JPH0236476U - - Google Patents
Info
- Publication number
- JPH0236476U JPH0236476U JP11429888U JP11429888U JPH0236476U JP H0236476 U JPH0236476 U JP H0236476U JP 11429888 U JP11429888 U JP 11429888U JP 11429888 U JP11429888 U JP 11429888U JP H0236476 U JPH0236476 U JP H0236476U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- protruding electrodes
- view
- wiring
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007650 screen-printing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Radar Systems Or Details Thereof (AREA)
- Credit Cards Or The Like (AREA)
- Calculators And Similar Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11429888U JPH0236476U (sr) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11429888U JPH0236476U (sr) | 1988-08-31 | 1988-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0236476U true JPH0236476U (sr) | 1990-03-09 |
Family
ID=31354914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11429888U Pending JPH0236476U (sr) | 1988-08-31 | 1988-08-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0236476U (sr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06123773A (ja) * | 1992-06-17 | 1994-05-06 | Micron Technol Inc | 無線周波数識別装置及び該装置の製造方法並びに該装置を用いた探知システム |
JPH08321671A (ja) * | 1995-05-26 | 1996-12-03 | Nec Corp | バンプ電極の構造およびその製造方法 |
WO2021106471A1 (ja) * | 2019-11-29 | 2021-06-03 | 株式会社デンソー | レーダ装置 |
WO2022113186A1 (ja) * | 2020-11-25 | 2022-06-02 | 株式会社Fuji | 電気回路形成方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51139775A (en) * | 1975-05-28 | 1976-12-02 | Seiko Epson Corp | Method of forming projection electrode |
JPS594196A (ja) * | 1982-06-30 | 1984-01-10 | 富士通株式会社 | 半導体部品実装用半田バンプの形成方法 |
JPS63119288A (ja) * | 1986-11-06 | 1988-05-23 | 株式会社村田製作所 | 回路基板 |
-
1988
- 1988-08-31 JP JP11429888U patent/JPH0236476U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51139775A (en) * | 1975-05-28 | 1976-12-02 | Seiko Epson Corp | Method of forming projection electrode |
JPS594196A (ja) * | 1982-06-30 | 1984-01-10 | 富士通株式会社 | 半導体部品実装用半田バンプの形成方法 |
JPS63119288A (ja) * | 1986-11-06 | 1988-05-23 | 株式会社村田製作所 | 回路基板 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06123773A (ja) * | 1992-06-17 | 1994-05-06 | Micron Technol Inc | 無線周波数識別装置及び該装置の製造方法並びに該装置を用いた探知システム |
JPH08321671A (ja) * | 1995-05-26 | 1996-12-03 | Nec Corp | バンプ電極の構造およびその製造方法 |
WO2021106471A1 (ja) * | 2019-11-29 | 2021-06-03 | 株式会社デンソー | レーダ装置 |
JP2021085795A (ja) * | 2019-11-29 | 2021-06-03 | 株式会社デンソー | レーダ装置 |
WO2022113186A1 (ja) * | 2020-11-25 | 2022-06-02 | 株式会社Fuji | 電気回路形成方法 |
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