WO2015030513A1

WO2015030513A1 - Touch sensor for touch screen panel, method for manufacturing same, and touch screen panel comprising same

Info

Publication number: WO2015030513A1
Application number: PCT/KR2014/008052
Authority: WO
Inventors: 단성백; 황진수
Original assignee: 주식회사 아모센스
Priority date: 2013-08-30
Filing date: 2014-08-29
Publication date: 2015-03-05
Also published as: KR20150026961A; KR101696411B1

Abstract

The present invention relates to a touch sensor for a touch screen panel, a method for manufacturing the same, and a touch screen panel comprising the same. A seed layer is formed on a transparent substrate, a circuit cover layer is formed on the seed layer, a circuit pattern hole being formed on the circuit cover layer in the shape of a circuit pattern for touch sensing, and a plating layer is then formed in the circuit pattern hole and etched such that the touch sensor for a touch screen panel comprises a circuit pattern for touch sensing having a plating layer that covers only the upper surface of the seed layer except for the periphery of the seed layer. The electrode circuit forming process is simplified through a photolithography process, thereby reducing manufacturing costs and improving productivity; a fine circuit having a thickness of 5μm or less is easily formed on a substrate; and a fine line width of 15μm or less, preferably 3μm or less, can be accurately formed according to a circuit design.

Description

Touch sensor for touch screen panel, manufacturing method thereof and touch screen panel including same

The present invention relates to a touch sensor for a touch screen panel, and more particularly, to a touch sensor that is a simple manufacturing method that can accurately form a fine line width, a manufacturing method thereof, and a touch screen panel including the same.

The present invention claims the benefit of Korean Patent Application No. 10-2013-0103867, filed August 30, 2013, the entire contents of which are incorporated herein.

In general, a touch screen panel is manufactured by bonding a touch sensor provided with a transparent electrode to a transparent film to a cover glass.

The touch sensor is manufactured by coating an electrode material, that is, for example, indium tin oxide (ITO) on one surface of a transparent film, and forming a sensing electrode by an etching process.

Referring to FIG. 1, the touch screen panel 1 is a tempered glass 1d covering two touch sensors 1c and the touch sensor 1c by using a transparent adhesive layer 1b on the display panel 1a. Has a structure in which the layers are sequentially stacked.

That is, in the conventional touch screen panel, two touch sensors for a touch screen panel in which ITO sensing electrodes are formed on a film substrate, and a GFF method using tempered glass 1d are mainly used. The two sensors are each formed with an X-axis sensor or a Y-axis sensor.

However, the touch sensor for the conventional touch screen panel forming the sensing electrode with ITO on the film substrate has a difficulty in implementing a touch speed reduction and multi-touch due to the high resistance of the indium tin oxide (ITO) electrode on the screen of 13 inches or more.

Indium, which is a main material of indium tin oxide (ITO), is being depleted as a rare element, which is expensive due to limited reserves, which causes an increase in the manufacturing cost of the touch screen panel.

In addition, ITO (Indium Tin Oxide) electrode is difficult to apply a flexible substrate at a high process temperature, there is a problem that is often unsuitable for use in a flexible display due to frequent cracks due to weak mechanical properties.

In addition, there is a problem in that wastewater by the etching process during dry deposition causes environmental pollution, and indium diffuses into the organic layer when the OLED is applied.

In particular, in a large area touch screen panel of 13 inches or more, an indium tin oxide (ITO) electrode has a problem of excessive power consumption due to high resistance.

In addition, a silver nanowire (AgNW) may be formed on the front surface of the transparent film, and a transparent electrode may be formed by etching to manufacture a touch sensor. When a transparent electrode is formed using silver nanowire (AgW), The touch speed is excellent but the transparency is low.

In addition, most of the conventional touch sensor is subjected to a process such as exposure, development, etching, etc. At this time, damage such as scratches are generated on the substrate of the transparent film, and there is a problem that optical degradation due to such damage occurs.

In addition, since the conventional touch screen panel includes two touch sensors 1c formed on the transparent film, the X-axis sensor and the Y-axis sensor are complicated in the manufacturing process, require a lot of manufacturing cost, and have a limitation in slimming the thickness. There was this.

The present invention has been made in view of the above, it is possible to ensure the operation reliability of the product by implementing a stable touch speed and multi-touch, has a high transparency, touch sensor for touch screen panel simplified the manufacturing process, Its purpose is to provide a manufacturing method and a touch screen panel including the same.

Touch screen panel touch sensor according to an embodiment of the present invention for achieving the above object, a transparent substrate; And

It is provided on the transparent substrate, and comprises a circuit pattern for detecting the touch formed on the touch screen panel,

The touch sensing circuit pattern may include a seed layer; And a plating layer formed by plating on the seed layer, wherein the plating layer is formed to cover only an upper surface of the seed layer except for the circumference of the seed layer.

In the present invention, the seed layer may be a deposited thin film layer formed through the deposition, the deposited thin film layer is chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), copper (Cu) may be any one.

In the present invention, the seed layer may be an oxide film or a nitride film.

In the present invention, the oxide film is any one of titanium oxide (TiO ₂ ), chromium oxide (CrO ₂ ), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al ₂ O ₃ ), silver oxide (AgO), The nitride film may be titanium nitride (TiN) or copper nitride (CuN).

In the present invention, the seed layer may be formed of a conductive ink or a conductive paste.

In the present invention, the conductive ink or the conductive paste may include a conductive powder and a black-based blackening agent.

In the present invention, the blackening agent may be carbon black or carbon nanotubes.

The touch sensor for a touch screen panel according to an embodiment of the present invention may further include a plating affinity layer laminated between the seed layer and the plating layer.

In the present invention, the plating affinity layer may include any one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). .

According to one or more exemplary embodiments, a method of manufacturing a touch sensor for a touch screen panel includes: forming a seed layer on a transparent substrate;

Forming a circuit cover layer having a circuit pattern hole formed in the shape of a touch sensing circuit pattern on the seed layer;

Plating to form a plating layer in the circuit pattern hole; And

Removing the circuit cover layer and etching the circuit pattern for touch sensing to be formed.

In the present invention, the forming of the seed layer may include forming a deposition thin film layer by deposition, and the deposition may be performed by evaporation, ebeam deposition, laser deposition, or sputtering. Sputtering), or arc ion plating (Arc Ion Plating).

In the present invention, the forming of the seed layer may include forming a deposited thin film layer by deposition, and the forming of the deposited thin film layer may thermally deposit copper (Cu).

In the present invention, the forming of the seed layer may include applying a conductive ink or a conductive paste onto the transparent substrate using a conductive ink or a conductive paste; And drying and firing the conductive ink or the conductive paste applied on the transparent substrate.

In the present invention, the forming of the circuit cover layer may include forming a photoresist layer on the seed layer; And patterning a circuit pattern hole in a shape of a touch sensing circuit pattern in the photoresist layer.

In the present invention, the process of forming the photoresist layer may be formed by any one of a comma roll coating, a gravure coating, a doctor blade method, a spray method.

In the present invention, the process of forming the photoresist layer may form the photoresist layer by electrospinning.

According to another aspect of the present invention, there is provided a method of manufacturing a touch sensor for a touch screen panel, further comprising: forming a plating affinity layer on the seed layer after forming the seed layer and before forming the circuit cover layer. It may include.

Forming the plating affinity layer in the present invention may form the plating affinity layer by vacuum deposition.

In addition, the touch screen panel according to an embodiment of the present invention for achieving the above object, the display panel unit for outputting a screen;

A touch screen panel cover material to cover and protect the screen of the display panel unit; And

Interposed between the display panel unit and the touch screen panel cover substrate and including a touch sensing circuit pattern formed to sense a touch on the touch screen panel,

The touch sensing circuit pattern,

Seed layer; And a plating layer formed by plating on the seed layer.

The plating layer is formed so as to cover only the upper surface of the seed layer except the circumference of the seed layer.

The present invention has the effect of reducing the manufacturing cost and improving the productivity by simplifying the electrode circuit forming process through a photolithography process.

The present invention can adjust the resistance of the electrode, there is an effect of improving the operating reliability of the product through a stable touch speed and multi-touch by reducing the scattering of light.

The present invention easily forms a fine circuit having a thickness of 5 μm or less on a substrate, and preferably has a fine line width of 15 μm or less, preferably 3 μm or less, depending on the circuit design, and improves transparency.

1 is a diagram illustrating an example of a conventional touch screen panel;

2 is a cross-sectional view showing an embodiment of a touch sensor for a touch screen panel according to the present invention.

3 is a cross-sectional view showing another embodiment of a touch sensor for a touch screen panel according to the present invention.

Figure 4 is a perspective view showing an embodiment of a touch sensor for a touch screen panel according to the present invention

5 and 6 are cross-sectional views showing another embodiment of the touch sensor for a touch screen panel according to the present invention.

7 to 11 are schematic diagrams showing an embodiment of a touch screen panel according to the present invention.

12 is a flowchart illustrating one embodiment of a method of manufacturing a touch sensor for a touch screen panel according to the present invention.

FIG. 13 is a schematic diagram of a method of manufacturing a touch sensor for a touch screen panel according to the present invention of FIG. 12.

14 is a process diagram showing another embodiment of the touch sensor manufacturing method for a touch screen panel according to the present invention.

15 is a schematic diagram of a method of manufacturing a touch sensor for a touch screen panel according to the present invention of FIG. 14.

* Description of the major symbols in the drawings *

1 seed layer 2 plating layer

3: plating affinity layer 4: circuit cover layer

4a: photoresist layer 4b: circuit pattern holes

10: transparent substrate 11: touch screen panel cover substrate

12: first transparent substrate 13: second transparent substrate

20: touch sensing circuit pattern 21: X-axis sensing circuit

22: Y axis sensing circuit unit 30: Display panel unit

40: transparent adhesive layer

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. Here, the repeated description, well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention, and detailed description of the configuration will be omitted. Embodiments of the present invention are provided to more completely describe the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity.

2 is a cross-sectional view illustrating a touch sensor according to an embodiment of the present invention. Referring to FIG. 2, a touch sensor for a touch screen panel according to an embodiment of the present invention includes a transparent substrate 10 and the transparent substrate. A touch sensing circuit pattern 20 is provided on the touch screen panel and configured to sense a touch on the touch screen panel.

The touch sensing circuit pattern 20 may include a seed layer 1; And a plating layer 2 formed by plating on the seed layer 1. The plating layer 2 is formed by being stacked on the seed layer 1 to cover only the top surface of the seed layer 1 except for the circumference of the seed layer 1.

The touch sensing circuit pattern 20 is formed to have a fine width that cannot be recognized by the human eye, and an example having a line width of 15 μm or less preferably 3 μm or less.

The plating layer 2 is formed so as to cover only the top surface of the seed layer 1 excluding the circumference of the seed layer 1, that is, the side surface, and for the touch sensing through the thickness control stacked on the seed layer 1. The resistance of the circuit pattern 20 can be adjusted.

In addition, the plating layer 2 is formed so as to cover only the upper surface of the seed layer 1 except the circumference of the seed layer 1, that is, does not affect the line width of the touch sensing circuit pattern 20, The fine line width can be accurately realized with the line width determined at the time of design, and thus the resistance can be adjusted to simultaneously meet the tolerances within the allowable range at the time of design.

The transparent substrate 10 may be a transparent PI film, and may be one of a polyethylene naphthalate (PEN) film, a polyethylene terephthalate (PET) film, a polycarbonate (PC) film, and a polystyrene sulfonate (PSS) film. Transparent films such as engineering plastics can be used.

In addition, the transparent base material 10 may be tempered glass, or may be a tempered coating film having a reinforcement coating layer for increasing hardness on the surface of the film base material. The film substrate may be a transparent PI film, and may be one of a polyethylene naphthalate (PEN) film, a polyethylene terephthalate (PET) film, a polycarbonate (PC) film, a polystyrene sulfonate (PSS) film, and a synthetic resin film. It is noted that the reinforcement coating can be modified to anything possible.

The reinforcing coating layer is a coating layer formed of a resin containing silicon (Si) or ceramic (Si) or may be a coating layer through vacuum deposition, in addition to scratches and cracks by increasing the hardness of one surface of the film substrate It should be noted that the modification can be carried out with any coating layer that increases its durability.

The reinforcement coating layer, it is preferable to have a thickness of less than 0.3mm to be flexible to be applicable to a flexible touch screen panel.

The transparent substrate 10 may be a touch screen panel cover substrate that covers and protects the screen of the display panel unit in the touch screen panel, and the touch screen panel cover substrate is preferably the above-mentioned tempered glass or reinforced coating film. .

The transparent substrate 10 is formed by directly forming a touch pattern circuit pattern 20 directly on one surface of the touch screen panel cover substrate as the touch screen panel cover substrate to reduce the thickness of the touch screen panel, Reduce weight

In this case, one surface of the touch screen panel cover substrate is an inner surface of the touch screen panel, that is, a surface facing the display panel unit, and a surface exposed to the outside when mounted on the display panel unit, that is, a surface opposite to the outer surface. Becomes

The seed layer 1 may be a deposited thin film layer formed through deposition, and the deposited thin film layer is formed by vacuum deposition and chromium (Cr) as an example. In addition to the chromium (Cr), molybdenum (Mo), Titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), copper (Cu), or molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium ( NiCr), a titanium tungsten alloy (TiW), an alloy containing at least two of copper (Cu), or molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), and titanium tungsten alloy (TiW) Or an alloy containing at least one of copper (Cu). The deposited thin film layer has a good adhesion to the substrate 1 for the touch screen panel and uses a metal capable of minimizing light scattering.

The deposited thin film layer is attached on the transparent substrate 10 by vacuum deposition, and the adhesion force with the transparent substrate 10 is strong, and even if the bending deformation of the transparent substrate 10 is not separated from the transparent substrate 10 firmly It may be maintained in a state attached to the transparent substrate 10.

Preferably, the deposited thin film layer is thermally deposited copper (Cu), and the copper (Cu) has a black color upon thermal deposition as well as excellent bonding strength with the plating layer 2.

The deposited thin film layer may be an oxide film or a nitride film, the oxide film is titanium oxide (TiO ₂ ), chromium oxide (CrO ₂ ), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al ₂ O ₃ ), silver oxide One example is (AgO), and the nitride film is one example of titanium nitride (TiN) or copper nitride (CuN).

The seed layer 1 may be formed of a conductive ink or a conductive paste.

The conductive ink or the conductive paste may serve to reduce diffuse reflection of light by forming the seed layer 1 in a black series.

For example, the conductive ink or the conductive paste may include a conductive powder and a black-based blackening agent, and the conductive powder may be any one of silver powder, copper powder, gold powder, and aluminum powder. The conductive ink or the conductive paste contains at least one of the conductive powders having excellent conductivity, and it may be found that the two conductive powders may be mixed.

As the blackening agent, carbon black or carbon nanotubes are taken as an example, and any conductive black or conductive paste forming a black color may be applied, and it is more preferable that the conductivity is more preferable. Put it.

In addition, the conductive ink or the conductive paste may include carbon black or carbon nanotubes.

For example, the seed layer 1 may be formed by drying or baking a conductive ink or a conductive paste. It is preferable that the seed layer 1 lowers the resistance by firing the conductive ink or the conductive paste and increases the adhesion to the substrate.

The seed layer 1 is preferably a dark colored metal that absorbs light, and more preferably black metal after deposition, that is, a metal having a light reflectance of 30% or less.

The seed layer 1 has a light reflectance of 30% or less, thereby minimizing light scattering to increase transparency and preventing glare to improve visibility of the touch screen panel.

In addition, it is preferable that the seed layer 1 has a thickness of 500 kPa to 10,000 kPa, and in the present invention, the seed layer 1 is an example.

The plating layer 2 is one of gold (Au), silver (Ag) and copper (Cu) as an example, an alloy containing at least one of gold (Au), silver (Ag), copper (Cu) It may be.

The plating layer 2 serves to lower the resistance of the touch sensing circuit pattern 20, to adjust the overall resistance of the touch sensing circuit pattern 20 lower, and to adjust the touch sensing circuit pattern 20 by adjusting the thickness. You can adjust the resistance value of).

The plating layer 2 is formed in a shape surrounding the outer circumference of the seed layer 1. For example, the plating layer 2 covers the surface and both sides of the seed layer 1.

Referring to FIG. 3, the touch sensing circuit pattern 20 may further include a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2.

The plating affinity layer 3 allows the seed layer 1 to be smoothly plated and at the same time increases the bonding force between the plating layer 2 and the seed layer 1 so that the touch pattern of the circuit pattern 20 can be The durability is further improved, and the shape of the touch sensing circuit pattern 20 can be maintained even when the transparent substrate 10 is deformed, such as bending deformation of the transparent substrate 10.

The plating affinity layer 3 is one using copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), palladium (Pd) As an example, it is noted that any plating-friendly metal can be used.

The plating affinity layer 3 may be a conductive ink or a conductive paste, and the conductive ink or the conductive paste may be a plating-friendly metal powder, that is, copper (Cu), nickel (Ni), silver (Ag), and gold (Au). For example, at least one powder containing tin (Sn), aluminum (Al), or palladium (Pd) may be used.

The plating affinity layer 3 deposits at least one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). The formed metal vapor deposition layer may be sufficient.

The plating affinity layer 3 is laminated on the seed layer 1, and the plating layer 2 is the plating affinity layer 3 except for the circumference of the seed layer 1 and the plating affinity layer 3. It is characterized in that it is formed so as to cover only the upper surface. More specifically, only the surface of the plating affinity layer 3 is covered, and the circumference of the plating affinity layer 3 and the circumference of the seed layer 1 are not covered.

This may adjust the resistance of the touch sensing circuit pattern 20 by controlling the thickness of the stacked on the seed layer (1).

Further, the plating layer 2 may be formed around the plating affinity layer 3 and the seed layer 1, that is, the plating affinity layer 3 except for the side surfaces of the plating affinity layer 3 and the seed layer 1. Since it is formed to cover only the upper surface of the) does not affect the line width of the touch-sensing circuit pattern 20, it is possible to accurately implement a fine line width with the line width determined at the time of design, thereby designing a resistor to satisfy the resistance within the allowable range at the same time accurately It is adjustable.

Referring to FIG. 4, the touch sensing circuit pattern 20 is formed in a circuit shape capable of sensing a touch, and includes an X-axis sensing circuit unit 21 or a plurality of X-axis electrodes spaced apart in a horizontal direction. For example, the Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced apart in the direction.

The transparent substrate 10 includes a first transparent substrate 12 and a second transparent substrate 13, and the touch sensing circuit pattern 20 is provided on the first transparent substrate 12 and is transverse. X-axis sensing circuit unit 21 including a plurality of X-axis electrodes spaced in the direction and the second transparent substrate 13 and Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction Take this as an example.

The plurality of X-axis electrodes spaced apart in the lateral direction and the plurality of Y-axis electrodes spaced in the longitudinal direction are connected to an external circuit through a trace electrode, and as an example of the external circuit, there is a capacitive multi-touch control unit. The multi-touch controller is electrically connected to the main process of the electronic device.

For example, the X-axis electrode and the Y-axis electrode has a form in which a plurality of touch sensor electrodes formed in a metal mesh shape of a rhombus shape are electrically connected.

Hereinafter, the line widths and the intervals between the touch sensing circuit patterns 20 in FIGS. 5 to 11 are shown to clearly explain the configuration of the present invention and are different from the actual ones.

In implementing the touch sensor for a touch screen panel according to the present invention, it is confirmed that the touch sensing circuit pattern 20 may be variously modified to have a fine line width and an interval having invisible transparency in an actual touch screen panel. do.

Referring to FIG. 5, the touch sensing circuit pattern 20 is provided on either side of the transparent substrate 10 and includes an X-axis sensing circuit unit 21 including a plurality of X-axis electrodes spaced apart in a lateral direction. Alternatively, for example, the Y-axis sensing circuit unit 22 provided on the other side of both surfaces of the transparent substrate 10 and including a plurality of Y-axis electrodes spaced in the longitudinal direction.

Both sides of the transparent substrate 10 are provided with the X-axis sensing circuit 21 and the Y-axis sensing circuit 22, respectively, to reduce material costs, reduce the thickness of the touch screen panel, and reduce the weight of the touch screen panel. It can be lightened.

The X-axis sensing circuit unit 21 or the Y-axis sensing circuit unit 22 includes a seed layer formed through deposition; And a plating layer 2 formed by plating on the seed layer 1 circuit layer, and may further include a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2. .

Embodiments of the seed layer 1, the plating layer 2, and the plating affinity layer 3 will be omitted as described above as a redundant substrate.

Referring to FIG. 6, an X-axis sensing circuit unit 21 including a plurality of X-axis electrodes horizontally spaced apart from the touch sensing circuit pattern 20 and a Y-axis including a plurality of Y-axis electrodes spaced in the longitudinal direction. The sensing circuit unit 22 may be formed on the same surface of the transparent substrate 10.

The X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 are formed together on either side of both surfaces of the transparent substrate 10 to reduce material costs, improve optical properties, and at the same time increase the thickness of the touch screen panel. It is possible to slim down and reduce the weight of the touch screen panel.

The X-axis sensing circuit unit 21 or the Y-axis sensing circuit unit 22 includes a seed layer formed through deposition; And a plating layer 2 formed by plating on the seed layer 1, and further comprising a plating affinity layer 3 stacked between the seed layer 1 and the plating layer 2.

On the other hand, referring to Figures 7 to 11, the touch screen panel according to an embodiment of the present invention, the display panel unit 30 for outputting a screen; And a touch screen panel cover base 11 to cover and protect the screen of the display panel unit 30. And a touch sensing circuit pattern 20 interposed between the display panel unit 30 and the touch screen panel cover substrate 11 and configured to sense a touch on the touch screen panel.

The touch screen panel cover base material 11 may be tempered glass as the transparent base material 10, or a reinforcement coating film in which a reinforcement coating layer is formed on the surface of the film base material to increase hardness. The pattern 20 includes a seed layer 1, a plating affinity layer 3, and a plating layer 2, and the embodiment thereof has been described above.

Referring to FIG. 7 in detail, a touch screen panel according to an embodiment of the present invention may include a first transparent substrate spaced apart from the display panel unit 30 and the touch screen panel cover substrate 11. And a second transparent substrate 13, wherein the touch sensing circuit pattern 20 is provided on the first transparent substrate 12 and includes a plurality of X-axis electrodes laterally spaced apart from each other. The Y axis sensing circuit unit 22 is provided in the axis sensing circuit unit 21 and the second transparent substrate 13 and includes a plurality of Y axis electrodes spaced in the longitudinal direction.

A first transparent substrate 12 spaced apart from the display panel unit 30 and the touch screen panel cover substrate 11 and between the display panel unit 30 and the touch screen panel cover substrate 11; The second transparent substrate 13 is attached to each other with a transparent adhesive layer 40, respectively, the transparent adhesive layer 40 is an example that is an OCA (OCA Optically Clear Adhesive) film.

The transparent adhesive layer 40 may be formed between the touch screen panel cover substrate 11 and the first transparent substrate 12, between the first transparent substrate 12 and the second transparent substrate 13. Interposed between the display panel unit 30 and the second transparent substrate 13, respectively.

In addition, referring to FIG. 8, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 disposed to be spaced apart between the touch screen panel cover substrate 11 and the touch sensing. The circuit pattern 20 for the X-axis sensing circuit 21 includes a plurality of X-axis electrodes spaced apart in the transverse direction and provided on either side of the touch screen panel cover substrate 11 and the transparent substrate 10. And a Y-axis sensing circuit unit 22 provided on the other side of the touch screen panel cover substrate 11 and the transparent substrate 10 and including a plurality of Y-axis electrodes spaced in the longitudinal direction. .

One surface of the touch screen panel includes one of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22, and one surface of the transparent substrate 10 includes the X-axis sensing circuit unit 21 and the Y. The other one of the shaft sensing circuits 22 is provided.

The transparent substrate 10 disposed to be spaced apart from the display panel unit 30 and the touch screen panel cover substrate 11 and between the display panel unit 30 and the touch screen panel cover substrate 11 is transparent. Attached to each other by the adhesive layer 40, the transparent adhesive layer 40 is an example of an OCA optically clear adhesive (OCA) film.

The transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

One of the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 is integrally provided on one surface of the touch screen panel cover substrate 11 to reduce material costs, provide high transparency, The thickness can be reduced and the weight of the touch screen panel can be reduced.

In addition, referring to FIG. 9, the touch sensing circuit pattern 20 may include an X-axis sensing circuit unit including a plurality of horizontally spaced X-axis electrodes provided on one surface of the touch screen panel cover substrate 11. 21) and the Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction.

In the touch sensing circuit pattern 20, the X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 are formed together on one surface of the touch screen panel cover substrate 11 to reduce material costs, and provide optical It is possible to improve the characteristics, reduce the thickness of the touch screen panel, and reduce the weight of the touch screen panel.

The display panel unit 30 and the touch screen panel cover substrate 11 are attached to each other by a transparent adhesive layer 40, and the transparent adhesive layer 40 is an OCA (OCA Optically Clear Adhesive) film as an example.

In addition, referring to FIG. 10, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 disposed to be spaced apart between the touch screen panel cover substrate 11 and the touch. The sensing circuit pattern 20 may be an X-axis sensing circuit unit 21 including a plurality of X-axis electrodes spaced laterally and a Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction. The X-axis sensing circuit unit 21 and the Y-axis sensing circuit unit 22 may be formed on the same surface of the transparent substrate 10.

In the touch sensing circuit pattern 20, the X-axis sensing circuit 21 and the Y-axis sensing circuit 22 are formed on the same surface of the transparent substrate 10 to reduce material costs and improve optical characteristics. The thickness of the touch screen panel can be reduced, and the weight of the touch screen panel can be reduced.

A transparent adhesive layer 40 is interposed between the display panel unit 30 and the transparent substrate 10 and between the transparent substrate 10 and the touch screen panel cover substrate 11.

In addition, referring to FIG. 11, the touch screen panel according to an embodiment of the present invention further includes a transparent substrate 10 disposed to be spaced apart between the touch screen panel cover substrate 11 and the touch sensing. The circuit pattern 20 is provided on one surface of the transparent substrate 10 and is provided on the X-axis sensing circuit unit 21 and the other surface of the transparent substrate 10 including a plurality of X-axis electrodes spaced laterally. It may be a Y-axis sensing circuit unit 22 including a plurality of Y-axis electrodes spaced in the longitudinal direction.

12 and 13, in the method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present invention, forming the seed layer 1 on the transparent substrate 10 (S100) and the seed layer. Forming a circuit cover layer 4 having a circuit pattern hole 4b for exposing the seed layer 1 in the shape of the touch sensing circuit pattern 20 (S200), the circuit pattern Plating to form a plating layer 2 on the seed layer 1 exposed through the holes 4b (S300), removing the circuit cover layer 4, and forming a touch sensing circuit pattern 20. Etching step (S400) is included.

Forming the seed layer 1 (S100), for example, including a process of forming a deposited thin film layer by deposition.

The process of forming the deposited thin film layer, vacuum deposition to form a thin film layer, the vacuum deposition is evaporation (evaporation), e-beam (ebeam) deposition, laser deposition, sputtering (sputtering), arc ion plating ( Arc Ion Plating) is one example.

The vacuum deposition is any one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), copper (Cu), or molybdenum (Mo) , An alloy in which at least two of titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW) and copper (Cu) are mixed, or molybdenum (Mo), titanium (Ti) and tungsten (W). ), An alloy containing at least one of nickel chromium (NiCr), titanium tungsten alloy (TiW) and copper (Cu) is preferably used as the target material.

In the process of forming the deposited thin film layer, it is preferable to thermally deposit copper (Cu). The deposited thin film layer formed by thermally depositing the copper (Cu) has a bonding strength with the plating layer 2 formed by the plating step (S300) so that the plating is smoothly performed in the plating step (S300). Not only is it excellent, it has a black color when thermal evaporation.

In the process of forming the deposited thin film layer, it is preferable to form an oxide film or a nitride film by vacuum depositing a target material in an oxygen gas atmosphere or a nitrogen gas atmosphere.

The process of forming the deposited thin film layer, by sputtering a target material such as a metal, such as titanium, chromium, copper, nickel, aluminum, silver, or carbon in an oxygen gas atmosphere or a nitrogen gas atmosphere to the oxide film on one surface of the transparent substrate 10 Or forming a nitride film.

The process of forming the deposited thin film layer may include titanium oxide (TiO ₂ ), chromium oxide (CrO ₂ ), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al ₂ O ₃ ), silver oxide (AgO), and the like. An oxide film may be formed on one surface of the transparent substrate 10 by sputtering an oxidant with a target material, and the transparent substrate 10 may be sputtered with a nitride material such as titanium nitride (TiN) or copper nitride (CuN) as a target material. The nitride film may be formed on one surface of the substrate.

This allows the oxide film or the nitride film to be strongly and firmly attached to the transparent substrate 10, and easily forms the oxide film or the nitride film at a predetermined thickness on one surface of the transparent substrate 10.

The oxide film or the nitride film has a reflectance of 30% or less, to prevent glare caused by the reflection of the electrode, and to enhance adhesion between the electrode and the transparent substrate 10.

Forming the seed layer 1 (S100) includes applying a conductive ink or a conductive paste onto the transparent substrate 10 with the conductive ink or the conductive paste. Forming the seed layer 1 is one example.

In the forming of the seed layer 1 (S100), the process of drying the conductive ink or conductive paste applied on the transparent substrate 10 or the conductive ink or conductive paste applied on the transparent substrate 10 is performed. It may further comprise the step of drying and firing.

The coating of the conductive ink or the conductive paste may be performed by printing the conductive ink or the conductive paste to form the seed layer 1.

For example, the seed layer 1 is formed by applying a conductive ink or conductive paste, and drying or baking. It is preferable that the seed layer 1 lowers the resistance by firing the conductive ink or the conductive paste and increases the adhesion to the substrate.

In the forming of the circuit cover layer 4 (S200), a process of forming a photoresist layer on the seed layer 1 (S210) and a touch sensing circuit pattern 20 on the photoresist layer. Patterning the circuit pattern hole 4b in the shape of (S220).

The photoresist layer 4a may be formed by applying a dry film or a photoresist liquid.

Compared with the photoresist layer 4a formed by applying the photoresist liquid, the dry film has a uniform thickness and does not require a separate drying process, thereby simplifying the manufacturing process and uniformly forming the circuit electrode with a uniform thickness. In addition, it is advantageous in minimizing the line width of the circuit electrode, so that the intaglio circuit pattern hole 4b having a line width of 15 μm or less can be more easily formed.

In the process of forming the photoresist layer 4a (S210), the photoresist layer 4a may be formed by comma roll coating, gravure coating, doctor blade method, spray method, and electrospinning.

The electrospinning forms the electrospinning photoresist layer 4a to 1 to 10 mu m. The electrospinning is performed on the seed layer 1 by spraying a photosensitive polymer solution with compressed air with an electrospinning nozzle and the electrospinning nozzle while the electric power is applied to the seed layer 1. The radiation photoresist layer 4a is formed.

Since the electrospinning includes charge in the photosensitive polymer to be injected, the photosensitive polymer solution is not aggregated while the photosensitive polymer solution is sprayed to facilitate dispersion, thereby forming the electrospinning photoresist layer 4a as a thin film having a thickness of 5 μm or less.

In addition, since the electrospinning forms an electrospinning photoresist layer 4a on the seed layer 1 in a state in which electric power is applied to the seed layer 1, the photosensitive polymer solution is radiated. The photosensitive fiber is uniformly applied to the deposited thin film layer 1 by the potential difference, and is strongly adhered and applied.

When the photoresist layer 4a is formed by electrospinning, the photoresist layer 4a applied by electrospinning should be cured, and the photoresist layer 4a is cured by ultraviolet (UV) curing, laser curing, It hardens | cures by methods, such as an ebeam hardening.

In the patterning process (S220), the photoresist layer 4a is exposed with a mask 5 covering only a portion where the circuit pattern hole 4b is formed, and then developed with a developer to be cured by exposure. In other words, the circuit pattern hole 4b is formed in the photoresist layer 4a by dissolving only the portion covered by the mask 5 by the developer.

As an example, the photoresist layer 4a is changed to an insoluble state in which a portion exposed by exposure is not dissolved by a developer.

That is, in the exposing process, a portion of the photoresist layer 4a that is not covered by the mask 5, that is, a portion to which light is not applied, is not covered by the developer so as not to be dissolved by the developer. Keep dissolved.

In the developing process, the circuit pattern hole 4b is formed by removing only a portion of the photoresist layer 4a that is not insoluble and available, that is, a portion corresponding to the circuit pattern hole 4b. do.

The plating step (S300), for example, electroplating or electroless plating of gold (Au), silver (Ag) or copper (Cu), the circuit pattern hole (4b) by electrolytic plating or electroless plating The plating layer 2 is formed in it. In the plating step (S300), the plating layer 2 is formed by using the photoresist layer 4a as a barrier in the circuit pattern hole 4b, and is laminated on the seed layer 1 only. The plating layer 2 is not formed on the side surface, ie, around the seed layer 1, so that the plating layer 2 having an accurate fine line width is formed to match the line width of the circuit pattern hole 4b.

In the etching step (S400), the seed layer 1 is removed by removing the photoresist layer 4a and etching the seed layer 1 using the plating layer 2 as a barrier. Have a line width that corresponds to.

Accordingly, the touch sensing circuit pattern 20 having the exact line width that matches the circuit pattern hole 4b can be formed.

Referring to FIGS. 14 and 15, in the method of manufacturing a touch sensor for a touch screen panel according to an embodiment of the present disclosure, after forming the seed layer 1 (S100), the circuit cover layer 4 is formed. It is preferable to further include the step (S110) of forming a plating affinity layer 3 on the seed layer (1) before the step (S200).

The circuit cover layer 4 is formed on the seed layer 1 on the upper surface of the plating affinity layer 3.

The step of forming the plating affinity layer 3 (S110) may include copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). The conductive paste containing at least one of the above may be printed on the deposited thin film layer 1 and dried to form a plating affinity layer 3, or may be printed and dried and then fired to form the plating affinity layer 3.

The conductive paste may include at least one powder of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). .

Forming the plating affinity layer 3 (S110) may form the plating affinity layer 3 by vacuum deposition.

The vacuum deposition may be any one of evaporation, ebeam deposition, laser deposition, sputtering, and arc ion plating. The step of forming the plating affinity layer 3 (S110) may include copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). It is preferable to form a plating affinity layer 3 on the deposited thin film layer 1 by vacuum depositing either.

The vacuum deposition can easily form the plating affinity layer 3 on the deposition thin film layer 1 to simplify the manufacturing process, reduce the manufacturing cost, fine adjustment of the thickness of the plating affinity layer (3) It is easy.

In the process of forming the photoresist layer 4a (S210), the photoresist layer 4a is formed on the upper surface of the plating affinity layer 3, and the patterning process (S220), the mask (5) Except for the portion where the circuit pattern hole 4b is formed, the photoresist layer 4a is exposed in a covered state and then developed with a developing solution, and only the portion that is changed to an available state by exposure is applied to the photoresist layer 4a. The circuit pattern hole 4b is formed.

In the patterning process S220, the mask 5 is formed with a hole exposing a portion where the circuit pattern hole 4b is formed.

As an example, the photoresist layer 4a is changed into an soluble state in which a portion exposed by exposure is dissolved by a developer.

That is, in the exposing process, only a portion of the photoresist layer 4a that is not covered by the mask 5, that is, a portion to which light is applied, becomes a soluble state in which the developer is dissolved, and the portion to which light is not applied. The silver is kept in an insoluble state which is not dissolved by the developer.

The plating step (S300), for example, electroplating or electroless plating of gold (Au), silver (Ag) or copper (Cu), the circuit pattern hole (4b) by electrolytic plating or electroless plating The plating layer 2 is formed in it. In the plating step (S300), the seed layer 1 and the plating affinity layer 3 are formed by forming the plating layer 2 using the photoresist layer 4a as a barrier in the circuit pattern hole 4b. ) Is formed only on the side of the seed layer 1 and the plating affinity layer 3, that is, the plating layer 2 is not formed around the seed layer 1 and the plating affinity layer 3, so that it is accurate to match the line width of the circuit pattern hole 4b. The plating layer 2 which has a line width is formed.

In the etching step (S400), the photoresist layer 4a is removed, and the plating affinity layer 3 and the seed layer 1 are etched by using the plating layer 2 as a barrier. (3) and the seed layer 1 to have a line width corresponding to the plating layer (2).

The present invention simplifies the process of forming the electrode circuit through the photolithography process to reduce manufacturing costs and improve productivity.

The present invention can adjust the resistance of the electrode, to reduce the scattering of light to improve the operation reliability of the product through a stable touch speed and multi-touch.

The present invention easily forms a microcircuit of 5 μm or less on a substrate, and can form a fine line width of 15 μm or less, preferably 3 μm or less, depending on the circuit design, and improve transparency.

Within the scope of the basic technical idea of the present invention, many other modifications are possible to those skilled in the art, and the scope of the present invention should be interpreted based on the appended claims. will be.

Claims

Transparent substrates; And

It is provided on the transparent substrate, and comprises a circuit pattern for detecting the touch formed on the touch screen panel,

The touch sensing circuit pattern may include a seed layer; And a plating layer formed by plating on the seed layer, wherein the plating layer is formed to cover only an upper surface of the seed layer except for the circumference of the seed layer.
The method of claim 1,

The seed layer is a deposited thin film layer formed through deposition,

The deposited thin film layer may include at least one of chromium (Cr), molybdenum (Mo), titanium (Ti), tungsten (W), nickel chromium (NiCr), titanium tungsten alloy (TiW), and copper (Cu). Touch sensor for touch screen panels.
The method of claim 1,

The seed layer is a touch sensor for a touch screen panel, characterized in that the oxide film or nitride film.
The method of claim 3,

The oxide film is any one of titanium oxide (TiO 2 ), chromium oxide (CrO 2 ), copper oxide (CuO), nickel oxide (NiO), aluminum oxide (Al 2 O 3 ), silver oxide (AgO),

The nitride film is a touch sensor for a touch screen panel, characterized in that the titanium nitride (TiN) or copper nitride (CuN).
The method of claim 1,

The seed layer is a touch sensor for a touch screen panel, characterized in that formed with a conductive ink or a conductive paste.
The method of claim 5,

The conductive ink or the conductive paste includes a conductive powder and a black-based blackening agent.
The method of claim 6,

The blackening agent is a carbon black (carbon black) or a carbon nanotube touch sensor for a touch screen panel.
The method of claim 1,

And a plating affinity layer laminated between the seed layer and the plating layer.
The method of claim 8,

The plating affinity layer includes any one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), tin (Sn), aluminum (Al), and palladium (Pd). Touch sensor for panels.
Forming a seed layer on the transparent substrate;

Forming a circuit cover layer having a circuit pattern hole formed in the shape of a touch sensing circuit pattern on the seed layer;

Plating to form a plating layer in the circuit pattern hole; And

And removing the circuit cover layer and etching the circuit pattern for touch sensing to form a circuit pattern for touch sensing.
The method of claim 10,

Forming the seed layer includes the step of forming a deposited thin film layer by deposition,

The deposition may be any one of thermal evaporation, e-beam evaporation, laser deposition, sputtering, arc ion plating, and the like. Way.
The method of claim 10,

Forming the seed layer includes the step of forming a deposited thin film layer by deposition,

The process of forming the deposited thin film layer is a touch sensor manufacturing method for a touch screen panel, characterized in that the thermal deposition of copper (Cu).
The method of claim 10,

Forming the seed layer,

Applying a conductive ink or conductive paste onto the transparent substrate using a conductive ink or conductive paste; And

Method of manufacturing a touch sensor for a touch screen panel further comprising the step of drying and baking the conductive ink or conductive paste applied on the transparent substrate.
The method of claim 10,

Forming the circuit cover layer,

Forming a photoresist layer on the seed layer; And

And patterning a circuit pattern hole in a shape of a touch sensing circuit pattern on the photoresist layer.
The method of claim 14,

The forming of the photoresist layer may include forming a photoresist layer by any one of a comma roll coating, a gravure coating, a doctor blade method, and a spray method.
The method of claim 14,

The process of forming the photoresist layer is a touch sensor manufacturing method for a touch screen panel, characterized in that for forming the photoresist layer by electrospinning.
The method of claim 10,

And forming a plating affinity layer on the seed layer after forming the seed layer and before forming the circuit cover layer.
The method of claim 17,

The forming of the plating affinity layer is a touch sensor panel manufacturing method of the touch screen panel, characterized in that for forming the plating affinity layer by vacuum deposition.
A display panel unit for outputting a screen;

A touch screen panel cover material to cover and protect the screen of the display panel unit; And

Interposed between the display panel unit and the touch screen panel cover substrate and including a touch sensing circuit pattern formed to sense a touch on the touch screen panel,

The touch sensing circuit pattern,

Seed layer; And a plating layer formed by plating on the seed layer.

And the plating layer is formed to cover only an upper surface of the seed layer except for the circumference of the seed layer.
The method of claim 19,

The touch sensing circuit pattern further includes a plating affinity layer laminated between the deposition thin film layer and the plating layer.