JPH0231830Y2 - - Google Patents
Info
- Publication number
- JPH0231830Y2 JPH0231830Y2 JP1984146962U JP14696284U JPH0231830Y2 JP H0231830 Y2 JPH0231830 Y2 JP H0231830Y2 JP 1984146962 U JP1984146962 U JP 1984146962U JP 14696284 U JP14696284 U JP 14696284U JP H0231830 Y2 JPH0231830 Y2 JP H0231830Y2
- Authority
- JP
- Japan
- Prior art keywords
- shield
- notch
- shield member
- solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000005192 partition Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984146962U JPH0231830Y2 (cs) | 1984-09-27 | 1984-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984146962U JPH0231830Y2 (cs) | 1984-09-27 | 1984-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6161897U JPS6161897U (cs) | 1986-04-25 |
| JPH0231830Y2 true JPH0231830Y2 (cs) | 1990-08-28 |
Family
ID=30705200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984146962U Expired JPH0231830Y2 (cs) | 1984-09-27 | 1984-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231830Y2 (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007094068A1 (ja) * | 2006-02-16 | 2007-08-23 | Matsushita Electric Industrial Co., Ltd. | 回路基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS611977Y2 (cs) * | 1978-05-11 | 1986-01-22 |
-
1984
- 1984-09-27 JP JP1984146962U patent/JPH0231830Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6161897U (cs) | 1986-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0142380Y2 (cs) | ||
| JPH02948Y2 (cs) | ||
| JPS62162891U (cs) | ||
| JPH0720954Y2 (ja) | モジュラー型ハウジングアッセンブリー | |
| JPH0231830Y2 (cs) | ||
| JP2881430B2 (ja) | シールドコネクタ組立体 | |
| JPH01123389U (cs) | ||
| JPS633037Y2 (cs) | ||
| JPH0218627Y2 (cs) | ||
| JPH0349429Y2 (cs) | ||
| JPS5816195Y2 (ja) | プリント板取付構体 | |
| JPH0617263Y2 (ja) | 複合回路装置 | |
| JPH0642390Y2 (ja) | 電子部品のシールドフレーム構造 | |
| JPS643240Y2 (cs) | ||
| JPH0723987Y2 (ja) | 高周波回路装置 | |
| JPH0451519Y2 (cs) | ||
| JPH023669Y2 (cs) | ||
| JPH0143910Y2 (cs) | ||
| JPH0717169Y2 (ja) | セラミック電子部品 | |
| JPH0710555Y2 (ja) | シールドフレーム構造 | |
| JPH0339982Y2 (cs) | ||
| JPH0513038Y2 (cs) | ||
| JPS6144471Y2 (cs) | ||
| JPH08125374A (ja) | 内部に仕切板をもつ筐体 | |
| JPH037996Y2 (cs) |