JPH0231803Y2 - - Google Patents
Info
- Publication number
- JPH0231803Y2 JPH0231803Y2 JP14912184U JP14912184U JPH0231803Y2 JP H0231803 Y2 JPH0231803 Y2 JP H0231803Y2 JP 14912184 U JP14912184 U JP 14912184U JP 14912184 U JP14912184 U JP 14912184U JP H0231803 Y2 JPH0231803 Y2 JP H0231803Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- cap
- base
- notch
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000000078 claw Anatomy 0.000 claims description 19
- 239000000758 substrate Substances 0.000 description 33
- 239000000919 ceramic Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- -1 cap Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14912184U JPH0231803Y2 (US07943777-20110517-C00090.png) | 1984-10-02 | 1984-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14912184U JPH0231803Y2 (US07943777-20110517-C00090.png) | 1984-10-02 | 1984-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6163879U JPS6163879U (US07943777-20110517-C00090.png) | 1986-04-30 |
| JPH0231803Y2 true JPH0231803Y2 (US07943777-20110517-C00090.png) | 1990-08-28 |
Family
ID=30707309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14912184U Expired JPH0231803Y2 (US07943777-20110517-C00090.png) | 1984-10-02 | 1984-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231803Y2 (US07943777-20110517-C00090.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0635500Y2 (ja) * | 1986-05-29 | 1994-09-14 | 株式会社村田製作所 | 電子部品 |
| JPH0760940B2 (ja) * | 1988-07-13 | 1995-06-28 | 松下電器産業株式会社 | 電子機器用プリント基板のケーシング装置 |
-
1984
- 1984-10-02 JP JP14912184U patent/JPH0231803Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6163879U (US07943777-20110517-C00090.png) | 1986-04-30 |
