JPH0234736B2 - - Google Patents

Info

Publication number
JPH0234736B2
JPH0234736B2 JP58096847A JP9684783A JPH0234736B2 JP H0234736 B2 JPH0234736 B2 JP H0234736B2 JP 58096847 A JP58096847 A JP 58096847A JP 9684783 A JP9684783 A JP 9684783A JP H0234736 B2 JPH0234736 B2 JP H0234736B2
Authority
JP
Japan
Prior art keywords
wafer
template
finished
circular
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58096847A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5930632A (ja
Inventor
Dei Roorensu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPX Technologies Inc
Original Assignee
General Signal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Signal Corp filed Critical General Signal Corp
Publication of JPS5930632A publication Critical patent/JPS5930632A/ja
Publication of JPH0234736B2 publication Critical patent/JPH0234736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
JP9684783A 1982-06-01 1983-05-31 ウエフア−保持チヤツク用の裏打ち Granted JPS5930632A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38353282A 1982-06-01 1982-06-01
US383532 1982-06-01

Publications (2)

Publication Number Publication Date
JPS5930632A JPS5930632A (ja) 1984-02-18
JPH0234736B2 true JPH0234736B2 (enrdf_load_stackoverflow) 1990-08-06

Family

ID=23513589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9684783A Granted JPS5930632A (ja) 1982-06-01 1983-05-31 ウエフア−保持チヤツク用の裏打ち

Country Status (2)

Country Link
JP (1) JPS5930632A (enrdf_load_stackoverflow)
DE (2) DE3319327A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61192679A (ja) * 1985-01-23 1986-08-27 三菱電機株式会社 エレベ−タの制御装置
JP6924710B2 (ja) * 2018-01-09 2021-08-25 信越半導体株式会社 研磨装置および研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3453783A (en) * 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
JPS5310967A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Polishing method of semiconductor wafers
US4104099A (en) * 1977-01-27 1978-08-01 International Telephone And Telegraph Corporation Method and apparatus for lapping or polishing materials

Also Published As

Publication number Publication date
JPS5930632A (ja) 1984-02-18
DE3319327A1 (de) 1983-12-01
DE8315632U1 (de) 1988-05-11

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