JPH0233470U - - Google Patents

Info

Publication number
JPH0233470U
JPH0233470U JP11136188U JP11136188U JPH0233470U JP H0233470 U JPH0233470 U JP H0233470U JP 11136188 U JP11136188 U JP 11136188U JP 11136188 U JP11136188 U JP 11136188U JP H0233470 U JPH0233470 U JP H0233470U
Authority
JP
Japan
Prior art keywords
wiring board
film
printed wiring
silk
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11136188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11136188U priority Critical patent/JPH0233470U/ja
Publication of JPH0233470U publication Critical patent/JPH0233470U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,b,cは本考案の一実施例の要部の
平面図で第1図aは相対位置、組合せ共に正しい
例、第1図bは組合せが相違している例、第1図
cは相対位置がずれている例、第2図〜第4図は
それぞれ本考案の一実施例を製造するための銅箔
回路印刷用フイルム、ソルダーレジスト印刷用フ
イルム、およびシルク文字印刷用フイルムの上面
図、第5図は電子部品実装導通孔をあけた銅張板
の上面図、第6図〜第8図はそれぞれ従来の印刷
配線板の一例を製造するための銅箔回路印刷用フ
イルム、ソルダーレジスト印刷用フイルムおよび
シルク文字印刷フイルムの上面図である。 1……配線板として残る部分の境界、2……銅
箔回路、3……位置決めマーク、4……製造ブラ
ンクの大きさ、5……配線板固有名称、6……ソ
ルダーレジスト逃げ、7……シルク文字、9……
電子部品実装導通孔、10a……銅箔文字として
残る配線板固有名称、10b……ソルダーレジス
ト抜き文字の配線板固有名称、10c……シルク
文字の配線板固有名称、11……銅張板、12…
…銅箔回路印刷用フイルム、13……ソルダーレ
ジスト印刷用フイルム、14……シルク文字印刷
用フイルム。
Figures 1a, b, and c are plan views of essential parts of an embodiment of the present invention. Figure 1a is an example in which both relative positions and combinations are correct; Figure 1b is an example in which the combinations are different; Figure c shows an example in which the relative positions are shifted, and Figures 2 to 4 show a copper foil circuit printing film, a solder resist printing film, and a silk letter printing film for manufacturing an embodiment of the present invention, respectively. FIG. 5 is a top view of a copper clad board with holes for mounting electronic components, and FIGS. 6 to 8 are a top view of a copper foil circuit printing film for producing an example of a conventional printed wiring board. FIG. 2 is a top view of a solder resist printing film and a silk character printing film. 1...Boundary of the portion remaining as the wiring board, 2...Copper foil circuit, 3...Positioning mark, 4...Size of manufacturing blank, 5...Unique name of the wiring board, 6...Solder resist escape, 7... ...Silk letters, 9...
Electronic component mounting conduction hole, 10a... Unique name of the wiring board remaining as copper foil letters, 10b... Unique name of the wiring board with characters cut out from solder resist, 10c... Unique name of the wiring board with silk letters, 11... Copper clad board, 12...
...Film for printing copper foil circuits, 13...Film for printing solder resist, 14...Film for printing silk characters.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 銅箔回路形成用フイルム、ソルダーレジスト用
フイルム、シルク文字フイルム等複数のフイルム
を使用して形成される印刷配線板において、前記
それぞれのフイルムの印刷配線板として残る領域
の同一位置に設けられた同形状、または相似形の
文字、記号が前記印刷配線板の所定の位置に重ね
て形成され、組合せおよび相対位置関係の確認を
可能ならしめたことを特徴とする印刷配線板。
In a printed wiring board formed using a plurality of films such as a film for forming copper foil circuits, a film for solder resist, and a silk lettering film, the same film is provided at the same position in the area remaining as the printed wiring board of each of the films. 1. A printed wiring board, characterized in that characters and symbols having shapes or similar shapes are formed overlappingly at predetermined positions on the printed wiring board, thereby making it possible to confirm combinations and relative positional relationships.
JP11136188U 1988-08-24 1988-08-24 Pending JPH0233470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11136188U JPH0233470U (en) 1988-08-24 1988-08-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11136188U JPH0233470U (en) 1988-08-24 1988-08-24

Publications (1)

Publication Number Publication Date
JPH0233470U true JPH0233470U (en) 1990-03-02

Family

ID=31349336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11136188U Pending JPH0233470U (en) 1988-08-24 1988-08-24

Country Status (1)

Country Link
JP (1) JPH0233470U (en)

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