JPH0231799Y2 - - Google Patents

Info

Publication number

JPH0231799Y2

JPH0231799Y2 JP1985019181U JP1918185U JPH0231799Y2 JP H0231799 Y2 JPH0231799 Y2 JP H0231799Y2 JP 1985019181 U JP1985019181 U JP 1985019181U JP 1918185 U JP1918185 U JP 1918185U JP H0231799 Y2 JPH0231799 Y2 JP H0231799Y2

Authority

JP

Japan

Prior art keywords

circuit

insulating film

crossover

hole

wiring board

Prior art date

1985-02-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000004020 conductor Substances 0.000 claims description 16
• 239000011148 porous material Substances 0.000 claims description 9
• 238000010030 laminating Methods 0.000 claims description 4
• 239000010410 layer Substances 0.000 description 69
• 238000007650 screen-printing Methods 0.000 description 11
• 239000003973 paint Substances 0.000 description 10
• 238000000034 method Methods 0.000 description 9
• 229920005989 resin Polymers 0.000 description 8
• 239000011347 resin Substances 0.000 description 8
• 230000007547 defect Effects 0.000 description 6
• 238000007639 printing Methods 0.000 description 6
• 239000000463 material Substances 0.000 description 5
• 238000001723 curing Methods 0.000 description 4
• 238000009413 insulation Methods 0.000 description 4
• 229920003002 synthetic resin Polymers 0.000 description 4
• 239000000057 synthetic resin Substances 0.000 description 4
• 230000015572 biosynthetic process Effects 0.000 description 3
• 230000000694 effects Effects 0.000 description 3
• 239000003822 epoxy resin Substances 0.000 description 3
• 239000005011 phenolic resin Substances 0.000 description 3
• 229920000647 polyepoxide Polymers 0.000 description 3
• 239000000758 substrate Substances 0.000 description 3
• IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 2
• 230000015556 catabolic process Effects 0.000 description 2
• 239000007788 liquid Substances 0.000 description 2
• 239000011344 liquid material Substances 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 229920001568 phenolic resin Polymers 0.000 description 2
• 229920001225 polyester resin Polymers 0.000 description 2
• 239000004645 polyester resin Substances 0.000 description 2
• 239000002356 single layer Substances 0.000 description 2
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
• KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
• 229920000178 Acrylic resin Polymers 0.000 description 1
• 239000004925 Acrylic resin Substances 0.000 description 1
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000004640 Melamine resin Substances 0.000 description 1
• 229920000877 Melamine resin Polymers 0.000 description 1
• 239000005062 Polybutadiene Substances 0.000 description 1
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
• 230000005856 abnormality Effects 0.000 description 1
• 239000011230 binding agent Substances 0.000 description 1
• 229910052799 carbon Inorganic materials 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 230000000052 comparative effect Effects 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 239000000839 emulsion Substances 0.000 description 1
• 238000007720 emulsion polymerization reaction Methods 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000005530 etching Methods 0.000 description 1
• 230000008020 evaporation Effects 0.000 description 1
• 238000001704 evaporation Methods 0.000 description 1
• 238000013007 heat curing Methods 0.000 description 1
• 239000000178 monomer Substances 0.000 description 1
• 239000004570 mortar (masonry) Substances 0.000 description 1
• 239000003960 organic solvent Substances 0.000 description 1
• 239000003504 photosensitizing agent Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229920002857 polybutadiene Polymers 0.000 description 1
• 229920006267 polyester film Polymers 0.000 description 1
• 229920001721 polyimide Polymers 0.000 description 1
• 239000009719 polyimide resin Substances 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 229920002050 silicone resin Polymers 0.000 description 1
• 229910052709 silver Inorganic materials 0.000 description 1
• 239000004332 silver Substances 0.000 description 1
• 239000002904 solvent Substances 0.000 description 1