JPH0234736B2 - - Google Patents

Info

Publication number
JPH0234736B2
JPH0234736B2 JP58096847A JP9684783A JPH0234736B2 JP H0234736 B2 JPH0234736 B2 JP H0234736B2 JP 58096847 A JP58096847 A JP 58096847A JP 9684783 A JP9684783 A JP 9684783A JP H0234736 B2 JPH0234736 B2 JP H0234736B2
Authority
JP
Japan
Prior art keywords
wafer
template
finished
circular
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58096847A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5930632A (ja
Inventor
Dei Roorensu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPX Technologies Inc
Original Assignee
General Signal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Signal Corp filed Critical General Signal Corp
Publication of JPS5930632A publication Critical patent/JPS5930632A/ja
Publication of JPH0234736B2 publication Critical patent/JPH0234736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
JP9684783A 1982-06-01 1983-05-31 ウエフア−保持チヤツク用の裏打ち Granted JPS5930632A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38353282A 1982-06-01 1982-06-01
US383532 1982-06-01

Publications (2)

Publication Number Publication Date
JPS5930632A JPS5930632A (ja) 1984-02-18
JPH0234736B2 true JPH0234736B2 (OSRAM) 1990-08-06

Family

ID=23513589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9684783A Granted JPS5930632A (ja) 1982-06-01 1983-05-31 ウエフア−保持チヤツク用の裏打ち

Country Status (2)

Country Link
JP (1) JPS5930632A (OSRAM)
DE (2) DE3319327A1 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61192679A (ja) * 1985-01-23 1986-08-27 三菱電機株式会社 エレベ−タの制御装置
JP6924710B2 (ja) * 2018-01-09 2021-08-25 信越半導体株式会社 研磨装置および研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3453783A (en) * 1966-06-30 1969-07-08 Texas Instruments Inc Apparatus for holding silicon slices
JPS5310967A (en) * 1976-07-19 1978-01-31 Hitachi Ltd Polishing method of semiconductor wafers
US4104099A (en) * 1977-01-27 1978-08-01 International Telephone And Telegraph Corporation Method and apparatus for lapping or polishing materials

Also Published As

Publication number Publication date
DE8315632U1 (de) 1988-05-11
JPS5930632A (ja) 1984-02-18
DE3319327A1 (de) 1983-12-01

Similar Documents

Publication Publication Date Title
US5422316A (en) Semiconductor wafer polisher and method
TW393375B (en) Apparatus and method for polishing a flat surface using a belted polishing pad
US6030280A (en) Apparatus for holding workpieces during lapping, honing, and polishing
TW520317B (en) Wafer polishing method and wafer polishing device
JPH0413568A (ja) バッキングパッド、その精密平面加工方法およびそれを用いた半導体ウェーハの研磨方法
JPH0335063B2 (OSRAM)
JPH0615564A (ja) ウエハ研磨治具及びウエハ担持方法
US6113467A (en) Polishing machine and polishing method
JPS6015147B2 (ja) 表裏両外面を有する基板ウェファの保持および平面化方法
CN113661031B (zh) 用于化学机械平坦化组合件的垫修整器和垫修整器组合件
JPH0234736B2 (OSRAM)
US6074288A (en) Modified carrier films to produce more uniformly polished substrate surfaces
US20020049029A1 (en) System and method for chemical mechanical polishing
JPS634937B2 (OSRAM)
JPS60259372A (ja) 両面ポリツシング方法
JPH0253558A (ja) 吸着治具
JP4169432B2 (ja) 被加工物の保持具、研磨装置及び研磨方法
JP2950457B2 (ja) 半導体ウェーハ研磨装置
JPH0639869Y2 (ja) 真空チャック
JP3315793B2 (ja) 基板の研磨方法
JPH04261768A (ja) 両面ラップ加工装置
JPH05177538A (ja) 板状体の研磨方法
WO2025135082A1 (ja) 研磨パッド用ドレッサ及びドレッシング装置
JPH06210563A (ja) ウェハー研磨装置
JPH06335855A (ja) 平行平面加工治具