JPH0316318Y2 - - Google Patents
Info
- Publication number
- JPH0316318Y2 JPH0316318Y2 JP1983204378U JP20437883U JPH0316318Y2 JP H0316318 Y2 JPH0316318 Y2 JP H0316318Y2 JP 1983204378 U JP1983204378 U JP 1983204378U JP 20437883 U JP20437883 U JP 20437883U JP H0316318 Y2 JPH0316318 Y2 JP H0316318Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive layer
- electromagnetic shielding
- transparent resin
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000002335 surface treatment layer Substances 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000002834 transmittance Methods 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- -1 indium tin oxide compound Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
本考案は電気機器などの電磁遮蔽板に関するも
のである。[Detailed Description of the Invention] The present invention relates to an electromagnetic shielding plate for electrical equipment, etc.
一般に、電磁遮蔽を必要とする電気機器などを
電磁遮蔽する場合、アルミニウム、銅などの高導
電性材料からなる金属箱等により覆うことが行な
われている。 Generally, when electromagnetically shielding electrical equipment that requires electromagnetic shielding, it is covered with a metal box or the like made of a highly conductive material such as aluminum or copper.
ところで、このように電気機器などを金属箱等
により覆つて電磁遮蔽した状態であると、電気機
器の例えばデイスプレイなどを外から見たい場合
にこれを見ることができず、また、外からデイス
プレイなどが見えるようにするために、前記金属
箔に窓を形成したり、金属箱に代えて金網を使用
するようにすると、窓や網目から電磁波が洩れる
という不具合が生じる。 By the way, if electrical equipment is electromagnetically shielded by being covered with a metal box or the like, you will not be able to see the display of the electrical equipment from the outside. If a window is formed in the metal foil or a wire mesh is used in place of the metal box in order to make it visible, electromagnetic waves will leak through the window or mesh.
本考案は前記事情に鑑みてなされたもので、電
気機器などを外から見える状態で電磁遮蔽するこ
とができるとともに、耐久性の良い電磁遮蔽板を
提供することを目的とし、このような目的を達成
するために、透明樹脂により基板を形成し、その
表面に、電気抵抗値が100Ω以下とされて電磁遮
蔽効果を有する導電層を表面処理層を介して密着
させるとともに、導電層の上に保護層を設け、か
つ、光線透過率を50％以上としたことを特徴とす
るものである。 The present invention was developed in view of the above circumstances, and aims to provide a durable electromagnetic shielding plate that can electromagnetically shield electrical equipment etc. while being visible from the outside. To achieve this, a substrate is formed from a transparent resin, and a conductive layer with an electrical resistance value of 100Ω or less and an electromagnetic shielding effect is adhered to the surface of the substrate via a surface treatment layer, and a protective layer is placed on top of the conductive layer. It is characterized by having a layer and having a light transmittance of 50% or more.
以下、本考案を図面に示す一実施例に基づいて
説明する。 Hereinafter, the present invention will be explained based on an embodiment shown in the drawings.
本考案に係る電磁遮蔽板は、透明樹脂基板１の
片面に、表面処理層２と導電層３と保護層４とを
順次積層した４層構成とされている。 The electromagnetic shielding plate according to the present invention has a four-layer structure in which a surface treatment layer 2, a conductive layer 3, and a protective layer 4 are sequentially laminated on one side of a transparent resin substrate 1.
前記透明樹脂基板１は、アクリル樹脂、ポリカ
ーボネートなどの無色透明（例えば光線透過率が
90％以上）の樹脂からなるものである。 The transparent resin substrate 1 is made of a colorless and transparent material (for example, a material with low light transmittance) such as acrylic resin or polycarbonate.
90% or more) of resin.
前記表面処理層２は、前記透明樹脂基板１の表
面を平滑にして導電層３を密着させるためのもの
で、透明であることはもちろん加熱時などに透明
樹脂基板１から発生する可能性のある水分やモノ
マーなどを遮断し得るガスバリヤー性を有してお
り、例えば紫外線硬化型塗料、シリコーン樹脂系
塗料などを前記透明樹脂基板１の片面にコーテイ
ングすることにより形成される。 The surface treatment layer 2 is for smoothing the surface of the transparent resin substrate 1 and adhering the conductive layer 3 to it, and is transparent, as well as being transparent, and is free from any harmful substances that may be generated from the transparent resin substrate 1 during heating. It has gas barrier properties that can block moisture and monomers, and is formed by coating one side of the transparent resin substrate 1 with, for example, an ultraviolet curable paint or a silicone resin paint.
前記導電層３は、高導電材料である金からな
り、前記表面処理層２の上にイオンプレーテイン
グ法により100〜200Åの厚さに蒸着されて、電気
抵抗値が100Ω以下で、光線透過率が50％以上に
形成されている。これらの数値は、電気抵抗値が
100Ω以上になると導電性が小さくなつて電磁遮
蔽作用を発揮し難く、また、50％以上の光線透過
率では透視が極端に困難になるという理由により
決定したものである。 The conductive layer 3 is made of gold, which is a highly conductive material, and is deposited on the surface treatment layer 2 to a thickness of 100 to 200 Å by ion plating, and has an electrical resistance value of 100 Ω or less and a light transmittance. is formed in more than 50% of cases. These numbers are based on the electrical resistance value
This was determined because if the value exceeds 100Ω, the conductivity decreases and it is difficult to exhibit an electromagnetic shielding effect, and if the light transmittance exceeds 50%, it becomes extremely difficult to see through.
前記保護層４は、導電層３より硬質で、導電層
３の上に設けられてこれを摩耗等から保護するも
ので、透明性の高い有機塗料を印刷したり、酸化
インジウム・錫化合物あるいは酸化インジウム、
酸化錫等をイオンプレーテイング法により導電層
３の上に蒸着することにより形成される。なお、
有機塗料の印刷により形成する場合は、薄膜の導
電層３の粒子間に浸透して前記した電気抵抗値を
変化させないように、非溶剤タイプのものが使用
される。また、酸化インジウム・錫化合物等は導
電性を有するものであるが、これを蒸着する場
合、電磁遮蔽板としての前記した電気抵抗値を変
化させないように、膜厚が1000Å程度とされる。
因みに、金に代えて酸化インジウム・錫化合物を
導電層として100Ω以下の電気抵抗値を得ようと
すると、その膜厚が厚くなつて、イオンプレーテ
イング法による被膜成形工程に長時間かかり、ま
た、酸化物である被膜を透明樹脂基板１の表面に
厚肉に形成するから経時変化により歪が発生し
て、変形やクラツクを生じ易いので、不適当であ
る。 The protective layer 4 is harder than the conductive layer 3, and is provided on the conductive layer 3 to protect it from abrasion. indium,
It is formed by depositing tin oxide or the like on the conductive layer 3 using an ion plating method. In addition,
When forming by printing an organic paint, a non-solvent type is used so as not to penetrate between the particles of the thin conductive layer 3 and change the electrical resistance value described above. In addition, indium tin oxide compounds and the like have conductivity, and when deposited, the film thickness is set to about 1000 Å so as not to change the above-mentioned electrical resistance value as an electromagnetic shielding plate.
Incidentally, if an attempt is made to obtain an electrical resistance value of 100Ω or less by using an indium tin oxide compound instead of gold as a conductive layer, the film will become thicker and the film forming process using the ion plating method will take a longer time. Since a thick oxide film is formed on the surface of the transparent resin substrate 1, distortion occurs due to changes over time, which tends to cause deformation and cracks, which is unsuitable.
このように構成された電磁遮蔽板は、電気抵抗
値が100Ω以下で、光線透過率が50％以上とされ
て、導電性と透明性とを有しているから、例えば
前記従来例で示した金属箱等の窓に使用されて、
電気機器などを確実に電磁遮蔽することができる
とともに、電磁遮蔽状態で内部のデイスプレイな
どを外から見ることができる。 The electromagnetic shielding plate configured in this way has an electrical resistance value of 100Ω or less, a light transmittance of 50% or more, and has conductivity and transparency, so for example, as shown in the conventional example above, Used for windows of metal boxes, etc.
It is possible to reliably electromagnetically shield electrical equipment, etc., and the internal display etc. can be viewed from the outside while being electromagnetically shielded.
また、金からなる比較的軟質の導電層３の両面
に表面処理層２と保護層４とが設けられて、導電
層３が透明樹脂基板１内の水分や外気中の湿度な
どによる影響を受けずに剥がれ難く、かつ、摩耗
等から防護されて、抵抗値変化が少なく耐久性が
良い。 In addition, a surface treatment layer 2 and a protective layer 4 are provided on both sides of the relatively soft conductive layer 3 made of gold, so that the conductive layer 3 is not affected by moisture in the transparent resin substrate 1 or humidity in the outside air. It is resistant to peeling and is protected from wear, etc., and has good durability with little change in resistance value.
なお、本考案の電磁遮蔽板を金属箱等の窓とし
て使用する場合は、第２図に示すように、両端部
の導電層３を露出させて金属箱等との導通部を形
成しておくとよい。また、前記透明樹脂基板１を
予め、電気機器などを覆う箱状に形成しておいて
もよい。さらに、第１図に鎖線で示すように、透
明樹脂基板１の両面に表面処理層２，２′を設け
ることにより、電磁遮蔽板の両面の耐摩耗性を向
上させることができる。 In addition, when using the electromagnetic shielding plate of the present invention as a window of a metal box, etc., as shown in FIG. 2, the conductive layer 3 at both ends is exposed to form a conductive part with the metal box, etc. Good. Further, the transparent resin substrate 1 may be formed in advance into a box shape that covers electrical equipment or the like. Furthermore, as shown by the chain lines in FIG. 1, by providing surface treatment layers 2 and 2' on both sides of the transparent resin substrate 1, the abrasion resistance of both sides of the electromagnetic shielding plate can be improved.
以上説明したように、本考案の電磁遮蔽板は、
導電性及び透明性を有するから、電気機器などを
覆つてこれを電磁遮蔽でき、かつ電磁遮蔽状態で
内部を見ることができる。また、導電層が表面処
理層によつて透明樹脂基板に密着させられるとと
もに保護層に覆われているので、剥がれ難くなる
とともに摩耗等から防護されて、耐久性が良い。
しかも、導電層及び保護層は透明樹脂基板上に順
次蒸着されているから、各層を薄膜状に形成で
き、これにより、被膜成形工程が簡素かつ短時間
となり、製造コストの低減化および電磁遮蔽板の
大量生産を図ることができる。さらには、上記し
た各層により電磁遮蔽板を薄肉形成できるから、
光線透過率50％以上を容易に達成できるととも
に、電磁遮蔽板の適用範囲を広げることができる
効果を奏する。 As explained above, the electromagnetic shielding plate of the present invention is
Because it has conductivity and transparency, it can be used to cover electrical equipment to electromagnetically shield it, and it is also possible to see the inside of it while it is electromagnetically shielded. Furthermore, since the conductive layer is brought into close contact with the transparent resin substrate by the surface treatment layer and is covered by the protective layer, it becomes difficult to peel off and is protected from wear and the like, resulting in good durability.
In addition, since the conductive layer and the protective layer are sequentially deposited on the transparent resin substrate, each layer can be formed into a thin film, which simplifies and shortens the film forming process, reduces manufacturing costs, and reduces electromagnetic shielding. mass production can be achieved. Furthermore, since the electromagnetic shielding plate can be formed with a thin wall using each of the above-mentioned layers,
It is possible to easily achieve a light transmittance of 50% or more, and it also has the effect of expanding the range of application of electromagnetic shielding plates.
第１図は本考案の一実施例を示す縦断面図、第
２図は第１図における導電層の一部を露出させた
状態を示す平面図である。
１……透明樹脂基板、２……表面処理層、３…
…導電層、４……保護層。
FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and FIG. 2 is a plan view showing a state in which a part of the conductive layer in FIG. 1 is exposed. 1...Transparent resin substrate, 2...Surface treatment layer, 3...
...Conductive layer, 4...Protective layer.
Claims (1)
成され、この表面処理層２の上に電気抵抗値が
100Ω以下の導電層３が蒸着により形成され、こ
の導電層３の上に透明で前記導電層３より硬質な
保護層４が蒸着により形成され、かつ各層全体の
光線透過率が50％以上とされていることを特徴と
する電磁遮蔽板。 A transparent surface treatment layer 2 is formed on a transparent resin substrate 1, and an electric resistance value is formed on this surface treatment layer 2.
A conductive layer 3 having a resistance of 100Ω or less is formed by vapor deposition, and a protective layer 4 that is transparent and harder than the conductive layer 3 is formed on this conductive layer 3 by vapor deposition, and the light transmittance of each layer as a whole is 50% or more. An electromagnetic shielding plate characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20437883U JPS60109391U (en) | 1983-12-27 | 1983-12-27 | electromagnetic shielding plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20437883U JPS60109391U (en) | 1983-12-27 | 1983-12-27 | electromagnetic shielding plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60109391U JPS60109391U (en) | 1985-07-25 |
| JPH0316318Y2 true JPH0316318Y2 (en) | 1991-04-08 |
Family
ID=30766775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20437883U Granted JPS60109391U (en) | 1983-12-27 | 1983-12-27 | electromagnetic shielding plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60109391U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816599A (en) * | 1981-07-22 | 1983-01-31 | 凸版印刷株式会社 | Method of electromagnetically shielding |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5252758U (en) * | 1975-10-14 | 1977-04-15 | ||
| JPS59139318U (en) * | 1983-03-07 | 1984-09-18 | 三菱レイヨン株式会社 | A synthetic resin plate that is transparent and has an electromagnetic shielding effect. |
-
1983
- 1983-12-27 JP JP20437883U patent/JPS60109391U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816599A (en) * | 1981-07-22 | 1983-01-31 | 凸版印刷株式会社 | Method of electromagnetically shielding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60109391U (en) | 1985-07-25 |
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