CN107045399B - Touch panel and manufacturing method thereof - Google Patents
Touch panel and manufacturing method thereof Download PDFInfo
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- CN107045399B CN107045399B CN201610083667.1A CN201610083667A CN107045399B CN 107045399 B CN107045399 B CN 107045399B CN 201610083667 A CN201610083667 A CN 201610083667A CN 107045399 B CN107045399 B CN 107045399B
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a touch panel adopting metal grids as materials, which comprises a substrate and an induction layer; the induction layer is arranged on the substrate and is formed into a grid shape by a plurality of composite metal fine wires in a staggered way, and each composite metal fine wire comprises a metal layer and a first nickel copper titanium layer, wherein the metal layer is arranged between the substrate and the first nickel copper titanium layer. By adopting the touch panel provided by the invention, the first nickel copper titanium layer is arranged on the surface of the metal layer, so that the metal layer can be prevented from being oxidized in the subsequent process, and the possibility of realizing the thin line width of the metal grid is provided. The invention also provides a manufacturing method of the touch panel.
Description
Technical Field
The present invention relates to a touch panel, and more particularly, to a touch panel made of metal mesh material and a method for manufacturing the same.
Background
Related products related to touch panels have been used in daily life and daily work, and generally, a touch panel structure includes a sensing area formed on a surface of a substrate, the sensing area being used to sense a finger of a human body or a writing tool similar to a pen to achieve a touch effect.
In the current touch panel of the mobile terminal, ITO is an indispensable material, but the ITO also has the problems of high cost, difficult recovery and the like. In order to get rid of price competition of the traditional ITO touch panel and cope with the development bottleneck of the current industry, manufacturers are searching for new material technology to replace ITO so as to reduce cost and obtain profits.
The metal mesh touch panel technology is favored by mainstream PC manufacturers because of the advantages of low resistivity, easy material acquisition, simple process, etc., and is used for large-size panels such as NB and AIO PC. However, metal grids (metal mesh) have several disadvantages, for example, the metal material used in the metal grid has strong reflectivity, and blackening (blackening) is usually required on the surface of the grid line to reduce the reflectivity, but the blackening process increases the process steps, and the manufactured metal grid is exposed to air in the blackening process, so that oxidation is very easy to occur to increase the resistance value, and the line width of the metal grid needs to be properly increased to ensure that the resistance value meets the requirements of the panel. The wire width of the metal mesh is usually more than 5 μm; the visual Morey interference produced by a metal wire web above 5 μm is too pronounced. The problem of interference between light reflection and Morey results in poor visual effect, and is difficult to drive into the market of medium-high-order products.
Disclosure of Invention
In view of the foregoing, an embodiment of the present invention provides a touch panel using a metal mesh as a material, including a substrate, a sensing layer disposed on the substrate, wherein the sensing layer is formed by a plurality of composite metal thin lines, the composite metal thin lines are interlaced to form a mesh shape, and each of the composite metal thin lines includes a metal layer and a first nickel copper titanium layer, and the metal layer is disposed between the substrate and the first nickel copper titanium layer.
In one embodiment, the first nickel copper titanium layer contains 35% -50% nickel, 4% -10% copper and 44% -55% titanium.
In one embodiment, the thickness of the first nickel copper titanium layer is 10-30 nm.
In one embodiment, the metal layer is copper, aluminum, gold, or silver.
In one embodiment, the thickness of the metal layer is between 100 and 400nm.
In one embodiment, the thin metal wire has a width of less than 5 microns.
In one embodiment, the thin metal wire has a width of 1 to 3 μm.
In an embodiment, the reflectivity of the first nickel copper titanium layer is less than or equal to 60%.
In an embodiment, the touch panel further includes a protective cover plate disposed on a side of the first nickel copper titanium layer away from the metal layer.
In an embodiment, the composite metal thin wire further includes a second nickel copper titanium layer disposed between the metal layer and the substrate.
In one embodiment, the second nickel copper titanium layer contains 35% -50% nickel, 4% -10% copper and 44% -55% titanium.
In one embodiment, the thickness of the second nickel copper titanium layer is 10-30 nm.
In an embodiment, the reflectivity of the second nickel copper titanium layer is less than or equal to 65%.
In an embodiment, the touch panel further includes a protective cover disposed on a side of the substrate away from the second nickel copper titanium layer.
In an embodiment, the substrate is a protective cover plate of the touch panel.
An embodiment of the present invention further provides a method for manufacturing a touch panel, including the following steps: s1, providing a bearing plate and a vacuum device; s2, providing a metal target, and sputtering a metal layer on one side of the bearing plate in the vacuum device; s3, providing a first nickel-copper-titanium alloy target, and sputtering a first nickel-copper-titanium layer on one side of the metal layer far away from the bearing plate in the vacuum device; and S4, patterning the metal layer and the first nickel copper titanium layer to form a grid-shaped induction layer with induction electrodes.
In one embodiment, the metal target is copper, aluminum, gold, or silver.
In one embodiment, the nickel-copper-titanium alloy target contains 35% -50% of nickel, 4% -10% of copper and 44% -55% of titanium.
In one embodiment, before step S2, a step S10 is further included: and providing a second nickel-copper-titanium alloy target, and sputtering a second nickel-copper-titanium layer on one side of the bearing plate in the vacuum device.
In one embodiment, in step S2, the metal layer is sputtered on a side of the second nickel copper titanium layer away from the carrier plate.
The touch panel and the manufacturing method of the touch panel provided by the embodiment of the invention can avoid the problem that the surface layer of the metal layer in the metal grid is oxidized after patterning, and further, the line width of the metal grid can be smaller than 5um, so that the influence of Morey interference is reduced.
Drawings
Fig. 1 to 4 are side views of touch panels according to some embodiments of the invention.
Fig. 5 is a schematic diagram of a manufacturing process of a touch panel according to the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and the detailed description.
Referring to fig. 1, fig. 1 is a side view of a touch panel 100 according to an embodiment of the invention. The touch panel 100 includes: a substrate 12, a sensing layer 16 disposed on a surface of the substrate 12. The sensing layer 16 is formed by a plurality of composite metal thin wires 20, the composite metal thin wires 20 are interlaced to form a grid shape, and the composite metal thin wires 20 include a metal layer 22 and a first nickel copper titanium layer 24, wherein the metal layer 22 is disposed on the substrate 12, the first nickel copper titanium layer 24 is disposed on a side of the metal layer 22 away from the substrate 12, i.e. the metal layer 22 is located between the substrate 12 and the first nickel copper titanium layer 24.
In this embodiment, the substrate 12 is made of a transparent material, and is mainly used for carrying the sensing layer 16, and the substrate 12 may be a glass substrate or a film substrate.
In the present embodiment, the first nickel copper titanium layer 24 may comprise nickel copper titanium alloy with various proportions, and in a preferred embodiment, the first nickel copper titanium layer 24 comprises nickel with a nickel content of 35% -50%, copper with a copper content of 4% -10%, and titanium with a titanium content of 44% -55%. The first nickel copper titanium layer 24 has higher resistivity than the metal layer 22, but has excellent oxidation resistance than the metal layer 22, and the first nickel copper titanium layer 24 has a dense structure, so that when the first nickel copper titanium layer 24 is disposed on the metal layer 22, oxygen is difficult to penetrate the first nickel copper titanium layer 24 to oxidize the metal layer 22, and even in a high-oxygen environment, the first nickel copper titanium layer 24 itself is oxidized, and a more dense oxide layer can be rapidly formed on the surface layer to prevent further oxidation inside. I.e., the first nickel copper titanium layer 24 requires only an extremely thin thickness (e.g., 10-30 nm, 20nm in this embodiment) to protect the metal layer 22 from oxidation. More importantly, the first nickel copper titanium layer 24 and the metal layer 22 can be simultaneously etched by the same etching solution or laser during the subsequent patterning process (e.g. lithography or laser etching), because the two materials are similar (both are metal materials); in addition, the first nickel copper titanium layer 24 and the metal layer 22 can be sputtered on the surface of the substrate 12 in the same vacuum device, and the whole process only needs to replace the target material without changing the vacuum environment; this largely avoids the opportunity for the metal layer 22, and particularly the already patterned metal layer 22, to oxidize when exposed to air.
In the present embodiment, based on the requirement of the touch panel 100 on the resistivity of the sensing layer 16, the material of the metal layer 22 may be copper, aluminum, gold or silver, and in the present embodiment, based on the requirements of economy and resistivity of the material, the adhesion between the metal layer and the first nickel copper titanium layer 24, the matching degree of the material, and the like, the material of the metal layer 22 is preferably copper. Although the first nickel copper titanium layer 24 has higher resistivity than the metal layer 22, the resistivity is far lower than that of the oxide of the metal layer 22, so in this embodiment, the thickness of the metal layer 22 is not required to be increased intentionally to ensure that the resistivity meets the requirement of the touch panel, and the thickness is only required to be controlled to be 50-400 nm.
The first nickel copper titanium layer 24 and the metal layer 22 can be formed in the same vacuum device and patterned in the same etching step by adopting the grid-shaped sensing layer 16 formed by interlacing the composite metal fine wires 20 provided by the embodiment, and the fine wiring of the metal grid is realized by adding the excellent oxidation resistance of the first nickel copper titanium layer, so that the Morel interference can be avoided. In the present embodiment, the line width of the composite metal thin line 20 may be less than 5 μm, for example, between 1 and 3 μm.
The traditional thin metal wires, such as copper, aluminum, gold or silver, have high reflectivity, and the reflectivity of the materials in the visible wavelength range is over 95 percent, so that the wider the thin metal wires are, the more obvious the light reflection is, and therefore, a blackening layer is required to be additionally arranged to solve the problem of over-strong light reflection. The grid-shaped sensing layer 16 formed by the staggered composite metal thin wires 20 can solve the problem of strong reflection due to the smaller line width of the composite metal thin wires 20. Furthermore, the reflectivity of the first nickel copper titanium layer 24 in the visible light range can be controlled to be 65% or less, so that the problem that the appearance is affected due to too strong line reflection can be avoided without providing additional blackening layers on the grid-shaped sensing layer 16 formed by the staggered composite metal thin wires 20 according to the invention. Please further refer to fig. 2.
Fig. 2 is a side view of a touch panel 200 according to an embodiment of the invention. Unlike the touch panel 100, the touch panel 200 further includes a protective cover 26, and the protective cover 26 is an interface for a user of the touch panel 200 to touch and view, and is also used for protecting the internal structure of the touch panel 200. Which may be a strengthened glass substrate, sapphire, or an explosion-proof membrane. The protective cover 26 is disposed on a side of the sensing layer 16 away from the substrate 12, and more specifically, the protective cover 26 is disposed on a side of the first nickel copper titanium layer 24 away from the metal layer 22.
The composite metal mesh of the sensing layer 16 may be partially disconnected according to the need to form a plurality of first-direction sensing electrodes, and the touch panel 200 may further include another sensing layer and another substrate between the sensing layer 16 and the protective cover 26 or on a side of the substrate 12 away from the protective cover 26, so as to form a sensing structure, where the other sensing layer is provided with a plurality of second-direction sensing electrodes (the second direction is different from the first direction); the sensing layer 16 may also be provided as a sensing structure including a plurality of first direction sensing electrodes and second direction sensing electrodes. The arrangement of the sensing structure is not described here in detail.
Referring to fig. 3, fig. 3 is a side view of a touch panel 300 according to another embodiment of the invention. Unlike the touch panel 100, the touch panel 300 further includes a second nickel copper titanium layer 28 disposed between the metal layer 22 and the substrate 12. Namely, the composite metal thin wire 20 'of the sensing layer 16' comprises a metal layer 22, a first nickel copper titanium layer 24 and a second nickel copper titanium layer 28, wherein the metal layer 22 is sandwiched between the first nickel copper titanium layer 24 and the second nickel copper titanium layer 28. Similar to the first nickel copper titanium layer, in this embodiment, the second nickel copper titanium layer 28 may comprise nickel copper titanium alloy in various proportions, preferably 35% to 50% nickel, 4% to 10% copper, 44% to 55% titanium. The second nickel copper titanium layer 28 and the metal layer 22 and the first nickel copper titanium layer 24 can be sputtered by the same vacuum device and patterned simultaneously in the same etching process. The thickness of the second nickel copper titanium layer 28 is 10 to 30nm, for example 20nm. The second nickel copper titanium layer 28 has a reflectance of 65% or less in the visible light range. In contrast, in the present embodiment, the second nickel copper titanium layer 28 mainly uses its better adhesion with the substrate 12 to enhance the adhesion effect between the metal layer 22 and the substrate 12, especially when the material of the substrate 12 is a thin film substrate, the adhesion enhancing effect is particularly remarkable.
Referring to fig. 4 again, fig. 4 is a side view of a touch panel 400 according to another embodiment of the invention. Unlike the touch panel 200, the protective cover 26 of the touch panel 400 is not limited to be disposed on the side of the sensing layer 16 'away from the substrate 12, but may be disposed on the side of the substrate 12 away from the sensing layer 16', and specifically, the protective cover 26 may be disposed on the side of the substrate 12 away from the second nickel copper titanium layer 28.
Therefore, the present invention can also cover the case that the sensing layer 16' with the first direction sensing electrode and the sensing layer 16' with the second direction sensing electrode are respectively disposed on the opposite surfaces of the substrate 12, and the protective cover 26 is attached to the side where any of the sensing layers 16' is disposed to form a touch panel; and a touch panel is formed by providing the sensing layer 16 having the first direction sensing electrode on the side of the substrate 12 close to the protective cover 26, and providing the sensing layer 16' having the second direction sensing electrode on the side of the substrate 12 far from the protective cover 26. Further, the substrate 12 provided with the sensing layer 16 'may be directly used as a protective cover plate of the touch panel, i.e. the sensing layer 16' may be directly disposed on the protective cover plate.
In order to achieve the effects of oxidation resistance and fine circuit of the metal grid, the invention also provides a manufacturing method of a touch panel, please refer to fig. 5, fig. 5 is a schematic diagram of a manufacturing flow of the touch panel, which comprises the following steps:
s1, providing a bearing plate and a vacuum device. The carrier plate in step S1 is not limited to the substrate 12 of the touch panels 100, 200, 300, 400, but may be other carriers, even an opaque carrier, mainly used for carrying the metal mesh formed by interlacing the composite metal thin wires 20 or 20' of the present invention; when the carrier is the substrate 12, the carrier can be directly used for manufacturing the touch panel later, and when the carrier is other carriers, the composite metal grid can be transferred onto the substrate 12 in a gravure printing or other transfer printing mode after being formed later. The vacuum device in step S1 is mainly used for providing a vacuum environment, so as to avoid oxidation of metal during subsequent sputtering of the metal layer.
S2, providing a metal target, and sputtering a metal layer on one side of the bearing plate in the vacuum device. The metal target may be a copper target, an aluminum target, a gold target or a silver target, preferably a copper target.
S3, providing a first nickel copper titanium alloy target, and sputtering a first nickel copper titanium layer on one side of the metal layer far away from the bearing plate in the vacuum device. The first nickel-copper-titanium alloy target contains 35-50% of nickel, 4-10% of copper and 44-55% of titanium.
S4, patterning the metal layer and the first nickel copper titanium layer to form a grid-shaped induction layer with induction electrodes. The patterning is preferably a photolithography or a laser etching, which can ensure that the composite fine metal wire comprising the metal layer and the first nickel copper titanium layer achieves a line width of less than 5 μm.
Before the step S2, another step S10 may be further included, in which a second nickel-copper-titanium alloy target is provided, and a second nickel-copper-titanium layer is sputtered on a side of the carrier plate where the metal layer is formed in the vacuum apparatus. In step S2, a metal layer is sputtered on a side of the second nickel copper titanium layer away from the carrier plate. Correspondingly, in step S4, the metal layer and the first nickel copper titanium layer are patterned, and the second nickel copper titanium layer is also patterned to form a grid-like sensing layer with sensing electrodes. The second nickel copper titanium alloy target material may be the same as or different from the first nickel copper titanium alloy target material, and in a preferred embodiment, the second nickel copper titanium alloy target material contains 35% -50% nickel, 4% -10% copper, and 44% -55% titanium.
The above embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the principles of the present invention should be included in the scope of the present invention.
Claims (17)
1. A touch panel, comprising:
a substrate having a plurality of substrates,
the induction layer is arranged on the substrate and consists of a plurality of composite metal thin wires, the composite metal thin wires are staggered to form a grid shape, each composite metal thin wire comprises a metal layer and a first nickel copper titanium layer, and the metal layer is arranged between the substrate and the first nickel copper titanium layer;
the first nickel-copper-titanium layer contains 35-50% of nickel, 4-10% of copper and 44-55% of titanium;
the reflectivity of the first nickel copper titanium layer is less than or equal to 65%.
2. The touch panel of claim 1, wherein: the thickness of the first nickel copper titanium layer is 10-30 nm.
3. The touch panel of claim 1, wherein: the metal layer is copper, aluminum, gold or silver.
4. The touch panel of claim 1, wherein: the thickness of the metal layer is 100-400 nm.
5. The touch panel of claim 1, wherein: the thin metal wire has a width of less than 5 μm.
6. The touch panel of claim 1, wherein: the width of the metal thin wire is 1-3 micrometers.
7. The touch panel of claim 1, wherein: the touch panel further comprises a protective cover plate which is arranged on one side of the first nickel copper titanium layer away from the metal layer.
8. The touch panel of claim 1, wherein: the composite metal fine wire also comprises a second nickel copper titanium layer which is arranged between the metal layer and the substrate.
9. The touch panel of claim 8, wherein: the second nickel-copper-titanium layer contains 35% -50% of nickel, 4% -10% of copper and 44% -55% of titanium.
10. The touch panel of claim 8, wherein: the thickness of the second nickel copper titanium layer is 10-30 nm.
11. The touch panel of claim 8, wherein: and the reflectivity of the second nickel copper titanium layer is less than or equal to 60 percent.
12. The touch panel of claim 8, wherein: the touch panel further comprises a protective cover plate which is arranged on one side of the substrate far away from the second nickel copper titanium layer.
13. The touch panel of claim 8, wherein: the substrate is a protective cover plate of the touch panel.
14. The manufacturing method of the touch panel is characterized by comprising the following steps of:
s1, providing a bearing plate and a vacuum device;
s2, providing a metal target, and sputtering a metal layer on one side of the bearing plate in the vacuum device;
s3, providing a first nickel-copper-titanium alloy target, and sputtering a first nickel-copper-titanium layer on one side of the metal layer far away from the bearing plate in the vacuum device;
s4, patterning the metal layer and the first nickel copper titanium layer to form a grid-shaped induction layer with induction electrodes;
the nickel-copper-titanium alloy target contains 35% -50% of nickel, 4% -10% of copper and 44% -55% of titanium;
the reflectivity of the first nickel copper titanium layer is less than or equal to 65%.
15. The method for manufacturing a touch panel according to claim 14, wherein: the metal target is copper, aluminum, gold or silver.
16. The method of claim 14, further comprising a step S10 of: and providing a second nickel-copper-titanium alloy target, and sputtering a second nickel-copper-titanium layer on one side of the bearing plate in the vacuum device.
17. The method for manufacturing a touch panel according to claim 16, wherein: in step S2, the metal layer is sputtered on a side of the second nickel copper titanium layer away from the carrier plate.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610083667.1A CN107045399B (en) | 2016-02-06 | 2016-02-06 | Touch panel and manufacturing method thereof |
| TW105208100U TWM527989U (en) | 2016-02-06 | 2016-05-31 | Touch panels |
| TW105116996A TWI614651B (en) | 2016-02-06 | 2016-05-31 | Touch panels and method for fabricating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610083667.1A CN107045399B (en) | 2016-02-06 | 2016-02-06 | Touch panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107045399A CN107045399A (en) | 2017-08-15 |
| CN107045399B true CN107045399B (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610083667.1A Active CN107045399B (en) | 2016-02-06 | 2016-02-06 | Touch panel and manufacturing method thereof |
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| CN (1) | CN107045399B (en) |
| TW (2) | TWM527989U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762592B (en) * | 2018-05-31 | 2021-08-27 | 信利光电股份有限公司 | Preparation method of touch sensor and touch sensor |
| CN109182829A (en) * | 2018-09-07 | 2019-01-11 | 四川点燃科技有限公司 | Novel copper-titanium alloy capacitance plate |
| CN113458729A (en) * | 2021-07-05 | 2021-10-01 | 宁波江丰电子材料股份有限公司 | Preparation method of planar special-shaped titanium target assembly |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015026071A1 (en) * | 2013-08-20 | 2015-02-26 | 동우화인켐 주식회사 | Touch sensing electrode and touch screen panel having same |
| WO2015030513A1 (en) * | 2013-08-30 | 2015-03-05 | 주식회사 아모센스 | Touch sensor for touch screen panel, method for manufacturing same, and touch screen panel comprising same |
| TW201513130A (en) * | 2013-09-18 | 2015-04-01 | Intech Electronics Co Ltd | Transparent conductive structure having metal mesh |
| CN204288186U (en) * | 2014-12-23 | 2015-04-22 | 江苏吉创光电有限公司 | A kind of metal grill capacitance type touch-control panel |
| JP2015103223A (en) * | 2013-11-28 | 2015-06-04 | グンゼ株式会社 | Conductive substrate, touch panel and electromagnetic shield |
| TWM506318U (en) * | 2015-02-12 | 2015-08-01 | Superc Touch Corp | Touch display panel with shielding electrode |
| CN204790928U (en) * | 2015-05-30 | 2015-11-18 | 汕头万顺包装材料股份有限公司 | Need not novel ITO conductive film of adhesive agent |
| CN105183208A (en) * | 2015-07-23 | 2015-12-23 | 厦门变格新材料科技有限公司 | Metal mesh based touch screen capable of sensing touch position and pressure |
| CN205620971U (en) * | 2016-02-06 | 2016-10-05 | 宸鸿科技(厦门)有限公司 | Touch panel |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5474097B2 (en) * | 2009-02-06 | 2014-04-16 | エルジー・ケム・リミテッド | Touch screen and manufacturing method thereof |
| CN103207702B (en) * | 2013-03-30 | 2016-08-24 | 深圳欧菲光科技股份有限公司 | Touch-screen and manufacture method thereof |
| TW201526025A (en) * | 2013-12-27 | 2015-07-01 | Solar Applied Mat Tech Corp | Composite conductive film |
| TWM514605U (en) * | 2015-08-28 | 2015-12-21 | Jtouch Corp | Metal mesh touch display film having antenna module and built-in touch display apparatus using the same |
-
2016
- 2016-02-06 CN CN201610083667.1A patent/CN107045399B/en active Active
- 2016-05-31 TW TW105208100U patent/TWM527989U/en unknown
- 2016-05-31 TW TW105116996A patent/TWI614651B/en active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015026071A1 (en) * | 2013-08-20 | 2015-02-26 | 동우화인켐 주식회사 | Touch sensing electrode and touch screen panel having same |
| WO2015030513A1 (en) * | 2013-08-30 | 2015-03-05 | 주식회사 아모센스 | Touch sensor for touch screen panel, method for manufacturing same, and touch screen panel comprising same |
| TW201513130A (en) * | 2013-09-18 | 2015-04-01 | Intech Electronics Co Ltd | Transparent conductive structure having metal mesh |
| JP2015103223A (en) * | 2013-11-28 | 2015-06-04 | グンゼ株式会社 | Conductive substrate, touch panel and electromagnetic shield |
| CN204288186U (en) * | 2014-12-23 | 2015-04-22 | 江苏吉创光电有限公司 | A kind of metal grill capacitance type touch-control panel |
| TWM506318U (en) * | 2015-02-12 | 2015-08-01 | Superc Touch Corp | Touch display panel with shielding electrode |
| CN204790928U (en) * | 2015-05-30 | 2015-11-18 | 汕头万顺包装材料股份有限公司 | Need not novel ITO conductive film of adhesive agent |
| CN105183208A (en) * | 2015-07-23 | 2015-12-23 | 厦门变格新材料科技有限公司 | Metal mesh based touch screen capable of sensing touch position and pressure |
| CN205620971U (en) * | 2016-02-06 | 2016-10-05 | 宸鸿科技(厦门)有限公司 | Touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM527989U (en) | 2016-09-01 |
| CN107045399A (en) | 2017-08-15 |
| TWI614651B (en) | 2018-02-11 |
| TW201729054A (en) | 2017-08-16 |
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