductive material covering the end of the metal transparent conductive film functions as a ground contact part due to its conductivity, and protects the metal transparent conductive film formed below the conductive material.
第１図と第２図は、本考案の第１実施例を示す
もので、電磁遮蔽板Ａは、透明樹脂基板１の表面
に、金属透明導電膜３と透明保護層４と導電材５
とを設けて構成される。
1 and 2 show a first embodiment of the present invention, in which an electromagnetic shielding plate A includes a transparent metal conductive film 3, a transparent protective layer 4, and a conductive material 5 on the surface of a transparent resin substrate 1.
It is composed of:
前記透明樹脂基板１は、アクリル樹脂、ポリカ
ーボネートなどの無色透明（例えば光線透過率が
90％付近）の樹脂からなるものである。なお、密
着性等の物性向上のため基板にはシリコン系ある
いはUV塗料系のハードコートがほどこしてある
方が好ましい。 The transparent resin substrate 1 is made of a colorless and transparent material (for example, a material with low light transmittance) such as acrylic resin or polycarbonate.
(nearly 90%) resin. Note that, in order to improve physical properties such as adhesion, it is preferable that the substrate be coated with a silicone-based or UV paint-based hard coat.
前記金属透明導電膜３は、高導電材料である金
あるいは銀等からなり、前記透明樹脂基板１の上
面の周縁部分を除いた部分に、イオンプレーテイ
ング法、スパツタリング法等の気相メツキ法によ
つて100〜200Åの厚さに蒸着して形成されてい
て、電気抵抗値が100Ω以下であり、光線透過率
が50％以上になるよう形成されている。これらの
数値は、電気抵抗値が100Ω以上にあると導電性
が小さくなつて電磁遮蔽作用を発揮し難く、ま
た、50％以下の光線透過率では透視が極端に困難
になるという理由により決定したものである。 The metal transparent conductive film 3 is made of a highly conductive material such as gold or silver, and is coated on the upper surface of the transparent resin substrate 1 except for the peripheral edge by a vapor phase plating method such as an ion plating method or a sputtering method. Therefore, it is formed by vapor deposition to a thickness of 100 to 200 Å, and is formed to have an electrical resistance value of 100Ω or less and a light transmittance of 50% or more. These values were determined because if the electrical resistance value is 100Ω or more, the conductivity will be low and it will be difficult to exert an electromagnetic shielding effect, and if the light transmittance is less than 50%, it will be extremely difficult to see through the material. It is something.
前記導電材５は、前記金属透明導電膜３の端縁
３ａとこの端縁３ａの側方の基板１の縁部とを覆
つて設けられた銀製のもので、導電材５は銀ペー
ストの印刷により形成され、導電材５がアース部
を構成する。 The conductive material 5 is made of silver and is provided to cover the edge 3a of the metal transparent conductive film 3 and the edge of the substrate 1 on the side of this edge 3a, and the conductive material 5 is made of silver paste printed. The conductive material 5 constitutes a ground portion.
前記保護層４は、前記導電材５の内側にある金
属透明導電膜３の上面全部と、この上面を囲む導
電材５の幅方向半分程とを覆つて形成されてい
る。また、保護層４は、金属透明導電膜３より硬
質で、金属透明導電膜３を摩耗等から保護するも
ので、透明性の高い有機塗料を印刷したり、酸化
インジウム・錫化合物、あるいは、酸化インジウ
ム、酸化錫SiO2等無機透明材料をイオンプレー
テイング法により金属半透過膜３と電極層５の上
に蒸着することにより、あるいは透明の樹脂フイ
ルムを貼着することにより形成される。 The protective layer 4 is formed to cover the entire upper surface of the metal transparent conductive film 3 inside the conductive material 5 and about half of the conductive material 5 surrounding this upper surface in the width direction. The protective layer 4 is harder than the metal transparent conductive film 3 and protects the metal transparent conductive film 3 from abrasion. It is formed by depositing an inorganic transparent material such as indium or tin oxide SiO 2 on the metal semi-transparent film 3 and the electrode layer 5 by ion plating, or by pasting a transparent resin film.
このように構成された電磁遮蔽板Ａは、電気抵
抗が100Ω以下で、光線透過率が50％以上であり、
導電性と透明性とを有しているから、例えば従来
例で示した金属箱の窓に使用した場合に、電気機
器などを確実に電磁遮蔽することができるととも
に、電磁遮蔽状態で内部のデイスプレイなどを外
から見ることができる。 The electromagnetic shielding plate A configured in this manner has an electrical resistance of 100Ω or less, a light transmittance of 50% or more,
Because it has conductivity and transparency, for example, when used in the window of the metal box shown in the conventional example, it can reliably shield electrical equipment, etc., and also protect the internal display in an electromagnetic shielded state. etc. can be seen from the outside.
その上、金属透明導電膜３の端縁３ａは銀製の
導電材５によつて覆われているので、剥離や損傷
の虞れはない。 Moreover, since the edge 3a of the metal transparent conductive film 3 is covered with the silver conductive material 5, there is no risk of peeling or damage.
なおまた、電極層５は、アルミ箔テープや導電
テープで形成してもよく、この場合には各テープ
を金属半透過膜３の端縁３ａと透明樹脂基板１の
縁部とにまたがらせて貼着することにする。 Furthermore, the electrode layer 5 may be formed of an aluminum foil tape or a conductive tape, and in this case, each tape is made to straddle the edge 3a of the metal semi-transparent film 3 and the edge of the transparent resin substrate 1. I decided to attach it.
また、金製の比較的硬質の金属半透過膜３の表
面に保護層４および電極層５が設けられているの
で、金属半透過膜３は外気中の水分等による影響
を受けずに剥がれ難く、かつ、摩耗等から保護さ
れ、抵抗値変化が少なく耐久性に優れている。 Furthermore, since the protective layer 4 and the electrode layer 5 are provided on the surface of the relatively hard metal semi-transparent membrane 3, the metal semi-transparent membrane 3 is not affected by moisture in the outside air and is difficult to peel off. In addition, it is protected from abrasion, has little change in resistance value, and has excellent durability.
ちなみに金に代えて酸化インジウム・錫化合物
を導電層として100Ω以下の電気抵抗値を得よう
とすると、その膜厚が大きくなつて、イオンプレ
ーテイング法による被膜成形工程に時間がかか
り、また、酸化物である被膜を透明樹脂基板１の
表面に厚肉に形成するから経時変化により歪が発
生して、変形やクラツクを生じ易いので、不適当
である。 By the way, if you try to obtain an electrical resistance value of 100Ω or less by using an indium/tin oxide compound as a conductive layer instead of gold, the film thickness will increase and the film forming process using the ion plating method will take time, and the oxidation Since a thick coating is formed on the surface of the transparent resin substrate 1, distortion occurs due to changes over time, which tends to cause deformation and cracks, which is inappropriate.
第３図は本考案の第２実施例を示すもので、こ
の実施例の電磁遮蔽板A′は、透明樹脂基板１の
上面に金属透明導電膜３′を前記第１実施例の電
磁遮蔽板Ａにおける場合と同様に形成するととも
に、金属透明導電膜３′の縁部３ｂを除く部分の
上面を保護層４′で覆い、この保護層４′の側縁
４′ａと導電膜３′の縁部３ｂと透明樹脂基板１′
の端縁とを覆つて銀製の導電材５′を形成するこ
とにより、目的を達成したものである。 FIG. 3 shows a second embodiment of the present invention, in which an electromagnetic shielding plate A' of this embodiment is a metal transparent conductive film 3' on the upper surface of a transparent resin substrate 1, unlike the electromagnetic shielding plate A' of the first embodiment. It is formed in the same manner as in case A, and the upper surface of the metal transparent conductive film 3' except for the edge 3b is covered with a protective layer 4', and the side edge 4'a of this protective layer 4' and the conductive film 3' are Edge 3b and transparent resin substrate 1'
This objective was achieved by forming a conductive material 5' made of silver so as to cover the edges of the conductive material 5'.
以上説明したように、本考案の電磁遮蔽板は、
透明樹脂基板の表面に電気抵抗値が100Ω以下の
金又は銀からなる薄肉状の金属透明導電膜を蒸着
形成し、該金属透明導電膜の端部周縁に該金属透
明導電膜より耐摩耗性の高い導電材で被覆しアー
ス部を形成したから、導電性および透明性を有
し、電気機器などを覆つてこれを電磁遮蔽でき、
かつ電磁遮蔽状態で内部を見ることができる。ま
た、金属透明導電膜は比較的軟質の金又は銀を透
明樹脂基板の縁部を除く表面に蒸着形成し、かつ
金属透明導電膜の端縁から透明樹脂基板の縁部ま
で導電材によつて被覆し、さらに金属透明導電膜
自体は保護層により被覆してあるので、金属透明
導電膜の端縁を完全に被覆でき、よつて金属透明
導電膜の特に端縁からの剥離及び摩耗を確実に防
止でき、アース部の耐久性に優れている。しか
も、各層は透明樹脂基板上に順次蒸着手段等によ
り形成されるから、各層を薄膜状に形成して被膜
成形工程の簡素化及び短時間化を図るとともに、
製造コストの低減化および電磁遮蔽板の大量生産
を図ることができる効果を奏する。
As explained above, the electromagnetic shielding plate of the present invention is
A thin metal transparent conductive film made of gold or silver with an electrical resistance value of 100Ω or less is formed by vapor deposition on the surface of a transparent resin substrate, and a thin metal transparent conductive film with more wear resistance than the metal transparent conductive film is formed around the edge of the metal transparent conductive film. Since the grounding part is coated with a highly conductive material, it has conductivity and transparency, and can be used to cover electrical equipment and shield it from electromagnetic waves.
It is also possible to see the inside while electromagnetically shielded. In addition, the metal transparent conductive film is formed by vapor-depositing relatively soft gold or silver on the surface of the transparent resin substrate except for the edges, and by applying a conductive material from the edge of the metal transparent conductive film to the edge of the transparent resin substrate. Furthermore, since the metal transparent conductive film itself is covered with a protective layer, the edges of the metal transparent conductive film can be completely covered, thus ensuring that peeling and abrasion of the metal transparent conductive film, especially from the edges, are prevented. It can be prevented and the earthing part has excellent durability. Moreover, since each layer is sequentially formed on a transparent resin substrate by means of vapor deposition, etc., each layer is formed into a thin film to simplify and shorten the film forming process.
This has the effect of reducing manufacturing costs and mass producing electromagnetic shielding plates.
第１図と第２図は本考案の第１実施例を示すも
ので、第１図は平面図、第２図は要部の断面図、
第３図は本考案の第２実施例の要部の断面図であ
る。
Ａ，A′……電磁遮蔽板、１，１′……透明樹脂
基板、３，３′……金属透明導電膜、４，４′……
保護層、５，５′……導電材。
1 and 2 show a first embodiment of the present invention, FIG. 1 is a plan view, FIG. 2 is a sectional view of the main parts,
FIG. 3 is a sectional view of a main part of a second embodiment of the present invention. A, A'... Electromagnetic shielding plate, 1, 1'... Transparent resin substrate, 3, 3'... Metal transparent conductive film, 4, 4'...
Protective layer, 5, 5'... conductive material.
Claims (1)
が100Ω以下の金又は銀からなる薄肉状の金属透
明導電膜３が蒸着により形成され、該金属透明導
電膜３の端部周縁３ａから前記金属透明導電膜３
の端部にかけて金属透明導電膜３より耐摩耗性の
高い導電材５で被覆されてアース部が形成される
と共に、該アース部の少なくとも一部を除いて前
記金属透明導電膜３の全表面が該金属透明導電膜
３より硬質の透明保護層４により被覆されてなる
ことを特徴とする透明電磁遮蔽板。 A thin metal transparent conductive film 3 made of gold or silver having an electrical resistance value of 100Ω or less is formed on the surface of the transparent resin substrate 1 except for the edges by vapor deposition, and the Metal transparent conductive film 3
The ends of the metal transparent conductive film 3 are covered with a conductive material 5 having higher abrasion resistance than the metal transparent conductive film 3 to form a grounding part, and the entire surface of the metal transparent conductive film 3 except for at least a part of the grounding part is A transparent electromagnetic shielding plate characterized in that it is coated with a transparent protective layer 4 that is harder than the metal transparent conductive film 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167221U JPH023677Y2 (en) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167221U JPH023677Y2 (en) | 1984-11-02 | 1984-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183099U JPS6183099U (en) | 1986-06-02 |
| JPH023677Y2 true JPH023677Y2 (en) | 1990-01-29 |
Family
ID=30725023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984167221U Expired JPH023677Y2 (en) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023677Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1677330B1 (en) * | 1996-09-26 | 2009-12-02 | Asahi Glass Company, Limited | Protective plate for a plasma display and a method for producing the same |
| JP6015185B2 (en) * | 2012-07-18 | 2016-10-26 | いすゞ自動車株式会社 | Piston structure of internal combustion engine |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825713B2 (en) * | 1976-07-21 | 1983-05-28 | 石川島播磨重工業株式会社 | Operation method in high sulfur oil gasification equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5133310U (en) * | 1974-09-02 | 1976-03-11 | ||
| JPS5825713U (en) * | 1981-07-28 | 1983-02-18 | トヨタ自動車株式会社 | electromagnetic shielding window glass |
| JPS59139318U (en) * | 1983-03-07 | 1984-09-18 | 三菱レイヨン株式会社 | A synthetic resin plate that is transparent and has an electromagnetic shielding effect. |
-
1984
- 1984-11-02 JP JP1984167221U patent/JPH023677Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825713B2 (en) * | 1976-07-21 | 1983-05-28 | 石川島播磨重工業株式会社 | Operation method in high sulfur oil gasification equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6183099U (en) | 1986-06-02 |
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