JPH0236476U - - Google Patents

Info

Publication number
JPH0236476U
JPH0236476U JP11429888U JP11429888U JPH0236476U JP H0236476 U JPH0236476 U JP H0236476U JP 11429888 U JP11429888 U JP 11429888U JP 11429888 U JP11429888 U JP 11429888U JP H0236476 U JPH0236476 U JP H0236476U
Authority
JP
Japan
Prior art keywords
wiring pattern
protruding electrodes
view
wiring
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11429888U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11429888U priority Critical patent/JPH0236476U/ja
Publication of JPH0236476U publication Critical patent/JPH0236476U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Credit Cards Or The Like (AREA)
  • Calculators And Similar Devices (AREA)
JP11429888U 1988-08-31 1988-08-31 Pending JPH0236476U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11429888U JPH0236476U (de) 1988-08-31 1988-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11429888U JPH0236476U (de) 1988-08-31 1988-08-31

Publications (1)

Publication Number Publication Date
JPH0236476U true JPH0236476U (de) 1990-03-09

Family

ID=31354914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11429888U Pending JPH0236476U (de) 1988-08-31 1988-08-31

Country Status (1)

Country Link
JP (1) JPH0236476U (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06123773A (ja) * 1992-06-17 1994-05-06 Micron Technol Inc 無線周波数識別装置及び該装置の製造方法並びに該装置を用いた探知システム
JPH08321671A (ja) * 1995-05-26 1996-12-03 Nec Corp バンプ電極の構造およびその製造方法
JP2021085795A (ja) * 2019-11-29 2021-06-03 株式会社デンソー レーダ装置
WO2022113186A1 (ja) * 2020-11-25 2022-06-02 株式会社Fuji 電気回路形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139775A (en) * 1975-05-28 1976-12-02 Seiko Epson Corp Method of forming projection electrode
JPS594196A (ja) * 1982-06-30 1984-01-10 富士通株式会社 半導体部品実装用半田バンプの形成方法
JPS63119288A (ja) * 1986-11-06 1988-05-23 株式会社村田製作所 回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139775A (en) * 1975-05-28 1976-12-02 Seiko Epson Corp Method of forming projection electrode
JPS594196A (ja) * 1982-06-30 1984-01-10 富士通株式会社 半導体部品実装用半田バンプの形成方法
JPS63119288A (ja) * 1986-11-06 1988-05-23 株式会社村田製作所 回路基板

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06123773A (ja) * 1992-06-17 1994-05-06 Micron Technol Inc 無線周波数識別装置及び該装置の製造方法並びに該装置を用いた探知システム
JPH08321671A (ja) * 1995-05-26 1996-12-03 Nec Corp バンプ電極の構造およびその製造方法
JP2021085795A (ja) * 2019-11-29 2021-06-03 株式会社デンソー レーダ装置
WO2021106471A1 (ja) * 2019-11-29 2021-06-03 株式会社デンソー レーダ装置
WO2022113186A1 (ja) * 2020-11-25 2022-06-02 株式会社Fuji 電気回路形成方法

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