JPH0233470U - - Google Patents
Info
- Publication number
- JPH0233470U JPH0233470U JP11136188U JP11136188U JPH0233470U JP H0233470 U JPH0233470 U JP H0233470U JP 11136188 U JP11136188 U JP 11136188U JP 11136188 U JP11136188 U JP 11136188U JP H0233470 U JPH0233470 U JP H0233470U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- film
- printed wiring
- silk
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000007639 printing Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂ，ｃは本考案の一実施例の要部の
平面図で第１図ａは相対位置、組合せ共に正しい
例、第１図ｂは組合せが相違している例、第１図
ｃは相対位置がずれている例、第２図〜第４図は
それぞれ本考案の一実施例を製造するための銅箔
回路印刷用フイルム、ソルダーレジスト印刷用フ
イルム、およびシルク文字印刷用フイルムの上面
図、第５図は電子部品実装導通孔をあけた銅張板
の上面図、第６図〜第８図はそれぞれ従来の印刷
配線板の一例を製造するための銅箔回路印刷用フ
イルム、ソルダーレジスト印刷用フイルムおよび
シルク文字印刷フイルムの上面図である。
１……配線板として残る部分の境界、２……銅
箔回路、３……位置決めマーク、４……製造ブラ
ンクの大きさ、５……配線板固有名称、６……ソ
ルダーレジスト逃げ、７……シルク文字、９……
電子部品実装導通孔、１０ａ……銅箔文字として
残る配線板固有名称、１０ｂ……ソルダーレジス
ト抜き文字の配線板固有名称、１０ｃ……シルク
文字の配線板固有名称、１１……銅張板、１２…
…銅箔回路印刷用フイルム、１３……ソルダーレ
ジスト印刷用フイルム、１４……シルク文字印刷
用フイルム。
Figures 1a, b, and c are plan views of essential parts of an embodiment of the present invention. Figure 1a is an example in which both relative positions and combinations are correct; Figure 1b is an example in which the combinations are different; Figure c shows an example in which the relative positions are shifted, and Figures 2 to 4 show a copper foil circuit printing film, a solder resist printing film, and a silk letter printing film for manufacturing an embodiment of the present invention, respectively. FIG. 5 is a top view of a copper clad board with holes for mounting electronic components, and FIGS. 6 to 8 are a top view of a copper foil circuit printing film for producing an example of a conventional printed wiring board. FIG. 2 is a top view of a solder resist printing film and a silk character printing film. 1...Boundary of the portion remaining as the wiring board, 2...Copper foil circuit, 3...Positioning mark, 4...Size of manufacturing blank, 5...Unique name of the wiring board, 6...Solder resist escape, 7... ...Silk letters, 9...
Electronic component mounting conduction hole, 10a... Unique name of the wiring board remaining as copper foil letters, 10b... Unique name of the wiring board with characters cut out from solder resist, 10c... Unique name of the wiring board with silk letters, 11... Copper clad board, 12...
...Film for printing copper foil circuits, 13...Film for printing solder resist, 14...Film for printing silk characters.
Claims (1)
フイルム、シルク文字フイルム等複数のフイルム
を使用して形成される印刷配線板において、前記
それぞれのフイルムの印刷配線板として残る領域
の同一位置に設けられた同形状、または相似形の
文字、記号が前記印刷配線板の所定の位置に重ね
て形成され、組合せおよび相対位置関係の確認を
可能ならしめたことを特徴とする印刷配線板。 In a printed wiring board formed using a plurality of films such as a film for forming copper foil circuits, a film for solder resist, and a silk lettering film, the same film is provided at the same position in the area remaining as the printed wiring board of each of the films. 1. A printed wiring board, characterized in that characters and symbols having shapes or similar shapes are formed overlappingly at predetermined positions on the printed wiring board, thereby making it possible to confirm combinations and relative positional relationships.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136188U JPH0233470U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11136188U JPH0233470U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233470U true JPH0233470U (en) | 1990-03-02 |
Family
ID=31349336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11136188U Pending JPH0233470U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233470U (en) |
-
1988
- 1988-08-24 JP JP11136188U patent/JPH0233470U/ja active Pending