JPS6334917Y2 - - Google Patents
Info
- Publication number
- JPS6334917Y2 JPS6334917Y2 JP1983032537U JP3253783U JPS6334917Y2 JP S6334917 Y2 JPS6334917 Y2 JP S6334917Y2 JP 1983032537 U JP1983032537 U JP 1983032537U JP 3253783 U JP3253783 U JP 3253783U JP S6334917 Y2 JPS6334917 Y2 JP S6334917Y2
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- synthetic resin
- resin plate
- conductive film
- transparent synthetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 30
- 239000000057 synthetic resin Substances 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- NNWNNQTUZYVQRK-UHFFFAOYSA-N 5-bromo-1h-pyrrolo[2,3-c]pyridine-2-carboxylic acid Chemical compound BrC1=NC=C2NC(C(=O)O)=CC2=C1 NNWNNQTUZYVQRK-UHFFFAOYSA-N 0.000 description 1
- 229920006353 Acrylite® Polymers 0.000 description 1
- 229920002574 CR-39 Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Description
【考案の詳細な説明】
（考案の属する技術分野）
本考案は、各種計測機器等の電子機器のカバー
材として用いる透視性を備えた合成樹脂板状体に
係るものである。[Detailed description of the invention] (Technical field to which the invention pertains) The present invention relates to a transparent synthetic resin plate-like body used as a cover material for electronic equipment such as various measuring instruments.
（考案の目的）
本考案の目的とするところは、透視性がありか
つ長期にわたつて電磁シールド効果を発揮する合
成樹脂板状体を、構造が簡易にして容易に提供し
ようとするものである。(Purpose of the invention) The purpose of the invention is to easily provide a synthetic resin plate-like body with a simple structure that is transparent and exhibits an electromagnetic shielding effect over a long period of time. .
（従来技術）
近年の電子工学の発展はめざましく、電子機器
類は多様化をきわめている。そして多くの電子機
器は、例えば通信のように本来的目的のためにあ
るいはその他の機器で副次的に派生するノイズと
して、電磁波が放出されるようになつている。こ
のような電磁波は、他の電子機器の正常な機能を
妨げることが多く、電磁波による悪影響を遮断す
る必要がたかまつている。(Prior Art) The development of electronic engineering has been remarkable in recent years, and electronic devices are becoming extremely diverse. Many electronic devices now emit electromagnetic waves for their original purpose, such as communication, or as secondary noise from other devices. Such electromagnetic waves often interfere with the normal functioning of other electronic devices, and there is a growing need to block the harmful effects of electromagnetic waves.
電磁波のシールドについては今までにも幾多の
提案がなされ、実用化されている。最も簡便な方
式としては、電磁波を吸収ないし反射する材料例
えば金属材料によつて機器のハウジングを構成す
ることが行なわれている。しかしながらこのよう
に金属材料で覆つてしまう方式では表示器の前面
板やCRTのカバーの場合のように透視性が要求
される場合に適用できない憾みがある。また導電
塗料を塗布する方法、亜鉛溶着を行なう方法も実
用化されているが、これも透視性を損うという点
においては上記と同じであり、解決には至らな
い。 Many proposals regarding shielding of electromagnetic waves have been made and put into practical use. The simplest method is to construct the housing of the device from a material that absorbs or reflects electromagnetic waves, such as a metal material. However, this method of covering with a metal material has the disadvantage that it cannot be applied to cases where transparency is required, such as the front panel of a display device or the cover of a CRT. Also, methods of applying conductive paint and methods of zinc welding have been put into practical use, but these also impair transparency and do not solve the problem.
このため透明性基板に対してその表面に導電性
膜を形成することも試みられているが、導電性膜
の剥離や汚損あるいは水分やガスによる劣化が懸
念され、本質的な問題解決にはなつていないのが
現状である。 For this reason, attempts have been made to form a conductive film on the surface of a transparent substrate, but this does not solve the fundamental problem as there are concerns that the conductive film may peel off, become contaminated, or deteriorate due to moisture or gas. The current situation is that this is not the case.
（考案の構成）
本考案はこのような状況に鑑みてなされたもの
で、その要旨とするところは、透明導電膜を少な
くとも一面に形成した透明合成樹脂板と他の透明
合成樹脂板とからなり、両透明合成樹脂板を金属
または金属酸化物からなる透明導電膜を挟着する
ように透明接着剤をもつて積層一体化し、かつ所
望端縁部に上記透明導電膜に直接接触するように
金属薄片製の電極を設けたことを特徴とする透明
で電磁シールド効果のある合成樹脂板状体にあ
る。(Structure of the invention) The present invention was made in view of the above situation, and its gist is that it consists of a transparent synthetic resin plate on which a transparent conductive film is formed on at least one surface, and another transparent synthetic resin plate. , both transparent synthetic resin plates are laminated and integrated with a transparent adhesive so that a transparent conductive film made of metal or metal oxide is sandwiched therebetween, and a metal is placed on a desired edge so as to be in direct contact with the transparent conductive film. It is a synthetic resin plate-like body that is transparent and has an electromagnetic shielding effect, and is characterized by being provided with electrodes made of thin flakes.
以下、本考案を実施例の図面に従つて説明す
る。 The present invention will be described below with reference to drawings of embodiments.
図中１は透明導電膜３を片面に有する透明合成
樹脂板で、熱成形が容易で機械加工が手軽にでき
る熱可塑性合成樹脂板状体が望ましく、例えばア
クリル樹脂、スチレン樹脂、ポリカーボネート樹
脂、ポリアリルジグリコールカーボネート樹脂、
ポリエチレンテレフタレート樹脂からなるものが
用いられる。なおこの透明合成樹脂板１は無色透
明が一般的であるが、透視性を損わない程度に着
色されていてもよい。また、予め彎曲状等に成形
されていてもよい。 In the figure, 1 is a transparent synthetic resin plate having a transparent conductive film 3 on one side, preferably a thermoplastic synthetic resin plate that can be easily thermoformed and machined, such as acrylic resin, styrene resin, polycarbonate resin, polycarbonate resin, etc. allyl diglycol carbonate resin,
A material made of polyethylene terephthalate resin is used. Although this transparent synthetic resin plate 1 is generally colorless and transparent, it may be colored to the extent that visibility is not impaired. Further, it may be formed in advance into a curved shape or the like.
上記透明合成樹脂板１に形成する透明導電膜３
としては、金、酸化チタン、酸化インジユウム、
酸化スズ等が用いられるが、勿論透明性を有し導
電性があれば他の金属または金属化合物を使用す
ることもできる。また必要に応じてアルミニウ
ム、酸化アルミニウム、クロム、酸化ケイ素等の
膜を積層することも可能である。透明導電膜３の
形成方法は、真空蒸着、スパツタリング蒸着ある
いはイオンプレーテイング等の方法によつて行な
われる。 A transparent conductive film 3 formed on the transparent synthetic resin plate 1
Examples include gold, titanium oxide, indium oxide,
Although tin oxide and the like are used, other metals or metal compounds can of course be used as long as they are transparent and conductive. If necessary, it is also possible to laminate a film of aluminum, aluminum oxide, chromium, silicon oxide, etc. The transparent conductive film 3 is formed by a method such as vacuum deposition, sputtering deposition, or ion plating.
また図中２は、上記透明合成樹脂１と対をなし
て用いられる他の透明合成樹脂板で、同様の平板
状あるいは彎曲状等の合成樹脂材料が使用され
る。この透明合成樹脂板１は、上記透明合成樹脂
板２における透明導電膜３を挟着するようにして
積層されるが、両透明合成樹脂板１，２との間に
は透明接着剤５が注入され、これによつて一体化
されている。なお、このときの透明接着剤５とし
ては例えば無溶剤系のウレタン樹脂系接着剤、エ
ポキシ樹脂系接着剤あるいは熱硬化タイプまたは
紫外線硬化タイプのシリコーン樹脂系接着剤が用
いられる。 Reference numeral 2 in the figure denotes another transparent synthetic resin plate used as a pair with the transparent synthetic resin 1, and a similar flat or curved synthetic resin material is used. This transparent synthetic resin plate 1 is laminated so as to sandwich the transparent conductive film 3 of the transparent synthetic resin plate 2, and a transparent adhesive 5 is injected between both transparent synthetic resin plates 1 and 2. and are thereby unified. As the transparent adhesive 5 at this time, for example, a solvent-free urethane resin adhesive, an epoxy resin adhesive, or a thermosetting type or ultraviolet curing type silicone resin adhesive is used.
図中４は、上記透明導電膜３に直接接触するよ
うになつている金属薄片製の電極で、積層一体化
される板状体の所望端縁部に設けられている。図
示の例においては他の合成樹脂板２を小型のもの
を用い、端縁に段差ができるようにしているが、
この段差の部分に上記の電極４を設けると都合が
よい。 In the figure, reference numeral 4 denotes an electrode made of a thin metal flake that comes into direct contact with the transparent conductive film 3, and is provided at a desired edge of the plate-shaped body to be integrated. In the illustrated example, the other synthetic resin plate 2 is made of a small size so that a step is formed at the edge.
It is convenient to provide the above-mentioned electrode 4 at this step portion.
なお図示の例においては、片面に透明導電膜３
を有する透明合成樹脂板１と他の透明合成樹脂板
２の２枚構成となつているが、両面に透明導電膜
３を形成した透明合成樹脂板１を用いるときは、
他の透明合成樹脂板２を２枚用い、両面から積層
して一体化すればよい。なお本考案によつて得ら
れた板状体は、強固に一体化されているため、折
曲げや軽度の彎曲状等の成形が可能である。 In the illustrated example, a transparent conductive film 3 is provided on one side.
The transparent synthetic resin plate 1 has a transparent conductive film 3 on both sides, and the transparent synthetic resin plate 1 has a transparent conductive film 3 on both sides.
Two other transparent synthetic resin plates 2 may be used and laminated from both sides to be integrated. Note that since the plate-shaped body obtained by the present invention is strongly integrated, it can be bent or formed into a slightly curved shape.
以下具体的な実施例について説明する。 Specific examples will be described below.
縦、横200×200mmで、厚さ３mmの透明アクリル
樹脂板（三菱レイヨン社製アクリライト）の片面
に、金の透明導電膜（厚さ100Å）を真空蒸着法
によつて形成した。次いでこの樹脂板の両端縁
に、通電用端子として銅箔（住友スリーエム社製
テープ状銅箔No.1181）を直接接触するように取り
付けた。なおこの状態での表面電気抵抗は75Ω／
□、全光線透過率は68％で、透明導電膜はガーゼ
で軽くこすつても剥れる程度であつた。 A transparent conductive gold film (thickness: 100 Å) was formed on one side of a transparent acrylic resin plate (acrylite manufactured by Mitsubishi Rayon Co., Ltd.) measuring 200×200 mm in length and width and 3 mm in thickness by vacuum evaporation. Next, copper foil (tape-shaped copper foil No. 1181 manufactured by Sumitomo 3M Co., Ltd.) was attached to both ends of this resin plate so as to be in direct contact with each other as current-carrying terminals. The surface electrical resistance in this state is 75Ω/
□, the total light transmittance was 68%, and the transparent conductive film could be peeled off even if rubbed lightly with gauze.
次に上記と同じ厚さで大きさ200×180mmの透明
アクリル樹脂板を、両樹脂板間にシリコーン樹脂
系接着剤（信越シリコーン社製KE109）を注入
し、80℃で４時間加熱して、両者を積層一体化
し、本考案の製品を得た。 Next, a transparent acrylic resin plate with the same thickness as above and a size of 200 x 180 mm was injected with a silicone resin adhesive (KE109 manufactured by Shin-Etsu Silicone Co., Ltd.) between both resin plates, and heated at 80 ° C for 4 hours. The product of the present invention was obtained by laminating and integrating both.
この製品について測定したところ、全光線透過
率が68％、表面電気抵抗が75Ω／□であり、初期
の値と変わつておらず、しかもこの製品を60℃の
温水中に10日間浸漬した結果においても、上記値
は何等変化しない優れたものであつた。 When this product was measured, the total light transmittance was 68% and the surface electrical resistance was 75Ω/□, which were unchanged from the initial values. However, the above values were excellent and did not change in any way.
（考案の効果）
本考案は以上詳述した如き構成からなるもので
あるから、透視性がありかつ長期にわたつて確実
で性能の高い電磁シールド効果を発揮する合成樹
脂板状体を提供しうる利点がある。(Effects of the Invention) Since the present invention has the configuration as detailed above, it is possible to provide a synthetic resin plate-like body that is transparent and exhibits a reliable and high-performance electromagnetic shielding effect over a long period of time. There are advantages.
第１図は本考案の実施例を示す拡大断面図であ
る。
１……透明合成樹脂板、２……他の透明合成樹
脂板、３……透明導電膜、４……電極、５……透
明接着剤。
FIG. 1 is an enlarged sectional view showing an embodiment of the present invention. 1... Transparent synthetic resin plate, 2... Other transparent synthetic resin plate, 3... Transparent conductive film, 4... Electrode, 5... Transparent adhesive.
Claims (1)
合成樹脂板と他の透明合成樹脂板とからなり、
両透明合成樹脂板を金属または金属酸化物から
なる透明導電膜を挟着するように透明接着剤を
もつて積層一体化し、かつ所望端縁部に上記透
明導電膜に直接接触するように金属薄片製の電
極を設けたことを特徴とする透明で電磁シール
ド効果のある合成樹脂板状体。 ２ 透明導電膜を形成した透明合成樹脂板に対
し、他の透明合成樹脂板が小型であることを特
徴とする実用新案登録請求の範囲第１項記載の
透明で電磁シールド効果のある合成樹脂板状
体。[Claims for Utility Model Registration] 1. Consisting of a transparent synthetic resin plate on which a transparent conductive film is formed on at least one surface and another transparent synthetic resin plate,
Both transparent synthetic resin plates are laminated together using a transparent adhesive so that a transparent conductive film made of metal or metal oxide is sandwiched therebetween, and a thin metal piece is placed at a desired edge so as to directly contact the transparent conductive film. A synthetic resin plate-shaped body that is transparent and has an electromagnetic shielding effect, and is characterized by having an electrode made of aluminum. 2. A transparent synthetic resin plate having an electromagnetic shielding effect as set forth in claim 1 of the utility model registration claim, wherein the other transparent synthetic resin plates are smaller than the transparent synthetic resin plate on which the transparent conductive film is formed. body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3253783U JPS59139318U (en) | 1983-03-07 | 1983-03-07 | A synthetic resin plate that is transparent and has an electromagnetic shielding effect. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3253783U JPS59139318U (en) | 1983-03-07 | 1983-03-07 | A synthetic resin plate that is transparent and has an electromagnetic shielding effect. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59139318U JPS59139318U (en) | 1984-09-18 |
| JPS6334917Y2 true JPS6334917Y2 (en) | 1988-09-16 |
Family
ID=30163354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3253783U Granted JPS59139318U (en) | 1983-03-07 | 1983-03-07 | A synthetic resin plate that is transparent and has an electromagnetic shielding effect. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59139318U (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109391U (en) * | 1983-12-27 | 1985-07-25 | 釜屋化学工業株式会社 | electromagnetic shielding plate |
| JPH023677Y2 (en) * | 1984-11-02 | 1990-01-29 | ||
| JPH0546320Y2 (en) * | 1986-08-13 | 1993-12-03 | ||
| JPH0717199Y2 (en) * | 1986-09-27 | 1995-04-19 | 段谷産業株式会社 | Electromagnetic wave shield plywood |
| JPH0745997Y2 (en) * | 1987-12-15 | 1995-10-18 | 株式会社巴川製紙所 | Adhesive sheet for transparent electromagnetic wave shield |
| JP2698397B2 (en) * | 1988-10-19 | 1998-01-19 | 三井東圧化学株式会社 | Window plate for electromagnetic wave shielding |
| JP2001183988A (en) * | 1999-12-24 | 2001-07-06 | Arisawa Mfg Co Ltd | Front plate for plasma display and its manufacturing method |
| JP4669724B2 (en) * | 2005-03-25 | 2011-04-13 | Ｎｅｃネットワーク・センサ株式会社 | Display panel mounting structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535282A (en) * | 1976-07-05 | 1978-01-18 | Teijin Ltd | Conductive plastic sheets having rub resistance |
| JPS54150417A (en) * | 1978-05-19 | 1979-11-26 | Hitachi Ltd | Production of transparent conductive layer |
| JPS5686407A (en) * | 1979-12-15 | 1981-07-14 | Nitto Electric Ind Co | Transparent conductive film and method of manufacturing same |
| JPS591247A (en) * | 1982-06-28 | 1984-01-06 | 旭化成株式会社 | Composite film or shape |
-
1983
- 1983-03-07 JP JP3253783U patent/JPS59139318U/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535282A (en) * | 1976-07-05 | 1978-01-18 | Teijin Ltd | Conductive plastic sheets having rub resistance |
| JPS54150417A (en) * | 1978-05-19 | 1979-11-26 | Hitachi Ltd | Production of transparent conductive layer |
| JPS5686407A (en) * | 1979-12-15 | 1981-07-14 | Nitto Electric Ind Co | Transparent conductive film and method of manufacturing same |
| JPS591247A (en) * | 1982-06-28 | 1984-01-06 | 旭化成株式会社 | Composite film or shape |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59139318U (en) | 1984-09-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW332299B (en) | Transparent electrically conductive film-attached substrate and display element using IT | |
| US4258096A (en) | Composite top membrane for flat panel switch arrays | |
| KR101270784B1 (en) | Electroconductive laminate, and electromagnetic wave shielding film and protective plate for plasma display | |
| CN112909069A (en) | Display module and display device | |
| ATE21315T1 (en) | CLEAR ELECTROMAGNETIC SCREEN AND ITS MANUFACTURING PROCESS. | |
| JPS63271867A (en) | Bus bar assembly with electric conductor | |
| TWI229284B (en) | Input device | |
| TW201017274A (en) | Touch input function-equipped protection panel with excellent surface flatness and electronic device with the same | |
| JPS6334917Y2 (en) | ||
| US4590534A (en) | Tubes for integrated circuits | |
| JPH0713695A (en) | Transparent touch panel | |
| JPS6139144A (en) | Small-sized electronic equipment | |
| JPH0710998U (en) | Electronic circuit cover with electromagnetic wave blocking function | |
| JP3018780U (en) | Touch panel | |
| CN216133864U (en) | Display module and display device | |
| CN209858912U (en) | Electromagnetic shielding liquid crystal display screen | |
| JPH0126446Y2 (en) | ||
| JPH0431631Y2 (en) | ||
| JPS5593127A (en) | Thin type tn-type liquid crystal display device | |
| JPH0544815Y2 (en) | ||
| JPH1197878A (en) | Electromagnetic wave shielding light-transmitting window material | |
| JPH023677Y2 (en) | ||
| US3052811A (en) | Electroluminescent cell | |
| JPH0319003Y2 (en) | ||
| JPS6035769B2 (en) | switch matrix device |