JPH0236040U - - Google Patents

Info

Publication number
JPH0236040U
JPH0236040U JP1988115622U JP11562288U JPH0236040U JP H0236040 U JPH0236040 U JP H0236040U JP 1988115622 U JP1988115622 U JP 1988115622U JP 11562288 U JP11562288 U JP 11562288U JP H0236040 U JPH0236040 U JP H0236040U
Authority
JP
Japan
Prior art keywords
resin
pot
cavity
mold
communicates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988115622U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0521877Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988115622U priority Critical patent/JPH0521877Y2/ja
Publication of JPH0236040U publication Critical patent/JPH0236040U/ja
Application granted granted Critical
Publication of JPH0521877Y2 publication Critical patent/JPH0521877Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1988115622U 1988-09-01 1988-09-01 Expired - Lifetime JPH0521877Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988115622U JPH0521877Y2 (enrdf_load_stackoverflow) 1988-09-01 1988-09-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988115622U JPH0521877Y2 (enrdf_load_stackoverflow) 1988-09-01 1988-09-01

Publications (2)

Publication Number Publication Date
JPH0236040U true JPH0236040U (enrdf_load_stackoverflow) 1990-03-08
JPH0521877Y2 JPH0521877Y2 (enrdf_load_stackoverflow) 1993-06-04

Family

ID=31357451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988115622U Expired - Lifetime JPH0521877Y2 (enrdf_load_stackoverflow) 1988-09-01 1988-09-01

Country Status (1)

Country Link
JP (1) JPH0521877Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012156149A (ja) * 2011-01-21 2012-08-16 Daiichi Seiko Co Ltd 樹脂封止装置および樹脂封止方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012156149A (ja) * 2011-01-21 2012-08-16 Daiichi Seiko Co Ltd 樹脂封止装置および樹脂封止方法

Also Published As

Publication number Publication date
JPH0521877Y2 (enrdf_load_stackoverflow) 1993-06-04

Similar Documents

Publication Publication Date Title
HK27993A (en) Resin encapsulating method
JPH0236040U (enrdf_load_stackoverflow)
JPS6262435U (enrdf_load_stackoverflow)
JPS5961923U (ja) 射出成形用金型
JPS5967217U (ja) プラスチツク成形用金型
JPH0265524U (enrdf_load_stackoverflow)
JPH04197720A (ja) モールド金型
JPH0231129U (enrdf_load_stackoverflow)
JPS6337215Y2 (enrdf_load_stackoverflow)
JPS5883146U (ja) トランスフア成形用金型
JPS58184839U (ja) 樹脂モ−ルド装置
JPH02130312U (enrdf_load_stackoverflow)
JPH04137045U (ja) 半導体素子封入金型
JPH0221736U (enrdf_load_stackoverflow)
JPS6188239U (enrdf_load_stackoverflow)
JPS62138441U (enrdf_load_stackoverflow)
JPH0170517U (enrdf_load_stackoverflow)
JPS6038717U (ja) マルチ式トランスフア成形装置
JPS6046216U (ja) 樹脂モ−ルド装置
JPH032637U (enrdf_load_stackoverflow)
JPS6238127U (enrdf_load_stackoverflow)
JPH02135216U (enrdf_load_stackoverflow)
JPS60105125U (ja) サンドイツチ成形用金型
JPS58190107U (ja) セラミツクス調合物の射出成形用金型
JPS58105308U (ja) 歯科用補綴物の製造装置