JPH0234162B2 - - Google Patents
Info
- Publication number
- JPH0234162B2 JPH0234162B2 JP59224191A JP22419184A JPH0234162B2 JP H0234162 B2 JPH0234162 B2 JP H0234162B2 JP 59224191 A JP59224191 A JP 59224191A JP 22419184 A JP22419184 A JP 22419184A JP H0234162 B2 JPH0234162 B2 JP H0234162B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- mold
- thermocompression
- laminate
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 22
- 239000003985 ceramic capacitor Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000010304 firing Methods 0.000 description 14
- 238000002788 crimping Methods 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子部品として用いられる積層セラ
ミツクコンデンサの製造方法の改良に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in a method for manufacturing a laminated ceramic capacitor used as an electronic component.
（従来の技術）
従来、積層セラミツクコンデンサは、誘電体を
含むセラミツク生シートの上に粉末状の導電材料
を含む内部電極ペーストを印刷、乾燥した後、パ
ターンの位置合せ、打抜きして得られたシートを
複数枚積層し、熱圧着して積層体を形成し、これ
を所定の形状に切断し、脱バインダ、焼成した
後、外部電極付けという工程を経て製造されてい
る。(Prior art) Conventionally, multilayer ceramic capacitors were obtained by printing an internal electrode paste containing a powdered conductive material on a raw ceramic sheet containing a dielectric, drying it, aligning the pattern, and punching it out. It is manufactured by laminating a plurality of sheets and bonding them under heat to form a laminate, cutting this into a predetermined shape, removing the binder, firing, and then attaching external electrodes.
（本発明が解決しようとする問題点）
第３図に示す如く、従来のセラミツクコンデン
サの製造方法における熱圧着金型の上型（上パン
チ）３及び下型（下パンチ）２の圧着面４，４′
は平面であり、金型の中央部の圧縮力が弱く、周
辺部が強い傾向になる。このため、この従来の金
型により熱圧着して成形したセラミツク積層体５
は、中央部が厚く（密度が低い）、周辺部が薄い
（密度が高い）中高に成形され、かつ積層体の密
度にもバラツキが生じていた。従つて、この従来
方法により成形したセラミツク積層体から所定の
形状のチツプを切断して焼成した場合、焼成前の
セラミツク積層体の密度分布のバラツキの影響が
残り、第２図に示す如く、熱圧着した積層体の周
辺部から切出されたチツプの焼成密度は高く、中
央部から切出されたチツプの焼成密度は低くなつ
ていた。この様な、焼成時の密度の不均一は、製
品としてのコンデンサの特性のバラツキを大きく
すると共に、プレス体（熱圧着した積層体）の乾
燥で周辺が剥離する所謂デラミネーシヨンの原因
ともなり、コンデンサの信頼性を低下させる結果
となつていた。(Problems to be Solved by the Invention) As shown in FIG. 3, the crimping surfaces 4 of the upper die (upper punch) 3 and the lower die (lower punch) 2 of the thermocompression mold in the conventional manufacturing method of ceramic capacitors ,4'
is a flat surface, and the compressive force tends to be weak at the center of the mold and strong at the periphery. For this reason, the ceramic laminate 5 molded by thermocompression using this conventional mold
The laminate was formed into a medium-height shape with a thick central portion (low density) and a thin peripheral portion (high density), and the density of the laminate also varied. Therefore, when chips of a predetermined shape are cut and fired from a ceramic laminate formed by this conventional method, the influence of the variation in the density distribution of the ceramic laminate before firing remains, and as shown in FIG. Chips cut from the periphery of the crimped laminate had a high firing density, while chips cut from the center had a low firing density. Such non-uniform density during firing not only increases the variation in the characteristics of the capacitor as a product, but also causes so-called delamination, where the periphery of the pressed body (thermo-bonded laminate) peels off when it dries. This resulted in a decrease in the reliability of the capacitor.
（問題点を解決するための手段）
本発明は、上記の不具合を解決するためになさ
れたものであつて、内部電極を印刷した誘電体セ
ラミツクシートを複数枚積層し、所定の圧力と温
度により熱圧着してセラミツク積層体を成形する
ための熱圧着金型の上型（上パンチ）３及び下金
型（下パンチ）２のセラミツク圧着面４，４′を
中央部が高く、周辺部が低い凸曲面とし、密度の
均一な熱圧着したセラミツク積層体を得ることを
可能にしたものである。(Means for Solving the Problems) The present invention has been made to solve the above-mentioned problems, and consists of laminating a plurality of dielectric ceramic sheets on which internal electrodes are printed, and applying pressure and temperature under a predetermined pressure and temperature. The ceramic crimping surfaces 4, 4' of the upper mold (upper punch) 3 and lower mold (lower punch) 2 of a thermocompression mold for molding a ceramic laminate by thermocompression are set such that the center part is high and the peripheral part is high. This makes it possible to obtain a thermocompression bonded ceramic laminate with a low convex curved surface and uniform density.
（実施例） 以下、本発明の一実施例について説明する。(Example) An embodiment of the present invention will be described below.
セラミツク素材として、Pb〔（Nb1/2・Fe1/2）0.
６７（Ｗ1/3・Fe2/3）0.33〕O3を組成とする複合ペロ
ブスカイト系誘電材料を用い、これを混合、予
熱、湿式粉砕した粉末とPVB、BPBGをエチル
セルソルブに分散させてスラリーとして、ドクタ
ーブレード法により30μｍのグリーンシート（セ
ラミツク生シート）を成形した。このグリーンシ
ートを130×160の大きさに打ち抜き、そのグリー
ンシート上に35ケを有するパターンにて、Agと
Pdを重量比８：２の割合で混合した内部電極ペ
ーストをスクリーン印刷することにより電極膜を
形成する。この電極膜60枚を第１図に示す如く、
金型枠１内に固定した下金型（下パンチ）２及び
この下金型２に向つて金型枠１内に進退する上金
型（上パンチ）３よりなる熱圧着金型のセラミツ
ク圧着面４，４′を金型の中央部から周辺部に向
つて低くなる凸曲面（ｄ＝40μｍ）に形成した金
型内に積層し、110℃に加熱後、1ton／cm2の圧力
にて熱圧着を行い、セラミツク積層体５を成形し
た。このようにして得られた積層体５を公知の方
法によりパターン形状に従つて切断し、焼成を行
つた。 As a ceramic material, Pb [(Nb1/2・Fe1/2) 0.
67 (W1/3・Fe2/3) 0.33 ] Using a composite perovskite dielectric material whose composition is O 3 , it is mixed, preheated, and wet-milled, and the powder, PVB, and BPBG are dispersed in ethyl cellosolve to form a slurry. A 30 μm green sheet (ceramic raw sheet) was formed using the doctor blade method. This green sheet was punched out to a size of 130 x 160, and Ag and
An electrode film is formed by screen printing an internal electrode paste containing Pd mixed at a weight ratio of 8:2. As shown in Figure 1, these 60 electrode films are
Ceramic crimping with a thermocompression mold consisting of a lower mold (lower punch) 2 fixed in a mold frame 1 and an upper mold (upper punch) 3 that advances and retreats into the mold frame 1 toward the lower mold 2 The surfaces 4 and 4' are stacked in a mold with convex curved surfaces (d = 40 μm) that become lower from the center to the periphery of the mold, heated to 110°C, and then under a pressure of 1 ton/cm 2 . Thermocompression bonding was performed to form a ceramic laminate 5. The thus obtained laminate 5 was cut according to the pattern shape by a known method and fired.
第２図は、このようにして整形した積層体の焼
成密度およびチツプ厚みのバラツキを測定した結
果と、焼成前における積層チツプとを熱圧着した
状態のセラミツク積層体の位置に対応させて比較
したものである。第２図から明らかなように、焼
成前（熱圧着した状態）のセラミツク厚さと焼成
後の積層セラミツクの厚さとは略比例して変化し
ており、熱圧着した（焼成前）セラミツク積層体
のバラツキが小さければ焼成後の積層チツプの厚
さのバラツキも少なく、焼成密度の均一な積層チ
ツプを得ることができる。 Figure 2 compares the results of measuring the firing density and chip thickness variations of the laminate shaped in this way, and the position of the ceramic laminate after thermocompression bonding of the laminate chips before firing. It is something. As is clear from Fig. 2, the thickness of the ceramic before firing (thermocompression bonded) and the thickness of the laminated ceramic after firing change approximately in proportion to each other, and the If the variation is small, there will be little variation in the thickness of the laminated chips after firing, and it is possible to obtain laminated chips with uniform firing density.
また、デラミネーシヨン不良は、積層体密度が
高くなつたところで、有機バインダが分解した
後、脱ガスが十分になされないことに起因するこ
とが多いが、本発明方法によれば、熱圧着したセ
ラミツク積層体の全面にわたり略均一な圧縮密度
とすることが可能となり、デラミネーシヨン不良
の発生も抑制できた。なお、本発明は、積層セラ
ミツクコンデンサに限らず熱圧着された積層構造
を有する他の部品の製造にも有効であることは言
うまでもない。 In addition, delamination defects are often caused by insufficient degassing after the organic binder decomposes when the density of the laminate increases, but according to the method of the present invention, It became possible to achieve a substantially uniform compressed density over the entire surface of the ceramic laminate, and it was also possible to suppress the occurrence of delamination defects. It goes without saying that the present invention is effective for manufacturing not only multilayer ceramic capacitors but also other components having a thermocompression bonded multilayer structure.
（発明の効果）
本発明によれば、熱圧着した積層セラミツクの
圧縮密度を均一にできるから、焼成（焼結）上り
の積層セラミツクの焼成密度のバラツキを少くす
ることが可能となると共に、デラミネーシヨンの
発生も減少させることができるから信頼性の高い
積層セラミツクコンデンサを得ることができる。(Effects of the Invention) According to the present invention, it is possible to make the compressed density of the laminated ceramic bonded by thermocompression uniform, so it is possible to reduce the variation in the firing density of the laminated ceramic after firing (sintering), and to Since the occurrence of lamination can also be reduced, a highly reliable multilayer ceramic capacitor can be obtained.
第１図は本発明の熱圧着金型の概略図、第２図
は積層セラミツクのチツプ切出し位置と焼成前・
後のチツプ厚みの関係線図、第３図は従来の熱圧
着金型の概略図である。
２：熱圧着金型の下金型、３：熱圧着金型の上
金型、４，４′：圧着面。
Fig. 1 is a schematic diagram of the thermocompression mold of the present invention, and Fig. 2 shows the chip cutting position of the laminated ceramic and the position before firing.
FIG. 3, which is a relationship diagram of chip thickness, is a schematic diagram of a conventional thermocompression mold. 2: lower mold of thermocompression mold, 3: upper mold of thermocompression mold, 4, 4': crimp surface.
Claims (1)
向する複数の平行な内部電極を設けると共に、内
部電極引出し部に端子電極を設けてなるセラミツ
クコンデンサの製造方法において、内部電極を印
刷した誘電体セラミツクシートを複数枚積層し、
所定の圧力と温度により熱圧着してセラミツク積
層体を成形するための熱圧着金型の上型３及び下
型２のセラミツク圧着面４，４′を中央部が高く、
周辺部が低い凸曲面としたことを特徴とする積層
セラミツクコンデンサの製造方法。1. A method for manufacturing a ceramic capacitor in which a plurality of parallel internal electrodes facing each other in a layered manner are provided inside a dielectric ceramic, and terminal electrodes are provided in an internal electrode lead-out portion, in which a dielectric ceramic is printed with internal electrodes. Stack multiple sheets,
The ceramic pressing surfaces 4, 4' of the upper mold 3 and lower mold 2 of a thermocompression mold for molding a ceramic laminate by thermocompression bonding at a predetermined pressure and temperature are made such that their central portions are high;
A method of manufacturing a multilayer ceramic capacitor characterized by having a convex curved surface with a low peripheral portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59224191A JPS61102717A (en) | 1984-10-26 | 1984-10-26 | Manufacture of laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59224191A JPS61102717A (en) | 1984-10-26 | 1984-10-26 | Manufacture of laminated ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102717A JPS61102717A (en) | 1986-05-21 |
| JPH0234162B2 true JPH0234162B2 (en) | 1990-08-01 |
Family
ID=16809945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59224191A Granted JPS61102717A (en) | 1984-10-26 | 1984-10-26 | Manufacture of laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102717A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670940B2 (en) * | 1988-12-15 | 1994-09-07 | 株式会社村田製作所 | Method for manufacturing ceramic laminated body |
| JP2603154B2 (en) * | 1990-09-12 | 1997-04-23 | 太陽誘電株式会社 | Manufacturing method of multilayer electronic component |
-
1984
- 1984-10-26 JP JP59224191A patent/JPS61102717A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61102717A (en) | 1986-05-21 |
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